19 results about "Equivalent series inductance" patented technology

A multilayer electronic component includes a laminated portion, wherein a first internal electrode and a second internal electrode are alternately arranged in the lamination direction. A first set of external electrodes is disposed on at least one of a pair of opposing main surfaces of the laminated portion. These external electrodes are arranged adjacent to an edge and electrically connected to the first internal electrode, wherein side surfaces of the laminated portion are abutted at the edge. A second set of external electrodes is also disposed on at least one main surface, located in the lateral direction between the first set of external electrodes, and electrically connected to the second internal electrode. Via electrodes penetrate the laminated portion in the lamination direction, thereby electrically connecting the second internal electrode to the second set of external electrodes. This structure enables multiple current paths and reduces the current loop length, thereby reducing the equivalent series inductance and improving the high-frequency characteristics of the component.

The utility model discloses a novel sheet type multilayer ceramic capacitor relates to capacitor technical field, including two end electrodes, the inside electrode subassembly is arranged between one side of two end electrodes, the inside electrode subassembly includes a plurality of first base plate, second base plate and ceramic dielectric layer, a plurality of ceramic dielectric layer is arranged between one side of two end electrodes, and a plurality of ceramic dielectric layer is all provided with first base plate or second base plate between two two, first base plate and second base plate are staggered distribution, the top one side of first base plate and second base plate all embeds and is installed with the conducting strip. The utility model discloses through carrying out three -dimensional interdigital electrode design, shortens the current path, reduces equivalent series inductance to 0.05nH below, adapts 5G / 6G high frequency communication scene, reduces signal reflection and energy loss, in addition still improved the heat dissipation capacity under high frequency, and reduced the fracture risk.

To enable efficient dissipation of heat generated in a capacitor element and reduction of equivalent series inductance (ESL) with a simple configuration.SOLUTION: A proximity portion 25 is provided on a first bus bar 2, and the proximity portion 25 is disposed closer to an inner surface (lower surface) of a case 5 than a main body portion 20 and an electrode connection portion 24. In addition, the electrode connection portion 24 of the first bus bar 2 is disposed at a position closer to an external connection terminal portion 22. Accordingly, heat generated by a capacitor element 10 can be dissipated via the proximity portion 25 disposed close to the inner surface of the case, and an increase in equivalent series inductance (ESL) can be suppressed.SELECTED DRAWING: Figure 7

The application discloses a motor controller, a power drive system and a vehicle, and relates to the technical field of electronics. The motor controller comprises a power device module, a capacitor module and an electrical connection assembly. The electrical connection assembly is a flexible structural member. The electrical connection assembly comprises a first conductive member and a second conductive member. The first conductive member and the second conductive member are coupled to each other. The first conductive member is electrically connected to the power device module and the capacitor module respectively. The second conductive member is electrically connected to the power device module and the capacitor module respectively. The embodiment of the application can solve the problem of a large equivalent series inductance.

The invention belongs to the technical field of filter capacitor detection, and provides a fault detection method and system for a filter capacitor, and the method comprises the steps: determining a current abnormal frequency band corresponding to a high and low frequency filtering combination of different low frequency equivalent series inductors; determining a frequency-ripple current coupling relation of high and low frequency filtering combinations of different low-frequency equivalent series inductors in a current abnormal frequency band; judging whether a ripple current fault occurs or not, if so, judging whether filter capacitor fault depth tracking is needed or not through low-frequency equivalent series inductance change of a current high-low frequency filter combination and comparison of a current frequency band and a current abnormal frequency band, and if so, judging whether the filter capacitor fault depth tracking is needed through the frequency band and the ripple current in a ripple current fault time period. And matching verification of a frequency-ripple current coupling relationship is carried out to determine whether the ripple current fault of the high-frequency filter capacitor is caused by one-way fault transfer between the high-frequency filter combination and the low-frequency filter combination, so that the fault diagnosis accuracy of the filter capacitor is improved.

The utility model relates to the technical field of capacitors, in particular to a metallized polypropylene film capacitor, which comprises a main body, a low-inductance electrode assembly, a heat dissipation assembly and a packaging shell, the main body comprises metallized polypropylene films and metal electrode layers, and the main body is formed by alternately stacking multiple layers of metallized polypropylene films and metal electrode layers. An electrode material of the low-inductance electrode assembly adopts a copper-silver alloy, the low-inductance electrode assembly is welded on the main body, the low-inductance electrode assembly adopts a planar electrode, the heat dissipation assembly is arranged between the main body and the packaging shell, the heat dissipation assembly comprises a heat dissipation sheet and heat conduction silica gel, the heat dissipation sheet adopts a high-heat-conductivity aluminum alloy material, and the heat conduction silica gel is arranged in the heat dissipation sheet. And the heat-conducting silica gel is filled among the radiating fins, the main body and the packaging shell. According to the utility model, through the optimization design of the laminated structure of the main body and the low-inductance electrode structure, the equivalent series inductance is greatly reduced, and the performance of the capacitor in a high-frequency environment is remarkably improved.

The invention provides a three-dimensional core particle packaging structure and a manufacturing method, and relates to the technical field of integrated circuit manufacturing. Comprising a first substrate; the reinforcing rib structure is arranged on the first substrate and is electrically connected with the first substrate; a capacitor assembly is arranged in the reinforcing rib structure; the core particle stacking structure is arranged between the first substrate and the reinforcing rib structure, and the core particle stacking structure is electrically connected with the reinforcing rib structure and the first substrate; the core particle stack structure includes at least one core particle. According to the invention, the overall physical stability and mechanical structural strength of the package can be improved, the package size is reduced, the equivalent series inductance is remarkably reduced, the high-frequency power supply noise is effectively suppressed, the defect of capacitor design in the core particles is overcome, the effective wiring space of the substrate is greatly saved, the wiring difficulty of the substrate is reduced, and the production cost is reduced. And meanwhile, the problem that the packaging size is increased due to external arrangement of the capacitor is avoided.

The invention discloses a reactive compensation-oriented capacitor life monitoring method, system and device, and relates to the technical field of capacitor testing. The method comprises the steps of periodically collecting an original data set; performing multi-frequency point selection in the power grid to obtain a plurality of multi-frequency points, and calculating to obtain complex impedance and admittance corresponding to each multi-frequency point; based on the complex impedance corresponding to each multi-frequency point, calculating to obtain estimated values of equivalent series resistance, equivalent series inductance and capacitance, and performing consistency verification by using admittance; based on the estimated values of the operation time, the equivalent series resistance, the equivalent series inductance and the capacitor capacity, the degradation degree of the capacitor is judged; calculating a comprehensive life consumption rate based on the original data set; based on the degradation degree of the capacitor, correcting the comprehensive life consumption rate to obtain the corrected comprehensive life consumption rate, and obtaining the health state of the capacitor; according to the invention, the capacitance degradation degree can be judged, so that the service life consumption rate is more suitable for the actual aging process after being corrected.

The utility model discloses a kind of trench capacitor unit and capacitor chip.The trench capacitor unit includes trench array group extending alternately along transverse direction, vertical direction, insulating layer, four layers of polar plate, and three layers of dielectric layer between polar plate, first, second, third, fourth polar plate contact via, and first, second metal layer and first via layer between it leading out capacitor first, second port.The capacitor chip is composed of the trench capacitor unit array, and the direction of the trench capacitor unit array is adjusted based on the windowing position of the capacitor chip.The utility model utilizes multilayer stack structure, and optimized polar plate, contact via and metal interconnection structure arrangement, can form capacitor chip with high density and low equivalent series inductance, and the capacitor chip can be applied to different package size types.

To provide a miniaturized stacked electronic component having low ESL (Equivalent Series Inductance) and low ESR (Equivalent Series Resistance). [Solution] The stacked electronic component includes a body 110 including a dielectric layer 111 and internal electrodes 121, 122, and electrodes 131, 133 that penetrate the body and are arranged on the body and connected to the internal electrodes. The electrodes include first electrode layers 131a, 133a arranged on the body and mainly composed of a first conductive metal, second electrode layers 131b, 133b arranged to penetrate the body and be in contact with the electrodes and mainly composed of a second conductive metal, and third electrode layers 131c, 133c that are in contact with the second electrode layers, penetrate the body and are arranged across the first electrode layers and mainly composed of a third conductive metal. The second and third conductive metals may be different metals from each other.

The invention discloses a preparation method of a deep trench capacitor structure based on RDL wiring, and the method comprises the following steps: S1, providing a deep trench capacitor structure which comprises at least two conductive layers with different potentials, and the upper surfaces of the conductive layers are covered by a first interlayer dielectric layer; s2, patterning the first interlayer dielectric layer to form via holes exposing different conductive layers; s3, a first redistribution layer is prepared on the first interlayer dielectric layer, the first redistribution layer comprises two electrode layers which are electrically isolated from each other, the two electrode layers are connected to conductive layers with different potentials respectively, patterns of the at least two electrode layers are alternately arranged on a plane in an interdigital shape or a spiral shape, and the patterns of the at least two electrode layers are arranged on the surface of the first interlayer dielectric layer; therefore, a planar capacitor structure connected in parallel with the deep groove capacitor is formed. According to the invention, the interdigital capacitor is connected in parallel on the basis of the MIM capacitor to form a composite capacitor structure, the advantage of high capacitance density of the DTC is maintained, the equivalent series inductance is reduced, and the working bandwidth of the capacitor is expanded.

The present application relates to the technical field of capacitors, and provides a capacitor and an electronic device. The capacitor comprises a carrier plate and a capacitor body. A first side of the carrier plate in the thickness direction thereof is provided with a positive electrode lead-out end, a negative electrode lead-out end, and an auxiliary lead-out end. The capacitor body is arranged on a second side of the carrier plate in the thickness direction thereof. The first side and the second side are opposite to each other in the thickness direction of the carrier plate. The capacitor body comprises a positive electrode and a negative electrode. The positive electrode lead-out end is connected to the positive electrode. The negative electrode lead-out end and the auxiliary lead-out end are both connected to the negative electrode. In the direction of extension of the carrier plate, the distance between the auxiliary lead-out end and the positive electrode lead-out end is smaller than the distance between the negative electrode lead-out end and the positive electrode lead-out end. The capacitor provided by the present application reduces the thickness and size of the capacitor, shortens the current flow path, reduces electrical lead-out resistance and equivalent series inductance, increases the capacitance of the capacitor, and improves the use performance of the electronic device.

The invention relates to a coupler for partial discharge monitoring and a packaging method thereof, the coupler comprises a coupler body, the coupler body comprises a plurality of coupler modules which are stacked up and down and are connected in series, and each coupler module comprises a plurality of cores which are stacked up and down and are connected in parallel; each core comprises an intermediate medium and electrode layers arranged on the two sides of the intermediate medium, and the intermediate medium comprises medium layers and metal layers which are stacked up and down and are alternately arranged. The coupler for partial discharge monitoring is low in equivalent series inductance, high in resonant frequency and resistant to high voltage.

This invention provides multilayer ceramic electronic components with low equivalent series inductance (ESL) and improved mountability on circuit boards. [Solution] In the multilayer ceramic capacitor 100, the base body 10 has a laminate 20 in which ceramic layers 21 and internal electrodes 22a and 22b mainly composed of metal are alternately stacked. The base body has a plurality of via conductors 23a and 23b arranged to penetrate the ceramic layers in the stacking direction, with one end extended to the surface of the laminate and electrically connected to the internal electrodes. Terminal electrodes 40a and 40b electrically connected to the via conductors are arranged on the surface from which the ends of the via conductors are extended. The surface from which the ends of the via conductors are extended and the terminal electrodes are arranged is surrounded by a peripheral edge 111 and has a raised structure composed of a raised portion 112 that rises relative to the peripheral edge, and a portion of each terminal electrode is located on the slope of the raised portion.

The application discloses a suspended strip line triplexer and limiter integrated device, and relates to the microwave and radio frequency technical field.The device comprises a suspended strip line triplexer composed of a metal cavity and a suspended dielectric substrate, is provided with one input port and three output ports corresponding to different frequency bands, and is provided with a step impedance resonator group between each port, is connected through parallel plate capacitance, and is further connected through a high impedance thin line equivalent series inductance.The step impedance resonator is used for generating a transmission zero point outside the frequency band.The device is provided with PIN diode limiters at the three output ports, the metal cavity is composed of upper and lower metal cover plates, metal patches on the suspended strip line are connected with the upper and lower metal cover plates through vias, radio frequency grounding is realized, and a limiter PIN diode grounding position is reserved.The application has the advantages of compact structure, multi-frequency band signal separation, interference suppression, interference signal amplitude limitation, improved system reliability and stability, and function expansion.

The invention provides a capacitor on-line health monitoring system and method based on double-path differential sensing and working condition self-adaption, and the system employs a double-path differential current sensing architecture, synchronously measures the current of a total bus and the total current of other parallel branches except a to-be-measured capacitor, and carries out the real-time differential operation. Net ripple current flowing through a specific capacitor bank to be measured is accurately reconstructed, and weak signal extraction with a high signal-to-noise ratio is realized under strong common-mode interference. According to the system, a working condition self-adaptive identification module is introduced to analyze macroscopic electrical parameters in real time and classify operation states, and it is ensured that a high-precision parameter identification algorithm is only triggered under a stable steady-state working condition. In the parameter identification stage, the system uses switch harmonic waves of a converter as a natural excitation source, the equivalent series resistance, capacitance and equivalent series inductance of a capacitor are synchronously solved through multi-frequency-point impedance spectroscopy measurement and nonlinear and least square fitting, and finally online health state evaluation and predictive maintenance are achieved.

The application provides a capacitor and an electronic device, and relates to the technical field of capacitors. The capacitor comprises a carrier plate and a capacitor body. A first side of the carrier plate in the thickness direction is provided with a positive electrode lead-out end, a negative electrode lead-out end and an auxiliary lead-out end. The capacitor body is arranged on a second side of the carrier plate in the thickness direction. The first side and the second side are opposite along the thickness direction of the carrier plate. The capacitor body comprises a positive electrode and a negative electrode. The positive electrode lead-out end is connected with the positive electrode. The negative electrode lead-out end and the auxiliary lead-out end are both connected with the negative electrode. Along the extension direction of the carrier plate, the distance between the auxiliary lead-out end and the positive electrode lead-out end is smaller than the distance between the negative electrode lead-out end and the positive electrode lead-out end. The capacitor provided by the application reduces the thickness of the capacitor, reduces the size of the capacitor, reduces the current flow path, reduces the electrical lead-out resistance and the equivalent series inductance, improves the capacity of the capacitor and improves the use performance of the electronic device.

The invention discloses a nine-terminal capacitor, and relates to the technical field of capacitors. The invention discloses a silicon-based solar cell which comprises a silicon substrate Si-Sub, a first interconnection layer metal1, a second interconnection layer metal2 and electrode terminals which are fixedly connected in sequence, a trench Trench in the silicon substrate Si-Sub comprises a first capacitor C1 and a second capacitor C2, the electrode terminals comprise first to fourth upper electrode terminals and first to fifth lower electrode terminals, the two upper electrode terminals are distributed at intervals through the lower electrode terminals, and the first capacitor C1 and the second capacitor C2 are connected with the first interconnection layer metal1 and the second interconnection layer metal2. An upper electrode of each capacitor is electrically connected with a pair of upper electrode terminals through a first interconnection layer and a second interconnection layer, and a lower electrode of each capacitor is electrically connected with all lower electrode terminals through the first interconnection layer and the second interconnection layer; through the two capacitors, the two interconnection layers, the four upper electrode terminals and the five lower electrode terminals, the equivalent series resistance and the equivalent series inductance of the capacitors are reduced while the density of the capacitors is improved.

A multilayer electronic component includes a laminate in which first and second internal electrodes are alternately disposed in a lamination direction. A first group of external electrodes is disposed on at least one of a pair of opposing main surfaces of the laminate. These external electrodes are positioned adjacent to edges where side surfaces of the laminate meet and are electrically connected to the first internal electrodes. A second group of external electrodes is also disposed on at least one of the main surfaces, positioned between the first group in a lateral direction, and electrically connected to the second internal electrodes. Via-electrodes penetrate the laminate in the lamination direction to electrically connect the second internal electrodes to the second group of external electrodes. This structure enables multiple current paths and reduces current loop lengths, thereby lowering the equivalent series inductance and improving the high-frequency characteristics of the component.