7 results about "Equivalent series inductance" patented technology

A multilayer electronic component includes a laminated portion, wherein a first internal electrode and a second internal electrode are alternately arranged in the lamination direction. A first set of external electrodes is disposed on at least one of a pair of opposing main surfaces of the laminated portion. These external electrodes are arranged adjacent to an edge and electrically connected to the first internal electrode, wherein side surfaces of the laminated portion are abutted at the edge. A second set of external electrodes is also disposed on at least one main surface, located in the lateral direction between the first set of external electrodes, and electrically connected to the second internal electrode. Via electrodes penetrate the laminated portion in the lamination direction, thereby electrically connecting the second internal electrode to the second set of external electrodes. This structure enables multiple current paths and reduces the current loop length, thereby reducing the equivalent series inductance and improving the high-frequency characteristics of the component.

The utility model discloses a novel sheet type multilayer ceramic capacitor relates to capacitor technical field, including two end electrodes, the inside electrode subassembly is arranged between one side of two end electrodes, the inside electrode subassembly includes a plurality of first base plate, second base plate and ceramic dielectric layer, a plurality of ceramic dielectric layer is arranged between one side of two end electrodes, and a plurality of ceramic dielectric layer is all provided with first base plate or second base plate between two two, first base plate and second base plate are staggered distribution, the top one side of first base plate and second base plate all embeds and is installed with the conducting strip. The utility model discloses through carrying out three -dimensional interdigital electrode design, shortens the current path, reduces equivalent series inductance to 0.05nH below, adapts 5G / 6G high frequency communication scene, reduces signal reflection and energy loss, in addition still improved the heat dissipation capacity under high frequency, and reduced the fracture risk.

The utility model discloses a kind of trench capacitor unit and capacitor chip.The trench capacitor unit includes trench array group extending alternately along transverse direction, vertical direction, insulating layer, four layers of polar plate, and three layers of dielectric layer between polar plate, first, second, third, fourth polar plate contact via, and first, second metal layer and first via layer between it leading out capacitor first, second port.The capacitor chip is composed of the trench capacitor unit array, and the direction of the trench capacitor unit array is adjusted based on the windowing position of the capacitor chip.The utility model utilizes multilayer stack structure, and optimized polar plate, contact via and metal interconnection structure arrangement, can form capacitor chip with high density and low equivalent series inductance, and the capacitor chip can be applied to different package size types.

To provide a miniaturized stacked electronic component having low ESL (Equivalent Series Inductance) and low ESR (Equivalent Series Resistance). [Solution] The stacked electronic component includes a body 110 including a dielectric layer 111 and internal electrodes 121, 122, and electrodes 131, 133 that penetrate the body and are arranged on the body and connected to the internal electrodes. The electrodes include first electrode layers 131a, 133a arranged on the body and mainly composed of a first conductive metal, second electrode layers 131b, 133b arranged to penetrate the body and be in contact with the electrodes and mainly composed of a second conductive metal, and third electrode layers 131c, 133c that are in contact with the second electrode layers, penetrate the body and are arranged across the first electrode layers and mainly composed of a third conductive metal. The second and third conductive metals may be different metals from each other.

The application discloses a suspended strip line triplexer and limiter integrated device, and relates to the microwave and radio frequency technical field.The device comprises a suspended strip line triplexer composed of a metal cavity and a suspended dielectric substrate, is provided with one input port and three output ports corresponding to different frequency bands, and is provided with a step impedance resonator group between each port, is connected through parallel plate capacitance, and is further connected through a high impedance thin line equivalent series inductance.The step impedance resonator is used for generating a transmission zero point outside the frequency band.The device is provided with PIN diode limiters at the three output ports, the metal cavity is composed of upper and lower metal cover plates, metal patches on the suspended strip line are connected with the upper and lower metal cover plates through vias, radio frequency grounding is realized, and a limiter PIN diode grounding position is reserved.The application has the advantages of compact structure, multi-frequency band signal separation, interference suppression, interference signal amplitude limitation, improved system reliability and stability, and function expansion.

The application provides a capacitor and an electronic device, and relates to the technical field of capacitors. The capacitor comprises a carrier plate and a capacitor body. A first side of the carrier plate in the thickness direction is provided with a positive electrode lead-out end, a negative electrode lead-out end and an auxiliary lead-out end. The capacitor body is arranged on a second side of the carrier plate in the thickness direction. The first side and the second side are opposite along the thickness direction of the carrier plate. The capacitor body comprises a positive electrode and a negative electrode. The positive electrode lead-out end is connected with the positive electrode. The negative electrode lead-out end and the auxiliary lead-out end are both connected with the negative electrode. Along the extension direction of the carrier plate, the distance between the auxiliary lead-out end and the positive electrode lead-out end is smaller than the distance between the negative electrode lead-out end and the positive electrode lead-out end. The capacitor provided by the application reduces the thickness of the capacitor, reduces the size of the capacitor, reduces the current flow path, reduces the electrical lead-out resistance and the equivalent series inductance, improves the capacity of the capacitor and improves the use performance of the electronic device.

A multilayer electronic component includes a laminate in which first and second internal electrodes are alternately disposed in a lamination direction. A first group of external electrodes is disposed on at least one of a pair of opposing main surfaces of the laminate. These external electrodes are positioned adjacent to edges where side surfaces of the laminate meet and are electrically connected to the first internal electrodes. A second group of external electrodes is also disposed on at least one of the main surfaces, positioned between the first group in a lateral direction, and electrically connected to the second internal electrodes. Via-electrodes penetrate the laminate in the lamination direction to electrically connect the second internal electrodes to the second group of external electrodes. This structure enables multiple current paths and reduces current loop lengths, thereby lowering the equivalent series inductance and improving the high-frequency characteristics of the component.