High-density capacitor and electrode leading-out method thereof

A technology of electrode extraction and capacitors, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of large equivalent series inductance, low working voltage, incompatibility, etc., and achieve small equivalent series inductance, large capacitance, Easily Integrate Effects

Active Publication Date: 2012-07-11
WUXI ZHONGWEI JINGYUAN ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Liquid electrolytic capacitors have the advantages of low price and large capacity, but because they contain liquid electrolyte, they often have disadvantages such as large volume, large equivalent series resistance, poor high frequency performance, poor high temperature resistance, short service life, and pollution to the environment. ;Electric double layer capacitors also use liquid electrolyte, but there are also disadvantages such as large volume, limited operating temperature, large equivalent series resistance, and environmental pollution.
Although solid polymer capacitors have greatly improved the high-frequency performance, high temperature

Method used

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  • High-density capacitor and electrode leading-out method thereof
  • High-density capacitor and electrode leading-out method thereof
  • High-density capacitor and electrode leading-out method thereof

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Embodiment 1

[0059] Such as Figure 1~Figure 5 Shown: this embodiment takes four local electrode layers 2 and three high-dielectric constant dielectric layers 3 as an example. That is, the local electrode layer 2 includes two odd-numbered local electrode layers 11 and two even-numbered local electrode layers 10, with odd local The electrode layer 11 is at the odd-numbered layer position above the substrate 1, and the even-numbered local electrode layer 10 is at the even-numbered layer position above the substrate 1, and is interleaved with the odd-numbered local electrode layer 11. The odd-numbered local electrode layer 11 and the even-numbered local electrode layer 10 The number of layers is the same; the odd-numbered interconnection electrodes 7 and even-numbered interconnection electrodes 8 corresponding to the interconnection electrode layer are alternately distributed around the substrate 1, and the odd-numbered interconnection electrodes 7 and the even-numbered interconnection electrodes...

Embodiment 2

[0075] Such as Figure 6~Figure 10 It is shown that the material types and sizes of the substrate 1, the microgrooves 4, the local electrode layer 2, the high dielectric constant dielectric layer 3, and the insulating dielectric layer 5 are consistent with those of the first embodiment. The first insulating protective layer 6 is SiO with a thickness of 2 μm 2 ; The difference is that the middle of the upper part of the substrate 1 is provided with a contact hole for the local electrode layer 2, and the lower part of the contact hole position has no microgrooves 4 structure, that is, the first odd-numbered contact hole 13 and the first even-numbered contact hole 12 are simultaneously located in the substrate 1 The upper periphery and the central area; finally, a second insulating protective layer 9 with a thickness of 2 μm is deposited on the top surface of the substrate 1 by PECVD, and the second insulating protective layer 9 is SiO 2 Or Si 3 N 4 , The electrode contact hole can ...

Embodiment 3

[0095] Such as Figure 11~Figure 16 Shown: in this embodiment, even-numbered interconnection electrodes 8 and odd-numbered interconnection electrodes 7 corresponding to the interconnection electrode layer are located in two layers, and even-numbered interconnection electrodes 8 and odd-numbered interconnection electrodes 7 are located at the same time on the upper side of the substrate 1 and correspondingly In the central area, the rest of this embodiment is consistent with the second embodiment.

[0096] Such as Figure 11 to Figure 16 As shown, the high-density capacitor with the above structure and its electrode lead form can be realized through the following process steps:

[0097] a. Provide substrate 1, and form microgrooves 4 on substrate 1, such as Picture 11 As shown; the microgrooves 4 can be processed by photolithography etching, photoelectrochemical etching, electrochemical etching, photolithography plating, self-assembly, selective liquid phase chemical deposition, etc...

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Abstract

The invention relates to a high-density capacitor and an electrode leading-out method thereof, wherein the capacitor comprises a substrate, on which a plurality of local electrode layers grow, the local electrode layers include even local electrode layers and odd local electrode layers matched with the even local electrode layers, and high dielectric constant dielectric layers are arranged between the odd local electrode layers and the even local electrode layers, interconnection electrode layers comprising even interconnection electrodes and odd interconnection electrodes are arranged above the substrate, and the odd interconnection electrodes are isolated from the even interconnection electrodes in an insulating manner. The capacitor provided by the invention has the advantages of high electric capacity, small equivalent series inductance and adjustable equivalent series inductance; and the equivalent series inductance can be regulated according to the demands of the circuit so as to reach the best matching. With the advantages of high precision, high reliability, small volume, long service life and environmental protection, the product is widely used for decoupling a high frequency circuit and removing noise; and the product can be used in a common tank circuit. The capacitor can be integrated in an IC (integrated circuit) chip or packaged in a same package together with the IC easily.

Description

Technical field [0001] The invention relates to a capacitor and an electrode extraction method thereof, in particular to a high-density capacitor and an electrode extraction method thereof, belonging to the technical field of high-density capacitors. Background technique [0002] At present, the commonly used capacitors on the market are aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, and electric double layer capacitors. Liquid electrolytic capacitors have the advantages of low price and large capacity, but because they contain liquid electrolyte, they often have disadvantages such as large volume, large equivalent series resistance, poor high-frequency performance, poor high temperature resistance, short service life, and pollution to the environment. ; Electric double-layer capacitors also use liquid electrolyte, but also have disadvantages such as large volume, limited operating temperature, large equivalent series resistance...

Claims

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Application Information

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IPC IPC(8): H01L23/522H01L21/768H01L21/60
Inventor 雷鸣陈杰陈立军
Owner WUXI ZHONGWEI JINGYUAN ELECTRONIC CO LTD
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