Abrasive fiber polishing disk, polishing machine with same and polishing method using same

A polishing disc and polishing machine technology, which is applied in the field of silicon wafer manufacturing, can solve the problems of separation of abrasive fiber metal discs, limitation of polishing precision, waste of resources, etc., and achieves the effect of simplifying the process, improving the polishing precision, and improving the polishing mirror effect.

Active Publication Date: 2010-10-20
北京东能良晶科技有限公司
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Problems solved by technology

[0005] The purpose of the present invention is to at least solve one of the above-mentioned technical defects, especially solve the problem that the polishing accuracy is limited due to the continuous setting of abrasive fibers in the circumferential direction of the polishing disc, and solve the difficulty in replacing the polishing disc after a period of use. High cost and waste of resources caused by separating the abrasive fibers from the bottom metal disc of the polishing disc

Method used

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  • Abrasive fiber polishing disk, polishing machine with same and polishing method using same
  • Abrasive fiber polishing disk, polishing machine with same and polishing method using same
  • Abrasive fiber polishing disk, polishing machine with same and polishing method using same

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[0036] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0037] The present invention mainly proposes an abrasive fiber polishing disc, by fixing the abrasive fiber bundles formed by a plurality of abrasive fiber bundles in a plurality of holes arranged at intervals in the circumferential direction of the upper mounting disc, and making the upper mounting disc The disc is detachably installed on the lower mounting disc, and the impurities, shed diamond particles and grinding debris generated during the polishing process can be removed from the surface of the silicon ingot in time, thereby furth...

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Abstract

The invention discloses an abrasive fiber polishing disk which comprises a lower installation disk, an upper installation disk and an abrasive fiber bundle, wherein, a plurality of holes are alternately arranged in the peripheral direction of the upper installation disk, and the upper installation disk is detachably arranged on the lower installation disk; and the abrasive fiber bundle is formed by a plurality of the fiber bundles with abrasive and is arranged in the holes of the upper installation disk. The embodiment of the invention can further improve the polishing effect, simplify the process, lower the energy consumption, save the cost and prolong the service life of the polishing disk. The invention further discloses a polishing machine with the abrasive fiber polishing disk and a polishing method using the same.

Description

technical field [0001] The invention relates to the field of silicon chip manufacture, in particular to an abrasive fiber polishing disc, a polishing machine and a polishing method for polishing silicon ingots. Background technique [0002] With the rapid development of the solar cell industry, the market demand for silicon wafers for solar energy has been driven. The manufacturing process of silicon wafers for silicon solar cells mainly includes the steps of squaring single crystal or polycrystalline ingots, polishing or acid etching, wire slicing, and cleaning. Among them, the effect of polishing or acid etching is to reduce the mechanical damage layer on the surface of the square silicon ingot, thereby reducing edge chipping of the silicon wafer during slicing and improving the yield. If acid corrosion is used, a large amount of waste acid containing fluorine will be produced, which will not only pollute the environment, but also be very difficult to handle. Therefore, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/00B24D3/28B24D13/12B24B29/02
Inventor 万关良
Owner 北京东能良晶科技有限公司
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