Method for depositing nano-grade TiO2 film on textile material

Abstract

The invention provides a method for depositing a nano-grade TiO2 film on a textile material. The method comprises the steps that: high-purity metal Ti target is adopted as a target material; a pretreated textile material is adopted as a substrate; and the textile-material-based nano-grade TiO2 film is prepared under room temperature by using a DC reactive magnetron sputtering device. All samples adopt a structure that the substrate is on the upper side and the target is on the lower side, such that the nano-grade TiO2 film is prepared by sputtering from bottom to top, and impurity particles are prevented from falling onto the surface of the substrate. Also, the substrate is cooled with a water cooling device, such that substrate temperature during film deposition is controlled, and substrate deformation caused by high temperature is avoided. For ensuring the purity of the nano-grade TiO2 film, a reaction chamber is first pumped to base vacuum; high-purity argon is delivered as a sputtering gas; and high-purity oxygen is adopted as a reaction gas. With the method provided by the invention, a relatively uniform and compact TiO2 film can be deposited on the non-woven fabric fiber surface. The average particle size of the film is relatively small, and the surface roughness of the film is relatively low.

Description

technical field [0001] The invention relates to a preparation method of a textile material, in particular to a method for depositing a nanometer TiO2 film on the textile material. Background technique [0002] The study of thin films depends on the preparation technology of thin films. High-quality thin films are conducive to the research of thin film physics and the development of thin film device applications. With the application of laser technology, microwave technology and ion beam technology, people have developed a variety of preparation technologies and methods for nano-TiO2 functional films, among which the most widely used are sol-gel method (Sol. gel), chemical vapor deposition method (CVD) and physical vapor deposition (PvD) represented by magnetron sputtering. But above-mentioned several preparation methods all have its defect, and the shortcoming of sol-gel method is that the porosity of making film, compactness, crystal form and the bonding force with matrix ...

AI Technical Summary

Problems solved by technology

Once the sputtering groove of the magnetron sputtering target penetrates the target, the entire target will be scrapped, so the utilization rate of the target is not high, generally lower than 40%.