To provide a
sputtering target capable of favorably suppressing occurrence of cracks and fractures during a manufacturing process.SOLUTION: A
sputtering target having (1) Fe, (2) Pt, (3) one or more elements selected from Ag, Au, B, Co, Cr, Cu, Ga, Ge, Mn, Mo, Nb, Ni, Pd, Re, Rh, Ru, Si, Sn, Ta, W, V, and Zn, and (4) the remainder, the
atomic ratio between (1) Fe and (2) Pt being 34-55 at%, the total concentration of (1) Fe and (2) Pt being 50 mol% or above, the total content of the elements (3) being 0.5-15 mol%, the remainder (4) being an
oxide and optionally including impurities, the volume ratio of the
oxide being 40 vol.% or more, and a number-average equivalent circle
diameter, calculated on the assumption that the shape of the
oxide in the oxide phase is a circle and calculated using ImageJ using an SEM image having a visual field
magnification of 3000, of 1.3 μm or less.SELECTED DRAWING: Figure 1