The invention relates to a spectrum selective absorbing coating driven by anion and cation co-entropy engineering. The coating is composed of a polished stainless steel heat absorber substrate, a (HfZrTiTaMo) B absorbing layer and a Si3N4 antireflection layer. And the absorption layer is obtained by sputtering high-entropy boride targets with equal molar ratios under different parameters through radio frequency reaction magnetron sputtering. The preparation process is simple, the cost is low, the absorption rate of the prepared coating is larger than or equal to 0.91, the emissivity is smaller than or equal to 0.13 under the condition of the atmospheric quality factor AM1.5, and the coating has the good spectrum selection characteristic and has the important application value in the fields of solar photo-thermal power generation, photo-thermal sterilization, seawaterdesalination, water evaporation and deicing.
The invention relates to the technical field of semiconductoroptical coating, in particular to an evaporation and magnetic control mixed coating method and equipment. Plating a first base coat on the substrate by adopting a reactive magnetronsputtering mode, and plating a second base coat on the first base coat by adopting an electron beam evaporation mode; plating a functional layer on the second base layer by adopting an electron beam evaporation mode; and plating a first protective layer on the functional layer by adopting an electron beam evaporation mode, and plating a second protective layer on the first protective layer by adopting a reaction magnetron sputtering mode. According to the invention, two coatingmodes of electron beam evaporation coating and reaction magnetron sputtering coating are combined, the first base coat on the end face of the substrate and the second protective layer on the outermost layer are formed by adopting the reaction magnetron sputtering coating mode, the reaction magnetron sputtering coating is compact in film formation and can be used as the waterproof layer on the outermost layer, the particle energy is relatively high during film formation, and the film formation efficiency is high. The substrate is firmly combined and is not easy to fall off; and the functional layer is coated by adopting an electron beam evaporation mode, so that the coating efficiency is improved.
Method for the production of a Mo—N-based coating structure, including: providing a substrate to be coated and applying a hard material layer on the substrate, wherein the hard material layer includes at least one layer of Mo—N having a hexagonal crystal structure and at least one layer of Mo—N having a cubic crystal structure or a mixed hexagonal / cubic crystal structure, wherein the hard material layer is applied by a low temperature closed field unbalanced reactive magnetronsputteringcoating process.
A method of fabricating a superconducting wire includes forming a buffer layer on the substrate, the buffer layer including an Al2O3 layer, the Al2O3 layer being formed by reactive magnetronsputtering in which first oxygen gas as reactant gas and a sputtering target made of aluminiummetal are used, the Al2O3 layer being formed while being supplied the first oxygen gas at a first concentration, the first concentration being a concentration of the first oxygen gas at which an emission intensity of Al in plasma near a surface of the sputtering target is not less than 25% and not more than 80% of a first reference value, the first reference value being the emission intensity of Al at which the concentration of the first oxygen gas is zero; and forming a superconducting layer above the buffer layer.
The invention belongs to the technical field of semiconductor material preparation, and particularly relates to a method for preparing a SiCN thin film based on double-target reaction magnetron sputtering and application of the SiCN thin film. According to the invention, through co-sputtering of a Si target (radio frequency) and a C target (direct current) and in combination with N2 reaction gas, precise regulation and control of components and performance of the thin film are realized. The low-temperature, accurate, uniform and adjustable preparation of the SiCN film is realized through double-target reaction magnetron sputtering, and the method has environmental protection property and mass production potential, has remarkable technical advantages in the fields of semiconductors, photoelectrons, MEMS (Micro Electro Mechanical Systems) and the like, and has wide application prospects.
The present invention relates to the technical field of magnetron sputtering process, and specifically to a method for improving the uniformity of rare earth nickelate thin film deposited by reactive magnetronsputtering, comprising the following steps: adjusting the sputter angle of a Ni target toward a substrate to perform magnetron sputtering to deposit a thin film, and obtaining the content data of the Ni element in the deposited thin film; analyzing the content data of the Ni element to screen out the sputter angle for realizing zero-gradient deposition of the Ni element on the substrate surface; similarly, screening out the sputter angle for realizing zero-gradient deposition of the RE element on the substrate surface; preparing a nickelate thin film according to the screened zero-gradient sputter angle of Ni target material and the RE target material so as to improve the deposition uniformity of the rare earth nickelate thin film. The present invention aims to solve the problem that the introduction of reactive gas in the state of art magnetron sputtering process compromises the uniformity of the product thin film.
The invention relates to the technical field of surface treatment engineering, and particularly provides a preparation method of an MCrAlY surface high-temperature-resistant infrared low-emissivitycoating. The preparation method provided by the invention comprises the following steps: S1, depositing an Al layer on the surface of a substrate with an MCrAlY bonding layer by adopting a physical vapor deposition method, and then carrying out thermal oxidation treatment to form an alpha-Al2O3 layer; s2, depositing a compact Al2O3 layer on the surface of the alpha-Al2O3 layer by adopting an atomic layer deposition method; s3, depositing a platinumoxidetransition layer on the surface of the compact Al2O3 layer by adopting a reaction magnetron sputtering method, and then depositing a Pt layer on the surface of the platinumoxidetransition layer by adopting a magnetron sputtering method; and S4, carrying out heat treatment on the matrix treated in the step S3 to complete the preparation of the high-temperature-resistant infrared low-emissivitycoating. The MCrAlY surface high-temperature-resistant infrared low-emissivitycoating prepared by the preparation method disclosed by the invention has excellent element blocking performance and interface bonding strength.
The invention provides a composite film structure for improving the emissivity of a space glass material. The composite film structure is a SiNx / TaOy / SiOz three-layer composite structure. The surface of the space glass material is directly coated with the first SiNx film, the thickness of the first SiNx film is 850-1000 nm, and the ratio of the film component x is 1-1.5; the surface of the SiNx film is coated with the second TaOy film, the thickness of the second TaOy film is 150-200 nm, and the ratio of y is 2-3; and the third layer of SiOz film is coated on the surface of the TaOy film, the thickness of the third layer of SiOz film is 200-300 nm, and the ratio of z is 1.5-2.5. A reaction magnetron sputteringcoating technology is adopted for preparation. Compared with uncoated space glass, the space glass provided by the invention has the advantages that the infraredemissivity (within the range of 2.5-25 microns) can be improved from 0.82-0.83 to 0.88-0.89, meanwhile, the radiation resistance of the space glass is kept unchanged, and the efficient heat dissipation requirement of a novel spacecraft is met.
Owner:LANZHOU INST OF PHYSICS CHINESE ACADEMY OF SPACE TECH
The present invention relates to the technical field of magnetron sputtering process, and specifically to a method for improving the uniformity of rare earth nickelate thin film deposited by reactive magnetronsputtering, comprising the following steps: adjusting the sputter angle of a Ni target toward a substrate to perform magnetron sputtering to deposit a thin film, and obtaining the content data of the Ni element in the deposited thin film; analyzing the content data of the Ni element to screen out the sputter angle for realizing zero-gradient deposition of the Ni element on the substrate surface; similarly, screening out the sputter angle for realizing zero-gradient deposition of the RE element on the substrate surface; preparing a nickelate thin film according to the screened zero-gradient sputter angle of Ni target material and the RE target material so as to improve the deposition uniformity of the rare earth nickelate thin film. The present invention aims to solve the problem that the introduction of reactive gas in the state of art magnetron sputtering process compromises the uniformity of the product thin film.
The invention discloses a noble metal modified epitaxial titanium dioxide single crystal film, a gas sensor and a preparation method of the noble metal modified epitaxial titanium dioxide single crystal film. According to the preparation method of the titanium dioxide single crystal thin film, sputtering is carried out in a vacuum cavity through a direct-current reaction magnetron sputtering method, Ti ions are obtained through a Ti target, meanwhile, oxygen is introduced for reaction, and the deposited titanium dioxide single crystal thin film is obtained. Through an electron beam evaporation method, precious metal is evaporated on the surface of the titanium dioxide film for modification. The titanium dioxide single crystal thin film prepared by the method has a relatively large specific surface area and a large number of active gas adsorption sites; precious metal modification is beneficial for improving the gas-sensitive performance. The sensor has the gas sensitive performance of high sensitivity and selectivity, low detection limit, quick response, good long-term stability and moisture resistance, and is very suitable for low-concentration hydrogen detection and lithiumion battery thermal runaway early safety early warning.
The invention belongs to the technical field of short-wavelength optical devices, and particularly relates to a method and device for preparing a multilayer film through reactive magnetronsputtering. The method comprises the following steps: (1) depositing an X layer on a substrate in the atmosphere of working gas; (2) depositing a Y layer on the substrate on which the X layer is deposited in the atmosphere of working gas; (3) depositing a Z layer on the substrate on which the X layer and the Y layer are deposited in the range of the working gas and the reaction gas; and repeating the steps (1) to (3) for a plurality of cycles to prepare the multilayer film. The X layer is B4C, Si or Al; the Y layer is La, Mo or Ti; the Z layer is LaN, MoN or TiN; the reaction gas is nitrogen.
A CuV2O6-based photoelectric sensor is prepared through the following steps: acquiring a CuV2O6 thin film through a direct-current reactive magnetron co-sputtering method; and loading an 8-hydroxyquinoline solution on the CuV2O6 thin film through a spin-coating method to acquire an 8-hydroxyquinoline-modified CuV2O6 photoelectric sensor. The 8-hydroxyquinoline-modified CuV2O6 photoelectric sensor has a good anti-interference capability in the detection of arginine; it is easy to realize the low-cost mass production of CuV2O6 photoelectrodes through a developed direct-current reactive magnetronsputteringcoating method; and a sensor device is low in cost, simple, portable, and easy to use, and has an application value in food safety and health and hygiene detection.
The present invention provides a process debugging method for preparing a thin film by using reactive magnetronsputtering, and the method comprises: step one, determining a target working power of reactive magnetronsputtering and a target flow rate of a working gas according to an arc discharge condition on a target material surface; step two, based on the target working power and the target flow rate of the working gas, measuring the surface roughness of a thin film prepared by reactive magnetronsputtering at different powers of an auxiliary source, and determining the auxiliary source power corresponding to a surface roughness of less than 0.2 nm as the target auxiliary source power; step three, based on the target working power, the target flow rate of the working gas and the target auxiliary source power, using reactive gases with different flow rates, testing the absorption loss of a thin film on a substrate surface by a weak absorption analysis method, the absorption loss being used to characterize the reaction degree of the thin film prepared by reactive magnetron sputtering, and determining the reaction gas flow rate corresponding to an absorption loss of less than 10 ppm as the target reaction gas flow rate.