This invention provides a
boron diffusion precursor structure, a P-type passivated contact structure, and a method for preparing the same. The
boron diffusion precursor structure includes a first
silicon oxide layer, an intrinsic
polycrystalline silicon layer, and a first
boron source layer disposed on a
silicon substrate. The thickness of the first
silicon oxide layer is 1–3 nm, the thickness of the intrinsic
polycrystalline silicon layer is 20–400 nm, and the first boron source layer is made of
silicon oxide containing carbon, boron, and
nitrogen. The
carbon doping concentration of the first boron source layer is greater than 1 × 10⁻⁶. 20 cm ‑3
Boron doping concentration greater than 1×10 20 cm ‑3 The thickness of the first boron source layer is greater than or equal to 10 nm. This invention uses
silicon oxide containing carbon and boron as the source layer, where
boron diffusion is easily controlled. The intrinsic
polycrystalline silicon layer acts as a barrier to
diffusion, achieving buffered
boron diffusion.
Boron diffuses through the polycrystalline silicon layer into the silicon substrate, reducing boron enrichment in the interfacial nano-
silicon oxide layer, reducing interfacial defects, which is beneficial for improving the
passivation performance of the P-type TOPCon structure. Furthermore, it can reduce the thickness of the polycrystalline silicon layer and decrease parasitic absorption.