4 results about "Doping profile" patented technology

This invention provides an image sensor, a pixel structure, and a method for manufacturing the same. The pixel structure includes a photoelectric conversion region disposed in a semiconductor substrate and a conductive plate disposed above it. The conductive plate covers a first region of the photoelectric conversion region and induces a hole accumulation layer on its surface by receiving a bias signal, achieving electrical pinning. A doped pinning layer is disposed in a second region outside the projection range of the conductive plate, achieving physical pinning, wherein the doping concentration of the surface doping profile of the first region is lower than that of the second region. Through the synergistic effect of electric field modulation and doping modulation, a stable potential distribution is formed on the surface of the photoelectric conversion region, effectively suppressing dark current. Because high-concentration doping is avoided in the first region, the impact of doping compensation on the potential well is reduced, thereby maintaining a large charge storage space even under pixel miniaturization conditions, improving the full-well capacity and the dynamic range and signal-to-noise ratio of the image sensor.

This utility model discloses a tunneling oxide passivation contact structure for a solar cell and a solar cell. The tunneling oxide passivation contact structure includes a substrate having a light-incident surface and a back-light surface disposed opposite to each other. The back-light surface is provided with, from the side closest to the substrate to the side furthest from the substrate, a first tunneling oxide layer, a lightly doped layer, a heavily doped carbon-doped layer, a second tunneling oxide layer, and a heavily doped undoped carbon layer. The total thickness of the heavily doped carbon-doped layer and the heavily doped undoped carbon layer is 30-140 nm. This utility model provides a tunneling oxide passivation contact structure for a solar cell. By setting a distributed doping structure of lightly doped layer / heavily doped carbon-doped layer / second tunneling oxide layer / heavily doped undoped carbon layer, it optimizes carrier transport and interface passivation, improves contact stability and resistance to silver ion erosion, and has advantages such as controllable doping profile and strong process compatibility, significantly improving cell performance.

A pixel cell includes a photodiode disposed in a semiconductor material. A floating diffusion is disposed in the semiconductor material. A transfer gate includes a vertical transfer gate structure disposed in the semiconductor material between the photodiode and the floating diffusion. The transfer gate is coupled between the photodiode and the floating diffusion. A passivation layer is disposed in the semiconductor material and proximate to the vertical transfer gate. The passivation layer has a region with a non-uniformly distributed doping profile proximate to the vertical gate structure such that a first doping concentration of the region in the passivation layer proximate to the vertical gate structure along a first direction is less than a second doping concentration of the region in the passivation layer proximate to the vertical gate structure along a second direction.

This disclosure relates to a method for fabricating a selective emitter, a solar cell, and the same method. The method for fabricating a selective emitter includes: providing a substrate; performing ion diffusion treatment on the substrate to form a doped inner layer extending from the substrate surface into the substrate and a rich-doped layer covering the doped inner layer; laser-treating a non-metallic contact region using a continuous infrared laser to push the dopant element in the rich-doped layer into the substrate, such that the thickness of the doped inner layer in the non-metallic contact region is greater than the thickness of the doped inner layer in the metallic contact region; using the rich-doped layer in the metallic contact region as a barrier layer, etching the substrate to partially or completely remove the doped inner layer in the non-metallic contact region, so that the doping concentration in the non-metallic contact region is less than the doping concentration in the metallic contact region. In this way, the doping profile of the non-metallic contact region can be precisely controlled, and a specific selective emitter can be fabricated.