The invention relates to a method for predicting a copper thickness ratio of a sparse area to a dense area in pattern plating. The method comprises the following steps: (1) determining a current density J adopted for pattern plating; and (2) selecting a sparse area and a dense area to be monitored, if another dense area is distributed on one side, which is back to the selected dense area, of the sparse area, executing a step a, otherwise, executing a step b; a, determining distances between the sparse area and the two dense areas as h1 and h2 respectively, so that a copper thickness ratio of the sparse area to one of the dense areas is Y1=(mxJ-n)xh1+k, a copper thickness ratio of the sparse area to the other dense area is Y2=(mxJ-n)xh2+k, and a final copper thickness ratio is Z=Y1+Y2-1; b, determining a distance between the sparse area and the dense area as h, so that a copper thickness ratio of the sparse area to the dense area is Y=(mxJ-n)xh+k. Through adoption of the method, the copper thickness ratio of the sparse area to each dense area in pattern plating is predicted according to the current density in pattern plating and the distance between the sparse area and each dense area, so that the pattern plating is monitored in an actual production process, and the quality of a product is ensured.