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45results about How to "Improved thickness distribution" patented technology

Stretch-forming and electromagnetic combining incremental forming method and device of large thin-wall part

The invention discloses a stretch-forming and electromagnetic combining incremental forming method and device of a large thin-wall part. The method comprises the steps that a driving plate is arranged above a plate to be deformed, the driving plate and the plate to be deformed are clamped by a pressing plate and a supporting plate, and a lifting oil cylinder drives the supporting plate to move, so that the driving plate and the plate to be deformed are stretch-bent and tightened preliminarily, and the stretch-forming process is achieved; the position of an electromagnetic coil is adjusted, the electromagnetic coil is made to exactly face the driving plate to be deformed to discharge electricity, the coil rotates on the surface of the driving plate for a circle around the axis of a male die, and the plate to be deformed is attached to the male die at the same height; then, the oil cylinder descends again to stretch-bend the plate, the coil discharges electricity to deform the plate to be deformed again, the plate to be deformed is attached to the male die, and the alternate forming process of stretch-forming, discharging, re-stretch-forming and re-discharging of the plate is achieved in the same way till deformation of the plate is finished. The flowing evenness of materials can be improved, the thinning ratio of the plate can be reduced, and flexible processing and precise plastic manufacturing of large plates hard to deform can be achieved.
Owner:HUAZHONG UNIV OF SCI & TECH

Workpiece electromagnetic incremental forming device provided with profile-followed arrangement coils, and workpiece electromagnetic incremental forming method

ActiveCN108856444AGuaranteed forming qualityIncrease forming heightEngineeringElectromagnetic forming
The invention discloses a workpiece electromagnetic incremental forming device provided with profile-followed arrangement coils, and further discloses a workpiece electromagnetic incremental forming method. The workpiece electromagnetic incremental forming device comprises a supporting frame, a mould, a plate, plate clamping assemblies for fixedly clamping the plate, and a driving piece for driving the mould to move so as to conduct stretch forming on the plate, and further comprises the multiple profile-followed arrangement coils. The plate clamping assemblies are arranged on the supporting frame; the plate is fixedly clamped between the plate clamping assemblies; the driving piece is connected with the mould; the profile-followed arrangement coils are arranged on the periphery of the surface of the plate subjected to stretch forming by the mould in a surrounding mode; and all the profile-followed arrangement coils are arranged on layers of different heights above the plate correspondingly. The workpiece electromagnetic incremental forming method comprises the steps of plate fixing, stretch forming of the plate, electromagnetic forming through the profile-followed arrangement coils and the like, and the plate and the mould are attached by repeatedly executing plate stretch forming and electromagnetic forming. The workpiece electromagnetic incremental forming device and methodhave the advantages of being high in forming precision, good in forming quality, high in efficiency, high in utilization rate of discharge energy, low in equipment energy demand and the like.
Owner:CENT SOUTH UNIV

Method for predicting copper thickness ratio of sparse area to dense area in pattern plating

The invention relates to a method for predicting a copper thickness ratio of a sparse area to a dense area in pattern plating. The method comprises the following steps: (1) determining a current density J adopted for pattern plating; and (2) selecting a sparse area and a dense area to be monitored, if another dense area is distributed on one side, which is back to the selected dense area, of the sparse area, executing a step a, otherwise, executing a step b; a, determining distances between the sparse area and the two dense areas as h1 and h2 respectively, so that a copper thickness ratio of the sparse area to one of the dense areas is Y1=(mxJ-n)xh1+k, a copper thickness ratio of the sparse area to the other dense area is Y2=(mxJ-n)xh2+k, and a final copper thickness ratio is Z=Y1+Y2-1; b, determining a distance between the sparse area and the dense area as h, so that a copper thickness ratio of the sparse area to the dense area is Y=(mxJ-n)xh+k. Through adoption of the method, the copper thickness ratio of the sparse area to each dense area in pattern plating is predicted according to the current density in pattern plating and the distance between the sparse area and each dense area, so that the pattern plating is monitored in an actual production process, and the quality of a product is ensured.
Owner:GUANGZHOU FASTPRINT CIRCUIT TECH +2

Drainage board and water drainage and storage board forming equipment

The invention relates to drainage board and water drainage and storage board forming equipment which comprises a support frame, and an upper roller and a lower roller which are arranged on the support frame in parallel opposite to each other, wherein boss molds which are arranged in a parallel array mode are arranged on a cylindrical surface of the lower roller; a plurality of array grooves are evenly distributed on the upper roller along the cylindrical surface; each groove is parallel to a central axis of the upper roller; and each array groove is matched with each row of boss molds which are arranged in an array mode. The equipment is easy to manufacture and maintain and easy and convenient to operate, and the boss and bottom plate of the drainage board and the water drainage and storage board can be uniform in thickness distribution, so that the consistency of pressure bearing and other physical mechanical properties can be effectively kept, the problems that partial area is broken and then the whole construction quality and service life are reduced due to non-uniform stress are effectively solved, the economic cost is wholly reduced, the service life is prolonged, a guarantee is provided for the quality and service life of the related construction, and the equipment is suitable for popularization and application in related fields of production of drainage boards and water drainage and storage boards.
Owner:曾立敏

Air intake and exhaust structure of semiconductor chamber and semiconductor chamber

The invention discloses an air intake and exhaust structure of a semiconductor chamber and the semiconductor chamber, wherein the air intake and exhaust structure is arranged between an upper cover and a lower cover of the semiconductor chamber; the air intake and exhaust structure is characterized in that the air intake and exhaust structure comprises an annular main body and an annular support part extending towards the interior of the semiconductor chamber, wherein the inner edge of the annular support part is used for bearing a preheating ring of the semiconductor chamber, an upper chamber is arranged above the annular support part, and a lower chamber is arranged below the annular support part; the annular main body is provided with an air inlet channel for introducing air to the upper chamber and an exhaust channel for exhausting air in the upper chamber; and the side, close to the exhaust channel, of the annular support part is provided with a longitudinal through hole communicating with the upper chamber and the lower chamber, and gas in the lower chamber is exhausted along the exhaust channel through the longitudinal through hole. The distance between the longitudinal through hole and the exhaust channel is closer, the pressure is lower, hydrogen in the lower chamber tends to flow to the longitudinal through hole with the lower pressure, and the situation that the hydrogen in the lower chamber collides with process gas to generate turbulent flow is avoided.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Film forming device and partition wall structure of same

Provided is a partition wall structure for a film forming apparatus and a film forming apparatus, wherein the partition wall structure of the present invention forms at least one film formation region in the chamber of the film forming apparatus. The partition wall structure includes a circumferential regulating portion and a pair of partition walls. The circumferential restricting portion is connected to the partition wall so that the relative position of the circumferential regulating portion and the partition wall is fixed. The inner side surface of the partition wall faces the outer peripheral surface of the film formation roller with a gap therebetween when the partition wall is attached to the chamber. The circumferential direction regulating portion forms a film formation area facing the outer peripheral surface of the film formation roller. The film forming apparatus of the present invention comprises a pair of partition walls fixed to the chamber and disposed on both sides in the widthwise direction of the film formation roller at positions spaced from the film roll by a partition wall. An outer surface facing the radially outer side of the film formation roll and an inner surface facing radially inward of the film formation roll, the mask being mounted on the outer side surface of the partition wall, the inner side surface of the partition wall being located closer to the outer peripheral surface of the film roll and is positioned radially inwardly of the film formation roller.
Owner:KOBE STEEL LTD

Intelligent electroplating device and method for circuit board

The invention discloses an intelligent electroplating device and method for a circuit board, and particularly relates to the technical field of circuit board electroplating. The intelligent electroplating device comprises a machine body, two supporting frames are fixedly installed at the two ends of the upper surface of the machine body, an electroplating table is fixedly installed between the upper ends of the two supporting frames, and an electroplating liquid storage box is fixedly installed on the electroplating table. A conveying pipe is installed at the bottom of the electroplating liquid storage box, the conveying pipe penetrates through the electroplating table and extends to one end of the lower side of the electroplating table to be fixedly provided with a liquid uniformizing pipe, a plurality of electroplating pipes are installed below the liquid uniformizing pipe, and a plurality of sets of supporting seat rods are fixedly installed on the machine body. When through holes in the circuit board are electroplated, operation is convenient and fast, electroplating is accurate, electroplating efficiency is improved, meanwhile, waste of electroplating liquid can be reduced, the electroplating liquid used in the method is beneficial for improving hole filling quality, scratches and other microcosmic distribution of the circuit board, and meanwhile macroscopic coating thickness distribution is also better improved.
Owner:深圳市合成快捷电子科技有限公司
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