Intelligent electroplating device and method for circuit board
A technology for electroplating devices and circuit boards, which is applied in the electrolysis process, electrolysis components, and the formation of electrical connection of printed components, etc., can solve problems such as affecting electroplating efficiency, incapability of intelligent control, and waste of electroplating solution, and achieves convenient operation, accurate electroplating, and improved electroplating. The effect of thickness distribution
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0028] as attached Figure 1-2 The shown intelligent electroplating device for a circuit board includes a body 1, two support frames 2 are fixedly installed at both ends of the body 1, and an electroplating station 3 is fixedly installed between the upper ends of the two support frames 2, and the electroplating station An electroplating solution storage box 4 is fixedly installed on the top of the electroplating solution storage box 4, and a delivery pipe 5 is...
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