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41results about How to "Uniform film thickness distribution" patented technology

Magnet unit and magnetron sputtering apparatus

The present invention provides a magnet unit, which can realize uniform film thickness distribution of a thin film formed on a substrate without increasing the length and width of a target.
The magnet unit 10 includes an annular peripheral magnet 30, which is disposed on the yoke 20 on the back side of a cathode electrode so as to follow the outline of a target 6, and an inner magnet 40 disposed in the peripheral magnet and having a polarity different from the polarity of the peripheral magnet. The magnet unit provides a magnetic track MT that is a set of regions which tangents of magnetic field lines M generated on the target parallels to the target surface. The magnet unit further includes n (n is a positive integer of two or more) extending magnetic pole portions 41 and n−1 projecting magnetic pole portions 32. The n extending magnetic pole portions extend toward the both sides in its longitudinal direction from the central portion of the inner magnet and are adjacent to the both ends in the longitudinal direction of the peripheral magnet, and the n−1 projecting magnetic pole portions protrude inward in the longitudinal direction of the peripheral magnet from the inside of both ends of the peripheral magnet and are located between the n extending magnetic pole portions. The n extending magnetic pole portions and the n−1 projecting magnetic pole portions form 2n−1 folded shape portions U at the both ends in the longitudinal direction of the magnetic track.
Owner:CANON ANELVA CORP
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