Organic material evaporation source and organic vapor deposition device

Abstract

An organic material evaporation source capable of forming a membrane having a uniform membrane thickness distribution with respect to a large-sized substrate and capable of controlling heating temperature and evaporation rate during vapor deposition accurately and with good responsiveness; and an organic vapor deposition device using the source. A vaporization source comprises a vessel main body (31a) having a heating section consisting of a high frequency induction coil (50) and receiving a predetermined organic material, and a lid (31b) having a vaporization port (31c) for the vapor of the organic material to pass therethrough. The arrangement is such that the amount of vapor of the organic material discharged from the vaporization port (31c) in the lid (31b) steadily increases with respect to a two-dimensional position with a predetermined reference position used as a basis.

Description

technical field [0001] The present invention relates to an evaporation source for organic materials used for forming an organic compound evaporation film on a substrate, for example, in the manufacture of an organic EL element, and an organic evaporation device using the evaporation source. Background technique [0002] FIG. 7 is a schematic configuration diagram of a conventional organic vapor deposition apparatus for producing an organic EL element. [0003] As shown in FIG. 7 , in this organic vapor deposition apparatus 101 , an evaporation source 103 is provided below a vacuum chamber 102 , and a substrate 104 as a film-forming object is arranged above the evaporation source 103 . [0004] An organic thin film having a predetermined pattern is formed by vapor-depositing organic material vapor evaporated from the evaporation source 103 onto the substrate 104 through the mask 105 . [0005] However, in the technical field of organic EL elements in recent years, mass produ...

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Problems solved by technology

[0005] However, in the technical field of organic EL elements in recent years, mass production technology suitable for large substrates is required, and there is a problem that it is difficult to obtain a uniform film thickness distribution with existing evaporation sources.

[0006] In addition, the existing evaporation source also has the problem that it is difficult to accurately control the heating temperature and evaporation rate, and the responsiveness of the control is not enough.

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