Method for predicting copper thickness ratio of sparse area to dense area in pattern plating

Abstract

The invention relates to a method for predicting a copper thickness ratio of a sparse area to a dense area in pattern plating. The method comprises the following steps: (1) determining a current density J adopted for pattern plating; and (2) selecting a sparse area and a dense area to be monitored, if another dense area is distributed on one side, which is back to the selected dense area, of the sparse area, executing a step a, otherwise, executing a step b; a, determining distances between the sparse area and the two dense areas as h1 and h2 respectively, so that a copper thickness ratio of the sparse area to one of the dense areas is Y1=(mxJ-n)xh1+k, a copper thickness ratio of the sparse area to the other dense area is Y2=(mxJ-n)xh2+k, and a final copper thickness ratio is Z=Y1+Y2-1; b, determining a distance between the sparse area and the dense area as h, so that a copper thickness ratio of the sparse area to the dense area is Y=(mxJ-n)xh+k. Through adoption of the method, the copper thickness ratio of the sparse area to each dense area in pattern plating is predicted according to the current density in pattern plating and the distance between the sparse area and each dense area, so that the pattern plating is monitored in an actual production process, and the quality of a product is ensured.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for predicting the ratio of the copper thickness of a pattern electroplating sparse area to a dense area. Background technique [0002] There are often problems such as uneven copper thickness and nickel thickness in the production of pattern electroplating. Due to the difference between the high and low current areas of the entire plate, the thickness difference between the plate surface and the metallized hole wall is relatively large, and the copper thickness of some isolated patterns (sparse areas) is too thick. However, the copper thickness in the large copper surface area (dense area) is relatively thin, which brings problems such as undercut and excessive line width tolerance to subsequent processing. However, there is still little research on the causes and mechanisms of the uneven thickness of the pattern plating coating, so it is impossible to ...

AI Technical Summary

Problems solved by technology

[0002] There are often problems such as uneven copper thickness and nickel thickness in the production of pattern electroplating. Due to the difference between the high and low current areas of the entire plate, the thickness difference between the plate surface and the metallized hole wall is relatively large, and the copper thickness of some isolated patterns (sparse areas) is too thick. However, the copper thickness in the large copper surface area (dense area) is relatively thin, which brings problems such as undercut and excessive line width tolerance to subsequent processing.

However, there is still little research on the causes and mechanisms of the uneven thickness of the pattern plating coating, so it is impossible to predict the thickness difference between the sparse area and the dense area before electroplating, and it is impossible to monitor the pattern electroplating in the actual production process. The quality of the product is not guaranteed

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