Method for predicting copper thickness ratio of sparse area to dense area in pattern plating
A graphic electroplating and prediction method technology, which is applied in the direction of electrical components, printed circuits, and printed circuit manufacturing, can solve problems such as graphic electroplating monitoring, prediction of thickness difference between sparse areas and dense areas, and excessive line width tolerance, so as to improve production benefit, reduce the scrap rate, and ensure the effect of quality
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[0024] The embodiments of the present invention will be described in detail below in conjunction with the drawings:
[0025] Such as figure 1 As shown, a method for predicting the ratio of copper thickness between sparse area and dense area of pattern plating includes the following steps:
[0026] (1) Obtain the graphic distribution information and size information of the printed board, and determine the current density J used for graphic electroplating, the unit is ASF;
[0027] (2) Select the sparse area and the dense area to be monitored. If there is a dense area on the side of the sparse area away from the selected dense area, it belongs to the situation of isolation on both sides, perform step a, otherwise it is unilateral isolation , Go to step b;
[0028] a. Determine the distance between the sparse area and the two dense areas as h1 and h2 respectively, then the copper thickness ratio of the sparse area to one of the dense areas Y1=(m×Jn)×h1+k, the difference between the spa...
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