The utility model relates to the technical field of
semiconductor manufacturing, in particular to a
wafer supporting structure for baking. The utility model provides a
wafer supporting structure for baking, which can enable the side end supporting
assembly and the middle supporting
assembly to alternately support the lower surface of a
wafer through a mode of arranging the side end supporting
assembly, the lifting motor and the middle supporting assembly, thereby reducing the influence on the baking effect of the wafer caused by
heat transfer blocking due to local shielding, and improving the baking quality of the wafer. The baking difference of the wafer is reduced; and 2, the side end supporting assembly lifts or sinks one side of the wafer, so that the wafer swings up and down during baking, the surface
adhesive film flows and is redistributed through external force, the thickness uniformity of the
adhesive film is improved, meanwhile,
solvent steam is more easily diffused to the surface from the interior of the
adhesive film, and the volatilization efficiency of the
solvent steam is improved.