Film forming device and method, producing device and method for liquid-crystal device

Abstract

The invention can include a thin-film forming device that is a device for forming a thin-film by applying a coating solution onto a substrate, the coating solution containing a solvent and a film-forming material dissolved or dispersed therein. Also an ejection mechanism having a droplet ejection head for ejecting the coating solution onto the substrate, a moving mechanism capable of relatively moving the positions of the droplet ejection head and the substrate, and a control unit for controlling at least one of the ejection mechanism and the moving mechanism can be provided for the thin-film forming device. In addition, a solvent vapor supply mechanism for supplying the solvent vapor to the vicinity of the coating solution applied onto the substrate can also be provided for the thin-film forming device. Thereby, material losses are reduced by using a droplet ejection head, the thickness of the entire film can be made uniform, in addition, the patent provides also provides e a thin-film forming device and a thin-film forming method, a liquid crystal display and a device and method for manufacturing the same, and a thin-film structure and a device and method for manufacturing the same, in which material losses are reduced by using a droplet ejection head, and in addition, the thickness of the entire film can be made uniform.

Description

Technical field [0001] The present invention relates to a thin film forming apparatus and method for forming a thin film by applying a coating solution prepared by dissolving or dispersing a film material in a solvent on a substrate, and a liquid crystal device manufacturing device and a liquid crystal device manufacturing method using them The invention relates to a liquid crystal device, a thin-film structure manufacturing device, a thin-film structure manufacturing method, a thin-film structure, and an electronic device, and in particular, it relates to a forming device capable of uniformizing a film thickness. Background technique [0002] Conventionally, as a thin film formation technique, for example, a spin coating method, which is one of thin film coating methods, is generally used. The spin coating method is a method in which a coating liquid is dropped on a substrate, and the substrate is rotated, and the entire surface of the substrate is coated by centrifugal force to...

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Problems solved by technology

[0003] However, in this spin coating method, since most of the supplied coating liquid scatters, it is not only necessary to supply a large amount of coating liquid, but also wastes a lot, causing a problem of cost increase.

In addition, since the substrate is rotated, the coating liquid flows from the inside to the outside due to the centrifugal force, and the film thickness in the outer peripheral region tends to be thicker than that in the inside, so the problem of uneven film thickness occurs.

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