The utility model discloses a substrate
processing device based on direct-current
glow discharge plasma. The substrate
processing device comprises a process chamber, a
discharge device arranged in the process chamber, a substrate fixing device, a direct-current high-
voltage power supply located outside the process chamber, and a vacuumizing device connected with the process chamber. The process chamber is further communicated with a gas
path system used for gas inlet and gas outlet, an
electrode flange is arranged between the direct-current high-
voltage power supply and the discharging device, the two sides of the
electrode flange are connected with the direct-current high-
voltage power supply and the discharging device respectively, and a cooling device is arranged at the
tail of the
electrode flange. According to the scheme, the substrate is cleaned through the
direct current glow discharge plasma technology, the
adhesive force between the substrate and the
colloid is increased, and the problem of degumming in the subsequent technological process is avoided. According to the scheme, the substrate treatment process is realized by arranging the process chamber, the discharging device, the direct-current high-voltage power supply, the vacuumizing device and the like, the structure is simple, the device can be suitable for treating substrates of different specifications, and the use requirements are met.