The invention discloses a sealing method for laser filler welding of hybrid integrated circuit package. The sealing method comprises the following steps: 1, an aluminum alloy casing and an aluminum cover plate are rinsed by using acetone; 2, joints are assembled, a stepped groove is arranged in the aluminum alloy casing, the aluminum alloy cover plate is mounted on the aluminum alloy casing, the aluminum alloy casing and the aluminum alloy cover plate are butted by utilizing a tool, the butting mode is corner joint, and a joint gap is formed at the joints; 3, pre-filler is filled in the joint gap; 4, spot welding is carried out, a Nd:YAG (nipigin-doped: yttrium aluminum garnet) laser is adopted, the relative positions of the aluminum alloy casing, the aluminum alloy cover plate and the pre-filler are fixed, and the spot welding is proceeded in protective gas; 5, the overall welding is carried out, the Nd:YAG laser is adopted, a mouth-shaped welding form is adopted, and the welding process is proceeded in the protective gas. With the adoption of the sealing method, the welding reliability is good, the air-tight seal is good, and the welding seam is attractive and crack-free.