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Sealing method for laser filler welding of hybrid integrated circuit package

A hybrid integrated circuit and laser technology, applied in laser welding equipment, circuits, welding equipment, etc., can solve the problems of high thermal cracking tendency and achieve good sealing effect

Active Publication Date: 2013-10-02
WUXI HUACE ELECTRONICS SYST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Practical experience shows that Al-Mg, Al-Si and Al-Mn alloys have good weldability and are not prone to welding cracks, but these Al-Cu, Al-Zn and Al-Mg-Si alloys have good weldability. prone to cracking

Method used

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  • Sealing method for laser filler welding of hybrid integrated circuit package
  • Sealing method for laser filler welding of hybrid integrated circuit package
  • Sealing method for laser filler welding of hybrid integrated circuit package

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Embodiment Construction

[0027] The specific implementation manner of the present invention will be described below in conjunction with the accompanying drawings.

[0028] like figure 1 As shown, the sealing method of the laser filler welding of the hybrid integrated circuit package in this embodiment includes the following steps:

[0029] The first step: cleaning the aluminum alloy shell 1 and the aluminum alloy cover plate 3 with acetone;

[0030] The second step: joint assembly: the aluminum alloy shell 1 is provided with a step-shaped groove, and the aluminum alloy cover plate 3 is installed on the aluminum alloy shell 1, and the aluminum alloy shell 1 and the aluminum alloy cover plate 3 are docked by tooling , the butt joint method is a corner joint, and a joint gap is formed at the joint;

[0031] Step 3: Fill the prefill 2 in the joint gap;

[0032] The fourth step: spot welding: use Nd:YAG laser to fix the relative position of aluminum alloy shell 1, aluminum alloy cover plate 3 and prefil...

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Abstract

The invention discloses a sealing method for laser filler welding of hybrid integrated circuit package. The sealing method comprises the following steps: 1, an aluminum alloy casing and an aluminum cover plate are rinsed by using acetone; 2, joints are assembled, a stepped groove is arranged in the aluminum alloy casing, the aluminum alloy cover plate is mounted on the aluminum alloy casing, the aluminum alloy casing and the aluminum alloy cover plate are butted by utilizing a tool, the butting mode is corner joint, and a joint gap is formed at the joints; 3, pre-filler is filled in the joint gap; 4, spot welding is carried out, a Nd:YAG (nipigin-doped: yttrium aluminum garnet) laser is adopted, the relative positions of the aluminum alloy casing, the aluminum alloy cover plate and the pre-filler are fixed, and the spot welding is proceeded in protective gas; 5, the overall welding is carried out, the Nd:YAG laser is adopted, a mouth-shaped welding form is adopted, and the welding process is proceeded in the protective gas. With the adoption of the sealing method, the welding reliability is good, the air-tight seal is good, and the welding seam is attractive and crack-free.

Description

technical field [0001] The invention relates to the technical field of metal casing packaging, in particular to a sealing method for laser filler welding of hybrid integrated circuit packaging. Background technique [0002] Aluminum and aluminum alloys have the characteristics of low density, good corrosion resistance, high electrical conductivity and thermal conductivity. It is widely used in aerospace electronic products. There are many types of aluminum and aluminum alloys, and their characteristics vary greatly in practical applications. [0003] The linear expansion coefficient and crystallization shrinkage rate of aluminum are twice that of steel, and it is easy to produce large welding deformation and internal stress. For structures with high rigidity, cracks are easy to occur during welding. The main alloying elements of aluminum alloys are Cu, Mg, Mn, Si and Zn, etc. The participation of these alloying elements can improve the mechanical properties of aluminum allo...

Claims

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Application Information

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IPC IPC(8): B23K26/24B23K26/42B23K33/00H01L21/48
Inventor 施冬跃刘均东
Owner WUXI HUACE ELECTRONICS SYST
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