Method for sticking module group substrates with driver circuit and equipment thereof
A driving circuit and liquid crystal module technology, which is applied in nonlinear optics, instruments, optics, etc., can solve problems such as substrate warping, low product yield, and driving circuit bonding dislocation, so as to reduce maneuvering space, improve yield, Avoid the effect of adhesive misalignment
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Embodiment 1
[0033] 3 to 5 are a schematic structural diagram and a working schematic diagram of a bonding apparatus according to a preferred embodiment of the present invention. As can be seen from FIG. 3 , the bonding apparatus of this embodiment includes a digital program-controlled unit 1 , a support table 2 a , a thermal pressing head 3 and a driving mechanism 5 thereof. The support table 2a is provided with a plurality of vacuum suction holes 21a; the digital program control unit 1 is used to drive the drive mechanism 5 to control the action of the thermal head 3 . As shown in FIG. 4 , when entering the LCD module segment process, the LCD module substrate 6 is placed on the support table 2a for vacuum adsorption, and the LCD module substrate 6 can be firmly adsorbed on the vacuum suction hole 21a through the vacuum suction hole 21a. The support table 2a is kept in a flat and stable state; the digital program control unit 1 in the machine equipment drives the driving mechanism 5 to tr...
Embodiment 2
[0035] FIG. 6 is a schematic structural diagram and a working schematic diagram of a bonding apparatus according to another embodiment of the present invention. It can be seen from the figure that the processing equipment of this embodiment also includes a digital program control unit 1 , a support table 2 b , a thermal press head 3 and its driving mechanism 5 . The difference is that the driving mechanism 5 in this embodiment adopts a telescopic straight tube type lateral displacement member 5b.
[0036] The placement of the liquid crystal module substrate 6 on the support table 2a is as described in the first embodiment. In particular, the digital program control unit 1 drives and controls the telescopic straight-tube lateral displacement mechanism 5b of the thermal head 3 according to a specific program. Start to extend step by step along the liquid crystal module substrate 6, and drive the thermal head 3 at the matching position to press the driving circuit 7 and the liqui...
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