145results about How to "Increase joint area" patented technology

The invention relates to an LED filament and a filament type LED bulb using the LED filament. The LED filament comprises a carrier, LED chips arranged on the carrier, and an electric conduction pin fixedly connected with the carrier. The electric conduction pin is electrically connected with the LED chips. The electric conduction pin comprises a pin head part, a pin tail part and a pin neck part used connected with the pin head part and the pin tail part. The entity width of the pin neck part is smaller than the maximum entity width of the pin head part. The pin neck part with the reduced entity width is obtained through the mode of internally reducing the width of the pin head part relative to the pin neck part or opening a through hole in the pin neck part or other modes, the pin neck part becomes a weak point of the electric conduction pin; and in this way, when stress is generated, the pin neck part acts firstly, and the joint of the pin head part and the carrier or the carrier itself can be protected.

A solar battery according to the embodiment of the present invention includes an rear electrode formed on a substrate and separated by an first through-hole; an light absorbing layer formed on the rear electrode including the first through-hole; a second through-hole exposing the rear electrode through the light absorbing layer; a buffer layer formed on the upper surface and the side surface of the light absorbing layer; a front electrode layer formed on the buffer layer; and a connection wiring extending from the front electrode layer and formed within the second through-hole.

A ball grid array package substrate includes a substrate body having a surface. A least a ball pad and a solder mask are formed on the surface of the substrate body. The solder mask has an opening corresponding to the ball pads to enable the ball pad to have an exposed surface out of the opening of the solder mask. A patterned reinforcing metal layer is formed on the exposed surface of ball pads along a sidewall of the opening of the solder mask so that the sidewall of the opening will not directly contact the solder balls. Solder balls can be reflowed on the ball pads and the patterned reinforcing metal layers to increase jointing area and improve the shear strength of the solder balls.

This invention discloses an electronic package for containing a vertical semiconductor chip that includes a laminated board having a via connector and conductive traces distributed on multiple layers of the laminated board connected to the via connector. The semiconductor chip having at least one electrode connected to the conductive traces for electrically connected to the conductive traces at a different layer on the laminated board and the via connector dissipating heat generated from the vertical semiconductor. A ball grid array (BGA) connected to the via connector functioning as contact at a bottom surface of the package for mounting on electrical terminals disposed on a printed circuit board (PCB) wherein the laminated board having a thermal expansion coefficient in substantially a same range the PCB whereby the BGA having a reliable electrical contact with the electrical terminals.

The invention discloses a friction welding method for copper and aluminum end faces. The method comprises the following steps that S1, a plurality of concentric ring-shaped or round bosses are formed on the copper or aluminum end face of a to-be-welded object with the copper or aluminum end face, and the section of each boss is in the shape of a trapezoid with the lower bottom connected with the copper or aluminum end face; S2, edges and corners of the bosses are removed; S3, acid pickling is conducted on the copper or aluminum end face, and a surface oxide layer is removed; and S4, the copper or aluminum end face is connected to another to-be-welded object with the copper or aluminum end face through friction welding. The copper and aluminum end faces are provided with the bosses and grooves, the bosses and the grooves are spliced, and thus the splicing area is increased; furthermore, the copper and aluminum end faces are treated before and during friction welding, the quantity of oxide impurities is reduced, and thus the splicing strength is improved.

A helmet 1 with a visor formed by integrally joining the preliminarily injection-molded visor 5 to a cap body 3, wherein an opening end edge 9 formed on the cap body is joined to the outer side of a joining wall 17 formed on the visor 5, and the joining wall 17 is held by the opening end edge 9 and a tongue-shaped part 31 formed on the inside of the cap body 3. The joined faces of the visor 5 and the cap body 3 are joined to each other by fusing, an intruding engagement part intruded in a through hole 22 formed in the joining wall 17 is formed at the opening end edge of the cap body 3, and the joining portion of the visor and the cap body is formed in annular shapes.

The invention relates to a polycylinder stackable semiconductor packaging structure. The structure mainly comprises a wafer carrier, a wafer and a plurality of downwards convex block groups, wherein the wafer carrier has a plurality of switchover pads on an upper surface and a plurality of external pads on a lower surface; the wafer is arranged on and is electrically connected with the wafer carrier; the downwards convex block groups are correspondingly arranged on the external pads, and each downwards convex block group connected with each external pad consists of a plurality of conducting cylinders; and a solder filling gap is arranged between adjacent conducting cylinders of the same downwards convex block group. The stackable semiconductor packaging structure is used to increase welding area and perplex the shape of a welding interface, thereby achieving high durability of welding spots and reducing the growing possibility of cracks. In addition, the convex block group arranged on each external pad has the solder filling gap, solder can be filled and stored in the convex block group, so that a plaque does not extrude the solder to cause bridging short circuit even when inclined or warped; therefore, the structure is particularly suitable for practical use.

Provided is an MEMS sensor wherein especially a structure for bonding each supporting conductive section of a movable electrode section and a fixed electrode section, which are supported on a first substrate side, with a lead layer embedded in an insulating layer on the side of a second substrate which faces the first substrate with a space therebetween is improved. The MEMS sensor has a first substrate (1), a second substrate (2), and a functional layer, which is arranged between the substrates and has the movable electrode section, the fixed electrode section and the supporting conductive section. On the surface of the second substrate (2), a second insulating layer (30), a lead layer (35) and a connecting electrode section (32) which is electrically connected to the lead layer and is individually connected to each supporting conductive section are arranged. On the surface of the second insulating layer (30), a recessed section (37) which penetrates to reach even the surface of the lead layer is formed. The connecting electrode section (32) has a recessed region (32a) conforming to the shape of the recessed section (37), and a connecting region (32b) which extends long on the surface of the second insulating layer (30) from one end section in the recessed region. The supporting conductive section (17) and a connecting region (32b) of the connecting electrode section (32) arebonded to each other.

The invention discloses a luminous element and a fabrication method thereof. The luminous element comprises a luminous diode and a pedestal; wherein the luminous diode is composed of electrodes and a junction layer formed on the electrodes, and the pedestal comprises a junction pad and a plurality of lug bosses and/or pits which are formed on the junction pad. The method for fabricating the luminous diode includes the following steps: providing a luminous diode which has electrodes and a junction layer which is arranged on the electrodes; providing a pedestal which comprises at least a junction pad; forming a plurality lug bosses and/or pits on the junction pad; and jointing the luminous diode and the pedestal.

In an injection mold comprising a cavity and a gate for feeding a molding material into the cavity, the molding material fed from the gate into the cavity is divided into two streams that flow through the cavity and then meet at a confluent point so that the molding material portions are joined together along a joint plane. Two air vent gates are spaced apart from the confluent point so as to provide a larger area of the joint plane. Articles having a good outer appearance and improved strength at the material joint can be consistently manufactured to a high precision.