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166results about "Movable microstructural devices" patented technology

MEMS sensor and method for compensating systematic measurement deviations in MEMS sensor

The invention relates to a MEMS sensor (100) comprising: a substrate (40) having a main plane of extension; a vibration mass (60) which is movably suspended in the z-direction (1000) relative to the substrate (40); and a sensor device (90) for detecting a measurement signal dependent on the position of the vibration mass (60). The at least two resonators (10, 11, 12) are suspended in an elastically movable manner relative to the substrate in the z-direction (1000). The actuatable electrode arrangement (30) is designed to resonate each of the at least two resonators (10, 11, 12) in order to generate a mechanical resonant vibration and to capacitively detect an interference variable dependent on at least one resonant frequency of the resonant vibration. The invention also relates to a method for compensating for systematic measurement deviations of a MEMS sensor (100).
Owner:ROBERT BOSCH GMBH

MEMS pressure sensor, manufacturing method thereof and electronic device

The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.
Owner:CHINA RESOURCES MICROELECTRONICS HLDG LTD

Optical probe and method for its manufacture

The invention relates to an optical probe (1) which is designed for optical coupling to at least one micro-optical component (50) and to a method for its production, wherein the optical probe (1) comprises: - a probe head (10); - at least one micro-optical element (20) having a mechanical connection to the probe head (10) and configured to establish an optical coupling to the at least one micro-optical component (50); and - at least one sensor structure (21) separate from the at least one micro-optical element (20) and configured to generate a sensor signal (40) indicating a positioning of the probe head (10) relative to an object (100).
Owner:KEYSTONE PHOTONICS GMBH

Three-axis angular rate sensor with a substrate and a double rotor

A three-axis angular rate sensor with a substrate and a A double rotor is proposed, wherein the double rotor has a first and a second rotor (1, 2) which are elastically connected to one another via a first coupling element (8) in such a way that the two rotors (1, 2) can be excited to antiphase torsional vibrations, wherein the first rotor (1) has a first and a second second seismic mass (3, 4) which are mounted so as to be deflectable relative to the first rotor (1) and the second rotor (2) has a third and a fourth seismic mass (5, 6) which are mounted so as to be deflectable relative to the second rotor (2), wherein the first mass (3) is connected to the third mass (5) via a first rocker element (9) is connected in such a way that the third mass (5) at a lateral deflection of the first mass (3) is deflected in an opposite lateral direction, wherein the second mass (4) is connected to the fourth mass (6) via a second rocker element (9') such that the fourth mass (6) is deflected in an opposite lateral direction upon a lateral deflection of the second mass (4).
Owner:ROBERT BOSCH GMBH

FLUID MODULE AND METHOD FOR PRODUCE SPATIALLY SEPARATED LIQUID PARTITIONS

Fluidic module and method for generating spatially separated liquid partitions in an array of wells formed in a surface. The method comprises the provision and rotation of the fluidic module. The fluidic module includes a fluid chamber comprising the surface in which the array of wells is formed. The fluidic module is rotated about a center of rotation to exert a centrifugal force on a liquid, thereby introducing the liquid into the fluid chamber and transporting at least a portion of the liquid from radially outside to radially inside across the array of wells. The method further comprises the removal of liquid from areas of the surface outside the wells to generate the spatially separated liquid partitions within the wells.
Owner:HAHN SCHICKARD GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG EV

Element for use in a micro-electro-mechanical system and micro-electro-mechanical system

The invention relates to an element (100) for use in a micro-electro-mechanical system (200), in particular for use in semiconductor technology equipment, and to a micro-electro-mechanical system (200) comprising such an element (100). The element (100) comprises a MEMS structure (101) and at least one coating (140) applied over a large area to designated partial surfaces (135, 155) of the MEMS structure (101) from one side of the element (100), wherein the MEMS structure (100) has at least one otherwise non-functional special shape (160) with which at least a continuous parasitic coating (145) is avoided for certain areas away from the designated partial surfaces (135, 155).
Owner:CARL ZEISS SMT GMBH

Micro-electro-mechanically movable element and system

The invention relates to a micro-electro-mechanically movable element (103) for use in a micro-electro-mechanical system (100) and a corresponding micro-electro-mechanical system (100), in particular for use in semiconductor technology equipment. The micro-electro-mechanically movable element (103) comprises a base plate (104) on the side of which facing away from the base structure (101) a mirror plate (105) with a curvature geometry is arranged, wherein the mirror plate (105) is connected to the base plate (104) via a pedestal (106), wherein the geometry of the contact points (107, 108) between pedestal (106) and mirror plate (105) as well as between pedestal (106) and base plate (104) are different. The micro-electro-mechanical system (100) comprises an element (103) that is micro-electro-mechanically movable at least in at least one degree of freedom relative to a basic structure (101) by at least one actuator (102), wherein the micro-electro-mechanically movable element (103) is designed according to the invention.
Owner:CARL ZEISS SMT GMBH

Micro-electromechanical system switch configured for high current and high power

PendingUS20250210282A1Circuit-breaking switches for excess currentsProtective switches using micromechanics
High voltage microelectromechanical systems (MEMS) switches are described. The MEMS switches can be actively opened and closed. The switch can include a beam coupled to an anchor on a substrate by one or more hinges. The switch can include control electrodes, disposed on a surface of the substrate, for electrically controlling the beam. The anchor is asymmetrically positioned with respect to the two ends of the beam and is electrically connected to a middle electrode. A stopper serves as a pivot point during actuation of the switch to reduce the mechanical stress on the hinges.
Owner:ANALOG DEVICES INT UNLTD CO

Rotation rate sensor with a micromechanical structure and method for operating a rotation rate sensor

A gyroscope with a micromechanical structure and a mass oscillator is proposed, wherein the mass oscillator can be driven to a drive oscillation by means of a drive device, wherein the gyroscope is configured to protect the micromechanical structure and during a time interval of a detected free-fall situation such that a reduction in the amplitude of the drive oscillation is achieved, wherein the free-fall situation is signaled by means of a free-fall signal supplied to the gyroscope, wherein the gyroscope is further configured such that - following the reception of a further free-fall signal signaling the end of the free-fall situation - the drive device drives the mass oscillator back to its operational drive oscillation.where the reduction in the amplitude of the drive oscillation is achieved faster than would correspond to a mere decay process of the drive oscillation of the mass oscillator.
Owner:ROBERT BOSCH GMBH

Three-axis rotation rate sensor with a substrate and a double rotor

A three-axis rotation rate sensor. The sensor includes a substrate and a double rotor including a first rotor and a second rotor elastically connected to each other via a first coupling element such that the two rotors are excitable to antiphase rotary oscillations, the first rotor including a first and a second seismic mass, which are deflectably mounted vis-à-vis the first rotor and the second rotor includes a third and a fourth seismic mass, which are deflectably mounted vis-à-vis the second rotor, the first mass being connected to the third mass via a first rocker element such that the third mass is deflected in an opposite lateral direction upon a lateral deflection of the first mass, the second mass being connected to the fourth mass via a second rocker element such that the fourth mass is deflected in an opposite lateral direction upon lateral deflection of the second mass.
Owner:ROBERT BOSCH GMBH

Circuit breaker circuitry with micro-electromechanical systems switch

PendingUS20250210295A1Protective switches using micromechanicsEmergency protective arrangements for limiting excess voltage/current
Circuit breakers based on micro-electromechanical systems (MEMS) switches are described. A high voltage MEMS teeter-totter switch can include a beam coupled to an anchor on a substrate and two control electrodes, disposed on a surface of the substrate. A control voltage applied on one of the control electrodes with respect to a first reference voltage puts one of the two ends of the beam in electric contact with one of two contact electrodes of the MEMS teeter-totter switch to electrical connected two terminals of a circuit breaker. The input voltage is applied on the beam with respect to a second reference voltage different from the first reference voltage. A MEMS teeter-totter switch network comprises a plurality of MEMS teeter-totter switches configured to switch high voltage and high current between the two terminals of the circuit breaker.
Owner:ANALOG DEVICES INT UNLTD CO

Microelectromechanical mirror device with piezoelectric actuation and improved opening angle

A microelectromechanical mirror device includes a fixed structure defining a cavity, a tiltable structure elastically suspended above the cavity and carrying a reflecting surface, and having a main extension in a horizontal plane. A first pair of driving arms carry respective piezoelectric material regions that are biased to cause a rotation of the tiltable structure around a first rotation axis parallel to a first horizontal axis of the horizontal plane, and elastically coupled to the tiltable structure. Elastic suspension elements that couple the tiltable structure to the fixed structure at the first rotation axis are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion around the first rotation axis, and further extend between the tiltable structure and the fixed structure. The elastic suspension elements have an asymmetrical arrangement on opposite sides of the tiltable structure along the first rotation axis.
Owner:STMICROELECTRONICS SRL

A magnetically controlled micro-nano robot and its manufacturing method and use

The present invention belongs to the technical field of micro-nano robots, and in particular to a magnetically controlled micro-nano robot and a manufacturing method and use thereof. The manufacturing method of the magnetically controlled micro-nano robot comprises the following steps: coating a magnetic material dispersion solution on the surface of a substrate to form a magnetic layer; the magnetic material dispersion solution is Fe 3 O 4 A γ-butyrolactone (GBL) solution is prepared; a photoresist is coated on the surface of the magnetic layer, and photolithography is performed to obtain a magnetically controlled micro-nano robot. The manufacturing method of the present invention does not require the use of expensive large-scale high-end complex equipment, and is easy to operate. The obtained magnetically controlled micro-nano robot can move rapidly and directional under the action of a magnetic field.
Owner:SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY

METHOD FOR PRODUCE AN ARRANGEMENT OF AT LEAST TWO ION TRAP CHIPS AND ARRANGEMENT

A method for manufacturing an arrangement (1) of at least two ion trap chips is disclosed, comprising a first ion trap chip (25) and a second ion trap chip (26), with - Providing a support (2) with a first main surface (5) with a first area (3) and a second area (4), - Arranging a first transparent layer (22) on which the first ion trap chip (25) is arranged, on the first area (3), - Providing a second transparent layer (23) on which the second ion trap chip (26) is arranged in the second area (4), - Aligning the first ion chip and the second ion chip in a vertical direction such that the principal extension planes of the first ion chip and the second ion chip extend within a common plane (27) extending in lateral directions, - Providing a spacer layer (12) with a predetermined thickness in the vertical direction depending on the orientation, - Arranging the spacer layer (12) on the second area (4), - Arrange the second transparent layer (23) on the spacer layer (12) such that the principal extension planes of the first ion trap chip (25) and the second ion trap chip (26) extend within the common plane (27). Furthermore, an arrangement (1) is specified.
Owner:ELEQTRON GMBH

Electrical counter based on super-smooth homojunction interface and counting method

The invention discloses an electrical counter based on a super-smooth homojunction interface and a counting method, and relates to the technical field of micro-nano electromechanical systems (MEMS / NEMS). Comprising a base part, a rotatable part, a first layered material layer, a second layered material layer and a measuring and processing system, and the rotatable part can rotate relative to the base part; the measuring and processing system is electrically connected to the first layer of layered material and the second layer of layered material and is configured to: monitor a change in a resistance value across the homojunction interface during the rotational motion; identifying a characteristic reduction of the resistance value; outputting a count signal based on the identification of the characterization reduction; the beneficial effects of the invention are that the scheme utilizes the intrinsic physical effect of the lattice of the layered material at a specific rotation angle to realize a novel counting sensing mechanism which is high in precision, high in signal-to-noise ratio and extremely easy to miniaturize.
Owner:RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN +1

MEMS devices and methods for their manufacture

Device with a microelectromechanical system (MEMS) comprising the following: a first record (101), a second plate (105) which is arranged above the first plate (101), a first movable plate (102) arranged between the first plate (101) and the second plate (105), and a second movable plate (103) arranged between the first movable plate (102) and the second plate (105), the MEMS device comprising a first input / output node coupled to the first plate (101), a second input / output node coupled to the second plate (105), a third input / output node coupled to the first movable plate (102), and a fourth input / output node coupled to the second movable plate (103), wherein the first input / output node is different from the second input / output node, and wherein the third input / output node is different from the fourth input / output node, wherein the first movable plate (102) is rigidly coupled to the second movable plate (103), wherein the first movable plate (102) is designedto be shielded from capacitive coupling with the second movable plate (103).
Owner:INFINEON TECHNOLOGIES AG

Large-deflection cantilever beam actuating structure

A large-deflection cantilever beam actuating structure disclosed by the present invention comprises an actuating module, a reflector and a supporting module, the reflector is fixedly installed at the upper end of the supporting module, and a driving element is arranged on the actuating module. The actuating module comprises a twisting plate fixedly connected with the supporting module and a plurality of actuators connected with the twisting plate, and the driving ends, connected with the twisting plate, of the actuators are asymmetrically arranged on the two sides of a rotating shaft L of the twisting plate. By means of the mode, the large-angle deflection can be achieved, meanwhile, the large-angle deflection device has the advantages of being small in size, high in integration degree, easy to machine and high in yield, and can be matched with reflectors of different sizes.
Owner:SHANGHAI MAIKAI TECHNOLOGY CO LTD

In-plane three-axis large-displacement actuating platform based on MEMS and manufacturing method of in-plane three-axis large-displacement actuating platform

The invention discloses an in-plane three-axis large-displacement actuating platform based on MEMS and a manufacturing method thereof.The in-plane three-axis large-displacement actuating platform mainly comprises an outer frame, a cross island frame, a bidirectional comb-shaped driving unit, a long spring beam and a short spring beam, and the manufacturing method comprises the steps that a cavity structure on a glass substrate is anisotropically etched through magnetic neutral loop discharge plasma (NLD); the method comprises the following steps of: bonding a BF33 glass wafer with a cavity structure with a low-resistance silicon wafer by using an anodic bonding process, thinning the low-resistance silicon wafer, performing deep silicon etching (DRIE) on the low-resistance silicon wafer to form an electrical isolation channel and filling a BCB material, removing the BCB on the surface of the low-resistance silicon wafer by using a chemical mechanical polishing (CMP) process, sputtering a metal layer and forming a lead layer by using a lift-off process, and performing deep silicon etching (DRIE) on the low-resistance silicon wafer to form a final device. The method has the beneficial effects that the filling rate of the device is improved, the size is reduced, the structural rigidity, the response speed, the resonant frequency and the heat dissipation performance are improved, and meanwhile, a routing method for heterogeneously integrating the micro-motion platform and the CMOS chip is provided.
Owner:BEIJING INST OF TECH

Micro-electromechanical sensor and manufacturing method thereof

The present invention discloses a microelectromechanical sensor and a manufacturing method thereof. The microelectromechanical sensor comprises: a buried layer including multiple first elevated regions; multiple detection electrodes and multiple wiring electrodes located on the buried layer, the multiple detection electrodes respectively covering the multiple first elevated regions; a torsion pendulum arm located above the multiple detection electrodes and the multiple wiring electrodes, the torsion pendulum arm, the multiple detection electrodes, and the multiple wiring electrodes not contacting each other; a torsion pendulum and multiple movable torsion pendulum blocks located above the torsion pendulum arm, the multiple movable torsion pendulum blocks connected to the torsion pendulum via the torsion pendulum arm, the multiple movable torsion pendulum blocks and the torsion pendulum arm forming a movable structure; multiple fixed electrodes located above the torsion pendulum arm; a supporting wall located on the buried layer, and a protective wall located on the supporting wall, the supporting wall and the protective wall enclosing a cavity, wherein the movable structure, the torsion pendulum, the multiple detection electrodes, the multiple wiring electrodes, and the multiple fixed electrodes are located in the cavity. Embodiments of the present invention improve the sensitivity of the microelectromechanical sensor and alleviate the problem of the movable structure fracturing under impact.
Owner:HANGZHOU SILAN INTEGRATED CIRCUIT +1

A three-axis accelerometer

The present invention provides a three-axis accelerometer, which includes: a Z-axis accelerometer, which includes a Z mass block, a Z mass block anchor point, and a torsion beam. The Z mass block is defined with a first space, a second space, and a third space, and the Z mass block anchor point is located in the third space; the torsion beam is located in the third space and is placed parallel to the Y axis, and the torsion beam connects the Z mass block anchor point and the Z mass block; the mass of the Z mass block on one side of the torsion beam is different from the mass of the Z mass block on the other side of the torsion beam, so that the Z mass block moves like a seesaw with the torsion beam as the axis; an X-axis accelerometer, which is located in the first space; and a Y-axis accelerometer, which is located in the second space. Compared with the prior art, the three-axis accelerometer provided by the present invention has a reasonable and compact overall structure, which can save chip area and reduce costs. In addition, under the same area, the sensitivity of the Z-axis accelerometer with an extended frame is high.
Owner:MEMSIC SEMICON WUXI

MEMS device and preparation method thereof

The invention relates to the technical field of semiconductor manufacturing, in particular to an MEMS device and a preparation method thereof.The MEMS device comprises a substrate, a device layer and a cap sealing layer which are sequentially adjacent in the first direction; the substrate internally comprises cavity grooves and supporting columns which are alternately arranged in the second direction. The cap sealing layer comprises a substrate and a plurality of semiconductor columns penetrating through the substrate in the first direction, and the semiconductor columns and the substrate are isolated through isolation rings surrounding the semiconductor columns; the device layer comprises a first driving electrode, a first movable driving comb tooth, a first beam, a first anchor point, a second beam, a first movable detection comb tooth and a first detection electrode which are sequentially arranged along a second direction; the first movable drive comb is connected with the first anchor point via the first beam. At least one MEMS device which is excellent in electrical isolation performance, good in thermal matching and high in electromechanical transformation sensitivity can be provided, and signal crosstalk caused by overlarge stray capacitance is avoided while vertical interconnection leading-out of multiple paths of independent signals is achieved.
Owner:PEKING UNIV

MEMS Device

The present application discloses a MEMS device comprising a proof mass, an anchor, a main suspension, and a flexible stopper. The main suspension respectively connects to the proof mass and the anchor at both ends thereof. An end of the flexible stopper is connected to the anchor, and another end of the flexible stopper extends toward the proof mass. Thereby, the present application reduces the impact of adding the flexible stopper on the proof mass, maintaining the sensing sensitivity of the MEMS device.
Owner:SENSORTEK TECH

Electro-actuated devices for ultra-lubricated interface sliding, microelectromechanical system (MEMS) drive devices, MEMS and electro-actuated sliding methods

This application discloses an electro-actuated device for superlubricated interface sliding, a microelectromechanical system (MEMS) drive device, a MEMS, and an electro-actuated sliding method, belonging to the field of MEMS technology. The electro-actuated device for superlubricated interface sliding provided by this invention includes a superlubricated van der Waals heterojunction, a first metal electrode, and a second metal electrode. The superlubricated van der Waals heterojunction includes a two-dimensional material platform with a conductive two-dimensional material layer on its surface, and a movable two-dimensional material stacked on the surface of the two-dimensional material platform. The lattice constant of the conductive two-dimensional material layer differs from that of the movable two-dimensional material by more than 1.8%. The electro-actuated device for superlubricated interface sliding provided by this invention can achieve nanoscale movement, and the frictional force during electro-actuated sliding is close to zero, effectively improving the sensitivity, accuracy, and service life of the MEMS drive device and MEMS based on it.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

METHOD FOR PRODUCING AN ARRANGEMENT OF AT LEAST TWO ION TRAP CHIPS AND ARRANGEMENT

Method for producing an arrangement (1) of at least two ion trap chips, comprising a first ion trap chip (25) and a second ion trap chip (26), with - Providing a holder (2) having a first main surface (5) with a first region (3) and a second region (4), - arranging a first transparent layer (22) on which the first ion trap chip (25) is arranged on the first region (3), - providing a second transparent layer (23) on which the second ion trap chip (26) is arranged in the second region (4), - aligning the first ion trap chip (25) and the second ion trap chip (26) in the vertical direction so that the main extension planes of the first ion trap chip (25) and the second ion trap chip (26) extend within a common plane (27) extending in lateral directions, - providing a spacer layer (12) with a predetermined thickness in the vertical direction depending on the orientation, - arranging the spacer layer (12) on the second region (4), - Arranging the second transparent layer (23) on the spacer layer (12) such that the main extension planes of the first ion trap chip (25) and the second ion trap chip (26) extend within the common plane (27).
Owner:ELEQTRON GMBH