71results about "Movable microstructural devices" patented technology

The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.

The invention relates to an element (100) for use in a micro-electro-mechanical system (200), in particular for use in semiconductor technology equipment, and to a micro-electro-mechanical system (200) comprising such an element (100). The element (100) comprises a MEMS structure (101) and at least one coating (140) applied over a large area to designated partial surfaces (135, 155) of the MEMS structure (101) from one side of the element (100), wherein the MEMS structure (100) has at least one otherwise non-functional special shape (160) with which at least a continuous parasitic coating (145) is avoided for certain areas away from the designated partial surfaces (135, 155).

The invention relates to a micro-electro-mechanically movable element (103) for use in a micro-electro-mechanical system (100) and a corresponding micro-electro-mechanical system (100), in particular for use in semiconductor technology equipment. The micro-electro-mechanically movable element (103) comprises a base plate (104) on the side of which facing away from the base structure (101) a mirror plate (105) with a curvature geometry is arranged, wherein the mirror plate (105) is connected to the base plate (104) via a pedestal (106), wherein the geometry of the contact points (107, 108) between pedestal (106) and mirror plate (105) as well as between pedestal (106) and base plate (104) are different. The micro-electro-mechanical system (100) comprises an element (103) that is micro-electro-mechanically movable at least in at least one degree of freedom relative to a basic structure (101) by at least one actuator (102), wherein the micro-electro-mechanically movable element (103) is designed according to the invention.

A micromechanical z-acceleration sensor. The sensor has a substrate with a main extension plane, and a micromechanical rocker which is arranged parallel to the extension plane above the substrate and can be tilted in a first direction z perpendicular to the extension plane, wherein the rocker in a first partial region: has first perforations, which extend through the rocker in the first direction z, with a first cross-section parallel to the main extension plane with a first aspect ratio of at least 1:1; and has second perforations, which extend through the rocker in the first direction z, with a second cross-section with a second aspect ratio of a longer side to a shorter side, wherein the first aspect ratio is smaller than the second aspect ratio. A first perforation and a second perforation are arranged alternately next to one another in a repeating pattern.

The invention discloses an electrical counter based on a super-smooth homojunction interface and a counting method, and relates to the technical field of micro-nano electromechanical systems (MEMS / NEMS). Comprising a base part, a rotatable part, a first layered material layer, a second layered material layer and a measuring and processing system, and the rotatable part can rotate relative to the base part; the measuring and processing system is electrically connected to the first layer of layered material and the second layer of layered material and is configured to: monitor a change in a resistance value across the homojunction interface during the rotational motion; identifying a characteristic reduction of the resistance value; outputting a count signal based on the identification of the characterization reduction; the beneficial effects of the invention are that the scheme utilizes the intrinsic physical effect of the lattice of the layered material at a specific rotation angle to realize a novel counting sensing mechanism which is high in precision, high in signal-to-noise ratio and extremely easy to miniaturize.

The invention relates to a MEMS component (10) having a movable surface (12) mounted on a cover surface (18) which executes a deflection or tilting movement (40) about a pivot point (60, 140) by means of an electrostatic drive (48) comprising movable electrodes (24) and fixed electrodes (36). The cover surface (18) is connected to a base surface (38) by means of at least one spring arrangement (28). Arranged between the cover surface (18) and the base surface (38) is at least one resilient stop structure (50, 70) or, viewed in the radial extension (138), a stop cascade (110) comprising a plurality of resilient stop structures (50, 120, 122, 124). These dampen the deflection or tilting movement (40) of the cover surface (18).

The invention relates to the technical field of semiconductor manufacturing, in particular to an MEMS device and a preparation method thereof.The MEMS device comprises a substrate, a device layer and a cap sealing layer which are sequentially adjacent in the first direction; the substrate internally comprises cavity grooves and supporting columns which are alternately arranged in the second direction. The cap sealing layer comprises a substrate and a plurality of semiconductor columns penetrating through the substrate in the first direction, and the semiconductor columns and the substrate are isolated through isolation rings surrounding the semiconductor columns; the device layer comprises a first driving electrode, a first movable driving comb tooth, a first beam, a first anchor point, a second beam, a first movable detection comb tooth and a first detection electrode which are sequentially arranged along a second direction; the first movable drive comb is connected with the first anchor point via the first beam. At least one MEMS device which is excellent in electrical isolation performance, good in thermal matching and high in electromechanical transformation sensitivity can be provided, and signal crosstalk caused by overlarge stray capacitance is avoided while vertical interconnection leading-out of multiple paths of independent signals is achieved.

This application discloses an electro-actuated device for superlubricated interface sliding, a microelectromechanical system (MEMS) drive device, a MEMS, and an electro-actuated sliding method, belonging to the field of MEMS technology. The electro-actuated device for superlubricated interface sliding provided by this invention includes a superlubricated van der Waals heterojunction, a first metal electrode, and a second metal electrode. The superlubricated van der Waals heterojunction includes a two-dimensional material platform with a conductive two-dimensional material layer on its surface, and a movable two-dimensional material stacked on the surface of the two-dimensional material platform. The lattice constant of the conductive two-dimensional material layer differs from that of the movable two-dimensional material by more than 1.8%. The electro-actuated device for superlubricated interface sliding provided by this invention can achieve nanoscale movement, and the frictional force during electro-actuated sliding is close to zero, effectively improving the sensitivity, accuracy, and service life of the MEMS drive device and MEMS based on it.

A microelectromechanical device comprising a mobile rotor in a silicon wafer. The rotor comprises one or more high-density regions. The one or more high-density regions in the rotor comprise at least one high-density material which has a higher density than silicon. The one or more high-density regions have been formed in the silicon wafer by filling one or more fill trenches in the rotor with the at least one high-density material. The one or more fill trenches have a depth / width aspect ratio of at least 10, and the one or more fill trenches have been filled by depositing the high-density material into the fill trenches in an atomic layer deposition (ALD) process.

A MEMS device is provided. The MEMS device includes a stator that encompasses a recess. Additionally, the MEMS device includes a rotor that is positioned within the recess and configured to oscillate around an oscillation axis. The rotor comprises first rotor electrodes that are toothed to first stator electrodes, and second rotor electrodes that are toothed to second stator electrodes. The first and second stator electrodes are located on opposite sides of the recess. The MEMS device further includes a drive circuit configured to apply electrical potentials to the first and second stator electrodes. When the rotor is in a rest position, the drive circuit is configured to generate the electrical potentials to apply a non-zero torque to the rotor, initiating oscillation of the rotor around the oscillation axis.

Microelectromechanical system (MEMS) inertial sensors exhibiting reduced parasitic capacitance are described. The reduction in parasitic capacitance can be achieved by forming localized regions of thick dielectric material. These localized regions can be formed inside a trench. Forming the trench can increase the vertical separation between a sense capacitor and a substrate, thereby reducing the parasitic capacitance of the region. A fixed electrode of the sense capacitor can be placed between the proof mass and the trench. The trench can be filled with a dielectric material. In some cases, a portion of the trench can be filled with air, thereby further reducing the parasitic capacitance. These MEMS inertial sensors can be used as accelerometers and / or gyroscopes in other types of inertial sensors. Fabricating these trenches can involve lateral oxidation, whereby a column of semiconductor material is oxidized.

Embodiments of the present disclosure provide a method, system and comb structure for manufacturing a micro-electro-mechanical system comb structure. The method comprises forming a fixed member blank plate and a movable member blank plate of the comb structure respectively, wherein the fixed member blank plate comprises a fixed member substrate and fixed member combs; and the movable member blank plate comprises a movable member riveting portion and movable member combs; inserting the movable member blank plate on the fixed member blank plate in a direction perpendicular to the fixed member blank plate, so that the fixed member combs and the movable member combs are arranged in intervals; and fixing the movable member riveting portion to the fixed member substrate to form the comb structure. According to the method of the embodiments of the present disclosure, the depth-width ratio of the comb structure can be higher than that of the comb structure manufactured by the traditional manufacturing method, and the consistency of the gap between the combs is ensured, thereby improving the performance of the comb structure.

The invention relates to a micromechanical switch with a movable micromechanical switching element (10), a first contact pair (100) for switching a first electrical line (101) with a first electrical contact (110) arranged on the movable micromechanical switching element, and a second electrical contact (120), wherein the movable micromechanical switching element and the first contact pair are arranged in a hermetically sealed cavity (20). The core of the invention consists in the fact that a getter (30) is arranged in the cavity.

The application discloses a kind of structural superlubricity devices of edge compression buckling, it is related to structural superlubricity technical field, including superlubricity sheet, the edge of two-dimensional material in the superlubricity sheet buckles to the direction of superlubricity surface, and the contact surface area of superlubricity surface is horizontal plane.The structural superlubricity device in the application includes superlubricity sheet, and the edge of two-dimensional material of superlubricity sheet buckles to the direction of superlubricity surface, i.e.the edge part is lifted to a certain height, to avoid the contact between the edge of two-dimensional material of superlubricity sheet and substrate, greatly reduce the friction between superlubricity sheet and substrate, avoid producing abrasion.Meanwhile, the contact area of superlubricity surface of superlubricity sheet is horizontal plane, so that the contact between superlubricity sheet and substrate is surface contact, rather than point contact, to avoid stress concentration, can stably bear higher load, while facilitating the movement of superlubricity sheet by electric signal control.The application also provides a kind of preparation method with the above advantages.

This device (1) a propulsion element (2) comprising at least one part (20) capable of expanding / contracting deformation along a main axis (X2) connecting a front part (21) and a rear part (23); - at least two guide elements (3, 5, 7) adapted to generate a rotation of the propulsion element (2) around a first and a second rotation axis, respectively, transverse to each other and to the main axis (X2) of the propulsion element, under the influence of an energy supply; a control unit (9) configured to actuate the rotation of the propulsion element (2) about at least one axis transverse to the main axis (X2) in coordination with the deformation of the deformable element (20) of the propulsion element (2) extending / retracting along the main axis (X2); Equipped with.

The present disclosure relates to early collision out-of-plane motion limiters for microelectromechanical devices. A microelectromechanical device includes a movable rotor and a fixed stator located in a device plane and a motion limiter that prevents the movable rotor from coming into contact with a fixed wall in a vertical direction perpendicular to the device plane. The motion limiter extends between the rotor and the stator and includes a stopper bar that is rotatable out of the device plane.

The invention relates to an electromechanical system (2) comprising: - a frame (10); - a movable element; - capacitive measuring or actuation means (15') comprising a movable electrode (152) and at least one fixed electrode, called a counter electrode, the movable electrode (152) comprising a membrane (152a) and a membrane stiffening structure (152b); - a motion transmission device (14') between the movable element and the movable electrode (152), the transmission device being rotationally mobile relative to the frame (10) by means of a plurality of pivot joints (16); and - elastic means connected to the movable electrode (152) and configured to generate an elastic force that opposes the motion of the movable electrode (152); the stiffening structure (152b) of the mobile electrode (152) being integral with the transmission device (14') and anchored to the transmission device at the level of at least part of the pivot joints (16).

The application provides a MEMS actuating structure and a preparation process thereof, and relates to the technical field of micro-electro-mechanical systems. The MEMS actuating structure comprises a fixed part, a moving part and decoupling beams. The fixed part and the moving part are arranged in an integrated structure, the fixed part is arranged at the periphery of the moving part, and a certain gap is formed between the fixed part and the moving part. The moving part comprises an array structure for providing driving force. The decoupling beams are arranged in the gap between the fixed part and the moving part. Each decoupling beam is provided with at least one corner. The decoupling beams are of a layered structure. The decoupling beams are provided with conductive lines. The conductive lines connect the fixed part and the moving part. The technical scheme framework is less and the structure is integrated. The overall structural strength is higher, and there is no need for late assembly. The conductive lines are arranged in the decoupling beams, so that physical collision between the lines is avoided, damage is reduced, and the service life is longer.

The invention relates to a micromechanical component comprising a substrate and a working element movable relative to the substrate. The movable working element extends planarly in a first direction of extension and in a second direction of extension that is linearly independent of the first direction of extension. In a third direction of extension that is linearly independent of both the first and second directions of extension, the movable working element has a smaller dimension than in the first and / or the second direction of extension. The micromechanical component further comprises a limiting element. The limiting element restricts movement of the working element in at least one of the directions of extension, in particular movement in the third direction of extension. The limiting element is connected to the substrate and has a limiting section.The boundary section is positioned between two work element structures with respect to the first direction of extension. The work element structures are connected via a contact element. The contact element is positioned at a distance from the boundary section with respect to the third direction of extension.

This invention discloses a photodynamic micro / nano motor based on metal particles. It involves superimposing two laser beams onto a metal particle on a support platform without a built-in track, driving the particle to rotate around the center of the laser beam. This invention utilizes localized surface plasmon resonance of the metal under light irradiation to achieve off-axis balance and orbital rotation of the particle across the beam cross-section. This results in an ultra-small subwavelength orbital rotation radius and significantly increases the rotational speed of the particle, thus realizing an ultra-small, high-speed photodynamic micro / nano motor.

The application discloses a structure super-smooth device with stress-driven edge warping, relates to the technical field of super-smoothness, and comprises a super-smooth sheet, wherein the edges of a two-dimensional material in the super-smooth sheet are warped in a direction away from a super-smooth surface; and a film layer arranged on the entire area of a preset surface of the super-smooth sheet, wherein the film layer produces volume shrinkage and thermal stress under annealing conditions to make the edges of the super-smooth sheet warp, and the preset surface is opposite to the super-smooth surface. It can be seen that the structure super-smooth device in the application comprises the super-smooth sheet and the film layer, the film layer is arranged on the entire area of the preset surface of the super-smooth sheet, the film layer can produce volume shrinkage and thermal stress under annealing conditions, so that the edges of the super-smooth sheet are warped, that is, the edges are lifted to a certain height, thereby avoiding the contact between the edges of the super-smooth sheet and a substrate, greatly reducing the friction between the super-smooth sheet and the substrate, and avoiding abrasion. In addition, the application also provides a preparation method with the above advantages.

An electrical connecting element (100) is proposed.The electrical connecting element (100) comprises at least one first conductor structure (13), wherein the first conductor structure (13) has at least one first dielectric support element (12) and at least two electrically insulated, electrically conductive structures (13a, 13b), at least one first shaped body (10) produced by an additive microstructuring process, wherein the first shaped body (10) is attached to the first conductor structure (13) and comprises at least one first joining and connecting element (15), at least one second conductor structure (23), wherein the second conductor structure (23) has at least one second dielectric support element (22) and at least two electrically insulated, electrically conductive structures (23a, 23b), at least one second shaped body (20), wherein the second shaped body (20) is attached to the second conductor structure (23) and comprises at least one second joining and connecting element (25).The first and second joining and connecting elements (15, 25) are designed such that a positive-locking, separable connection between the at least one first shaped body (10) and the at least one second shaped body (20) can be formed by joining and, in particular, interlocking the first and second joining and connecting elements (15, 25) along a joining path, that an electrical contact is formed between the at least one first conductor structure (13) and the at least one second conductor structure (23) during the formation of the positive-locking connection, and that a physical contact between the first conductor structure (13) and the second conductor structure (23) is formed only during a predetermined portion of the joining path. Furthermore, a method for producing an electrical connecting element (100) is proposed.

The invention discloses a sliding texture sensor based on laser direct writing and a microstructure and a preparation method thereof, and belongs to the technical field of sliding sensing sensors. The sliding texture sensor comprises a substrate layer and a copper-plated pattern layer, wherein the substrate layer is of a three-dimensional structure with convex structures distributed on the surface; and the copper-plated pattern layer is formed on the side surface of the convex structure, is positioned in an area which is 30-80% of the height of the convex structure, and is obtained by carrying out laser etching by adopting a laser direct writing technology and then carrying out chemical copper plating growth. According to the invention, the light-activated catalyst is doped in the substrate layer, and after the light-activated catalyst is activated by laser, the light-activated catalyst and the chemical plating solution are subjected to a replacement reaction, so that the preparation of the copper layer on the substrate layer with the convex structure is realized, and the perception capability and the conductivity of the bionic skin are enhanced; protruding structures distributed in a controllable sliding sensing mode are distributed on the surface of the substrate layer, the protruding structures can be bent and deformed during sliding, then measured resistance is changed, and sliding sensing is achieved.

The application discloses a MEMS-based in-plane three-axis large displacement actuating platform and a manufacturing method thereof, mainly comprising an outer frame, a cross island frame, a bidirectional comb-shaped driving unit, a long spring beam and a short spring beam, and manufacturing steps comprise: using magnetic neutral loop discharge plasma (NLD) to anisotropically etch a cavity structure on a glass substrate, using an anode bonding process to bond a BF33 glass wafer with the cavity structure and a low-resistance silicon wafer, thinning the low-resistance silicon wafer, deep silicon etching (DRIE) the low-resistance silicon wafer to form an electrically isolated channel and fill BCB material, using a chemical mechanical polishing (CMP) process to remove the BCB on the surface of the low-resistance silicon wafer, sputtering a metal layer and using a lift-off process to form a wire layer, and deep silicon etching (DRIE) the low-resistance silicon wafer to form a final device. The application has the beneficial effects of improving device filling rate, reducing size, improving structural stiffness, response speed, resonance frequency and heat dissipation performance, and simultaneously providing a wire bonding method for heterogeneously integrating a micro moving platform and a CMOS chip.

A microfluidic device for forming multicellular constructs of selected shapes. The microfluidic device comprises a bottom layer including a plurality of isolated open molds of selected shapes each having a top opening and a hydrophobic surface. The microfluidic device also comprises a top layer including a fluid channel extending from an inlet to an outlet, the fluid channel including an open channel having a bottom opening, the top layer slidably coupled to the bottom layer and movable among a plurality of positions relative to the bottom layer. The one of the plurality of positions, the top opening of the microfluidics device may be uncovered by the top layer to allow selective removal of a multicellular construct formed in the open mold having a selected shape from the open mold through the top opening.

The invention relates to a capacitive microsensor (10) for measuring an ambient quantity, comprising a sensor unit (12) with at least one first measuring capacitance (M1) that varies depending on the ambient quantity and a fixed first reference capacitance (R1), an electrical control circuit (16) that supplies the sensor unit (12) with at least one electrical input voltage (14) and processes at least one electrical first output potential (S1) of the sensor unit (12) that depends on the first measuring capacitance (M1), the control circuit being configured to electrically connect the sensor unit (12) for measuring the ambient quantity in a sensor switching configuration (18), wherein the first output potential (S1) is further dependent on at least one first stray capacitance (P1, P2), and wherein the control circuit (16) has at least one additional reference capacitance (C).wherein the additional reference capacitance (C) can be electrically connected to the first measuring capacitance (M1) and the first reference capacitance (R1) in at least one first measuring switching configuration (28) that differs from the sensor switching configuration (18). Furthermore, the invention relates to a method for determining the capacitance of the capacitive microsensor (10).