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109results about "Movable microstructural devices" patented technology

MEMS pressure sensor, manufacturing method thereof and electronic device

The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.
Owner:CHINA RESOURCES MICROELECTRONICS HLDG LTD

Optical probe and method for its manufacture

The invention relates to an optical probe (1) which is designed for optical coupling to at least one micro-optical component (50) and to a method for its production, wherein the optical probe (1) comprises: - a probe head (10); - at least one micro-optical element (20) having a mechanical connection to the probe head (10) and configured to establish an optical coupling to the at least one micro-optical component (50); and - at least one sensor structure (21) separate from the at least one micro-optical element (20) and configured to generate a sensor signal (40) indicating a positioning of the probe head (10) relative to an object (100).
Owner:KEYSTONE PHOTONICS GMBH

Three-axis angular rate sensor with a substrate and a double rotor

A three-axis angular rate sensor with a substrate and a A double rotor is proposed, wherein the double rotor has a first and a second rotor (1, 2) which are elastically connected to one another via a first coupling element (8) in such a way that the two rotors (1, 2) can be excited to antiphase torsional vibrations, wherein the first rotor (1) has a first and a second second seismic mass (3, 4) which are mounted so as to be deflectable relative to the first rotor (1) and the second rotor (2) has a third and a fourth seismic mass (5, 6) which are mounted so as to be deflectable relative to the second rotor (2), wherein the first mass (3) is connected to the third mass (5) via a first rocker element (9) is connected in such a way that the third mass (5) at a lateral deflection of the first mass (3) is deflected in an opposite lateral direction, wherein the second mass (4) is connected to the fourth mass (6) via a second rocker element (9') such that the fourth mass (6) is deflected in an opposite lateral direction upon a lateral deflection of the second mass (4).
Owner:ROBERT BOSCH GMBH

Element for use in a micro-electro-mechanical system and micro-electro-mechanical system

The invention relates to an element (100) for use in a micro-electro-mechanical system (200), in particular for use in semiconductor technology equipment, and to a micro-electro-mechanical system (200) comprising such an element (100). The element (100) comprises a MEMS structure (101) and at least one coating (140) applied over a large area to designated partial surfaces (135, 155) of the MEMS structure (101) from one side of the element (100), wherein the MEMS structure (100) has at least one otherwise non-functional special shape (160) with which at least a continuous parasitic coating (145) is avoided for certain areas away from the designated partial surfaces (135, 155).
Owner:CARL ZEISS SMT GMBH

Micro-electro-mechanically movable element and system

The invention relates to a micro-electro-mechanically movable element (103) for use in a micro-electro-mechanical system (100) and a corresponding micro-electro-mechanical system (100), in particular for use in semiconductor technology equipment. The micro-electro-mechanically movable element (103) comprises a base plate (104) on the side of which facing away from the base structure (101) a mirror plate (105) with a curvature geometry is arranged, wherein the mirror plate (105) is connected to the base plate (104) via a pedestal (106), wherein the geometry of the contact points (107, 108) between pedestal (106) and mirror plate (105) as well as between pedestal (106) and base plate (104) are different. The micro-electro-mechanical system (100) comprises an element (103) that is micro-electro-mechanically movable at least in at least one degree of freedom relative to a basic structure (101) by at least one actuator (102), wherein the micro-electro-mechanically movable element (103) is designed according to the invention.
Owner:CARL ZEISS SMT GMBH

Micro-electromechanical system switch configured for high current and high power

PendingUS20250210282A1Circuit-breaking switches for excess currentsProtective switches using micromechanics
High voltage microelectromechanical systems (MEMS) switches are described. The MEMS switches can be actively opened and closed. The switch can include a beam coupled to an anchor on a substrate by one or more hinges. The switch can include control electrodes, disposed on a surface of the substrate, for electrically controlling the beam. The anchor is asymmetrically positioned with respect to the two ends of the beam and is electrically connected to a middle electrode. A stopper serves as a pivot point during actuation of the switch to reduce the mechanical stress on the hinges.
Owner:ANALOG DEVICES INT UNLTD CO

Three-axis rotation rate sensor with a substrate and a double rotor

A three-axis rotation rate sensor. The sensor includes a substrate and a double rotor including a first rotor and a second rotor elastically connected to each other via a first coupling element such that the two rotors are excitable to antiphase rotary oscillations, the first rotor including a first and a second seismic mass, which are deflectably mounted vis-à-vis the first rotor and the second rotor includes a third and a fourth seismic mass, which are deflectably mounted vis-à-vis the second rotor, the first mass being connected to the third mass via a first rocker element such that the third mass is deflected in an opposite lateral direction upon a lateral deflection of the first mass, the second mass being connected to the fourth mass via a second rocker element such that the fourth mass is deflected in an opposite lateral direction upon lateral deflection of the second mass.
Owner:ROBERT BOSCH GMBH

Circuit breaker circuitry with micro-electromechanical systems switch

PendingUS20250210295A1Protective switches using micromechanicsEmergency protective arrangements for limiting excess voltage/current
Circuit breakers based on micro-electromechanical systems (MEMS) switches are described. A high voltage MEMS teeter-totter switch can include a beam coupled to an anchor on a substrate and two control electrodes, disposed on a surface of the substrate. A control voltage applied on one of the control electrodes with respect to a first reference voltage puts one of the two ends of the beam in electric contact with one of two contact electrodes of the MEMS teeter-totter switch to electrical connected two terminals of a circuit breaker. The input voltage is applied on the beam with respect to a second reference voltage different from the first reference voltage. A MEMS teeter-totter switch network comprises a plurality of MEMS teeter-totter switches configured to switch high voltage and high current between the two terminals of the circuit breaker.
Owner:ANALOG DEVICES INT UNLTD CO

Electrical counter based on super-smooth homojunction interface and counting method

The invention discloses an electrical counter based on a super-smooth homojunction interface and a counting method, and relates to the technical field of micro-nano electromechanical systems (MEMS / NEMS). Comprising a base part, a rotatable part, a first layered material layer, a second layered material layer and a measuring and processing system, and the rotatable part can rotate relative to the base part; the measuring and processing system is electrically connected to the first layer of layered material and the second layer of layered material and is configured to: monitor a change in a resistance value across the homojunction interface during the rotational motion; identifying a characteristic reduction of the resistance value; outputting a count signal based on the identification of the characterization reduction; the beneficial effects of the invention are that the scheme utilizes the intrinsic physical effect of the lattice of the layered material at a specific rotation angle to realize a novel counting sensing mechanism which is high in precision, high in signal-to-noise ratio and extremely easy to miniaturize.
Owner:RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN +1

Large-deflection cantilever beam actuating structure

A large-deflection cantilever beam actuating structure disclosed by the present invention comprises an actuating module, a reflector and a supporting module, the reflector is fixedly installed at the upper end of the supporting module, and a driving element is arranged on the actuating module. The actuating module comprises a twisting plate fixedly connected with the supporting module and a plurality of actuators connected with the twisting plate, and the driving ends, connected with the twisting plate, of the actuators are asymmetrically arranged on the two sides of a rotating shaft L of the twisting plate. By means of the mode, the large-angle deflection can be achieved, meanwhile, the large-angle deflection device has the advantages of being small in size, high in integration degree, easy to machine and high in yield, and can be matched with reflectors of different sizes.
Owner:SHANGHAI MAIKAI TECHNOLOGY CO LTD

Micro-electromechanical sensor and manufacturing method thereof

The present invention discloses a microelectromechanical sensor and a manufacturing method thereof. The microelectromechanical sensor comprises: a buried layer including multiple first elevated regions; multiple detection electrodes and multiple wiring electrodes located on the buried layer, the multiple detection electrodes respectively covering the multiple first elevated regions; a torsion pendulum arm located above the multiple detection electrodes and the multiple wiring electrodes, the torsion pendulum arm, the multiple detection electrodes, and the multiple wiring electrodes not contacting each other; a torsion pendulum and multiple movable torsion pendulum blocks located above the torsion pendulum arm, the multiple movable torsion pendulum blocks connected to the torsion pendulum via the torsion pendulum arm, the multiple movable torsion pendulum blocks and the torsion pendulum arm forming a movable structure; multiple fixed electrodes located above the torsion pendulum arm; a supporting wall located on the buried layer, and a protective wall located on the supporting wall, the supporting wall and the protective wall enclosing a cavity, wherein the movable structure, the torsion pendulum, the multiple detection electrodes, the multiple wiring electrodes, and the multiple fixed electrodes are located in the cavity. Embodiments of the present invention improve the sensitivity of the microelectromechanical sensor and alleviate the problem of the movable structure fracturing under impact.
Owner:HANGZHOU SILAN INTEGRATED CIRCUIT +1

MEMS device and preparation method thereof

The invention relates to the technical field of semiconductor manufacturing, in particular to an MEMS device and a preparation method thereof.The MEMS device comprises a substrate, a device layer and a cap sealing layer which are sequentially adjacent in the first direction; the substrate internally comprises cavity grooves and supporting columns which are alternately arranged in the second direction. The cap sealing layer comprises a substrate and a plurality of semiconductor columns penetrating through the substrate in the first direction, and the semiconductor columns and the substrate are isolated through isolation rings surrounding the semiconductor columns; the device layer comprises a first driving electrode, a first movable driving comb tooth, a first beam, a first anchor point, a second beam, a first movable detection comb tooth and a first detection electrode which are sequentially arranged along a second direction; the first movable drive comb is connected with the first anchor point via the first beam. At least one MEMS device which is excellent in electrical isolation performance, good in thermal matching and high in electromechanical transformation sensitivity can be provided, and signal crosstalk caused by overlarge stray capacitance is avoided while vertical interconnection leading-out of multiple paths of independent signals is achieved.
Owner:PEKING UNIV

MEMS Device

The present application discloses a MEMS device comprising a proof mass, an anchor, a main suspension, and a flexible stopper. The main suspension respectively connects to the proof mass and the anchor at both ends thereof. An end of the flexible stopper is connected to the anchor, and another end of the flexible stopper extends toward the proof mass. Thereby, the present application reduces the impact of adding the flexible stopper on the proof mass, maintaining the sensing sensitivity of the MEMS device.
Owner:SENSORTEK TECH

Electro-actuated devices for ultra-lubricated interface sliding, microelectromechanical system (MEMS) drive devices, MEMS and electro-actuated sliding methods

This application discloses an electro-actuated device for superlubricated interface sliding, a microelectromechanical system (MEMS) drive device, a MEMS, and an electro-actuated sliding method, belonging to the field of MEMS technology. The electro-actuated device for superlubricated interface sliding provided by this invention includes a superlubricated van der Waals heterojunction, a first metal electrode, and a second metal electrode. The superlubricated van der Waals heterojunction includes a two-dimensional material platform with a conductive two-dimensional material layer on its surface, and a movable two-dimensional material stacked on the surface of the two-dimensional material platform. The lattice constant of the conductive two-dimensional material layer differs from that of the movable two-dimensional material by more than 1.8%. The electro-actuated device for superlubricated interface sliding provided by this invention can achieve nanoscale movement, and the frictional force during electro-actuated sliding is close to zero, effectively improving the sensitivity, accuracy, and service life of the MEMS drive device and MEMS based on it.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

METHOD FOR PRODUCING AN ARRANGEMENT OF AT LEAST TWO ION TRAP CHIPS AND ARRANGEMENT

Method for producing an arrangement (1) of at least two ion trap chips, comprising a first ion trap chip (25) and a second ion trap chip (26), with - Providing a holder (2) having a first main surface (5) with a first region (3) and a second region (4), - arranging a first transparent layer (22) on which the first ion trap chip (25) is arranged on the first region (3), - providing a second transparent layer (23) on which the second ion trap chip (26) is arranged in the second region (4), - aligning the first ion trap chip (25) and the second ion trap chip (26) in the vertical direction so that the main extension planes of the first ion trap chip (25) and the second ion trap chip (26) extend within a common plane (27) extending in lateral directions, - providing a spacer layer (12) with a predetermined thickness in the vertical direction depending on the orientation, - arranging the spacer layer (12) on the second region (4), - Arranging the second transparent layer (23) on the spacer layer (12) such that the main extension planes of the first ion trap chip (25) and the second ion trap chip (26) extend within the common plane (27).
Owner:ELEQTRON GMBH

MEMS element with increased density

A microelectromechanical device comprising a mobile rotor in a silicon wafer. The rotor comprises one or more high-density regions. The one or more high-density regions in the rotor comprise at least one high-density material which has a higher density than silicon. The one or more high-density regions have been formed in the silicon wafer by filling one or more fill trenches in the rotor with the at least one high-density material. The one or more fill trenches have a depth / width aspect ratio of at least 10, and the one or more fill trenches have been filled by depositing the high-density material into the fill trenches in an atomic layer deposition (ALD) process.
Owner:MURATA MFG CO LTD

MEMS device and method for characterizing a MEMS device

A MEMS device is provided. The MEMS device includes a stator that encompasses a recess. Additionally, the MEMS device includes a rotor that is positioned within the recess and configured to oscillate around an oscillation axis. The rotor comprises first rotor electrodes that are toothed to first stator electrodes, and second rotor electrodes that are toothed to second stator electrodes. The first and second stator electrodes are located on opposite sides of the recess. The MEMS device further includes a drive circuit configured to apply electrical potentials to the first and second stator electrodes. When the rotor is in a rest position, the drive circuit is configured to generate the electrical potentials to apply a non-zero torque to the rotor, initiating oscillation of the rotor around the oscillation axis.
Owner:INFINEON TECHNOLOGIES AG

Large-deflection cantilever beam actuating structure

A large-deflection cantilever beam actuating structure disclosed by the present invention comprises a reflector (1), a supporting module (2) and an actuating module (3), the reflector (1) is fixedly installed at the upper end of the supporting module (2), and the actuating module (3) comprises an inner actuating assembly (31) enabling the reflector (1) to rotate around a rotating shaft Y and an outer actuating assembly (32) enabling the reflector (1) to rotate around a rotating shaft X, a driving element (33) is arranged on the actuating module (3), when the structure is not actuated, the rotating shaft Y and the rotating shaft X are located on the same plane and are perpendicularly arranged, and the supporting module (2) is installed at the intersection position of the rotating shaft Y and the rotating shaft X of the actuating module (3). By means of the mode, the large-angle deflection device adopts double shafts without mutual interference, can achieve large-angle deflection, has the advantages of being small in size, high in integration degree and high in finished product rate, and can be matched with reflectors of different sizes.
Owner:SHANGHAI MAIKAI TECHNOLOGY CO LTD

Low parasitic capacitance mems inertial sensor and related methods

Microelectromechanical system (MEMS) inertial sensors exhibiting reduced parasitic capacitance are described. The reduction in parasitic capacitance can be achieved by forming localized regions of thick dielectric material. These localized regions can be formed inside a trench. Forming the trench can increase the vertical separation between a sense capacitor and a substrate, thereby reducing the parasitic capacitance of the region. A fixed electrode of the sense capacitor can be placed between the proof mass and the trench. The trench can be filled with a dielectric material. In some cases, a portion of the trench can be filled with air, thereby further reducing the parasitic capacitance. These MEMS inertial sensors can be used as accelerometers and / or gyroscopes in other types of inertial sensors. Fabricating these trenches can involve lateral oxidation, whereby a column of semiconductor material is oxidized.
Owner:ANALOG DEVICES INC

Methods, systems, and comb structures for fabricating microelectromechanical system comb structures

Embodiments of the present disclosure provide a method, system and comb structure for manufacturing a micro-electro-mechanical system comb structure. The method comprises forming a fixed member blank plate and a movable member blank plate of the comb structure respectively, wherein the fixed member blank plate comprises a fixed member substrate and fixed member combs; and the movable member blank plate comprises a movable member riveting portion and movable member combs; inserting the movable member blank plate on the fixed member blank plate in a direction perpendicular to the fixed member blank plate, so that the fixed member combs and the movable member combs are arranged in intervals; and fixing the movable member riveting portion to the fixed member substrate to form the comb structure. According to the method of the embodiments of the present disclosure, the depth-width ratio of the comb structure can be higher than that of the comb structure manufactured by the traditional manufacturing method, and the consistency of the gap between the combs is ensured, thereby improving the performance of the comb structure.
Owner:HUAWEI TECH CO LTD

An edge-compressed buckling structure super-slip device and a preparation method thereof

The application discloses a kind of structural superlubricity devices of edge compression buckling, it is related to structural superlubricity technical field, including superlubricity sheet, the edge of two-dimensional material in the superlubricity sheet buckles to the direction of superlubricity surface, and the contact surface area of superlubricity surface is horizontal plane.The structural superlubricity device in the application includes superlubricity sheet, and the edge of two-dimensional material of superlubricity sheet buckles to the direction of superlubricity surface, i.e.the edge part is lifted to a certain height, to avoid the contact between the edge of two-dimensional material of superlubricity sheet and substrate, greatly reduce the friction between superlubricity sheet and substrate, avoid producing abrasion.Meanwhile, the contact area of superlubricity surface of superlubricity sheet is horizontal plane, so that the contact between superlubricity sheet and substrate is surface contact, rather than point contact, to avoid stress concentration, can stably bear higher load, while facilitating the movement of superlubricity sheet by electric signal control.The application also provides a kind of preparation method with the above advantages.
Owner:RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN +1

Early impact out-of-plane motion limiter for microelectromechanical devices

The present disclosure relates to early collision out-of-plane motion limiters for microelectromechanical devices. A microelectromechanical device includes a movable rotor and a fixed stator located in a device plane and a motion limiter that prevents the movable rotor from coming into contact with a fixed wall in a vertical direction perpendicular to the device plane. The motion limiter extends between the rotor and the stator and includes a stopper bar that is rotatable out of the device plane.
Owner:MURATA MFG CO LTD