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Bionic flexible force sensor and preparation method thereof

A flexible force and sensor technology, applied in the direction of instruments, relays, measuring force, etc., can solve the problems of complex manufacturing and processing, and achieve the effect of increasing the contact area, improving sensitivity and high repeatability

Active Publication Date: 2019-10-15
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the sensitivity of triboelectric sensors, specific microstructures are usually processed on the surface of materials by micro-nano-processing methods, but the manufacturing process is extremely complicated.

Method used

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  • Bionic flexible force sensor and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0036] see figure 1 and figure 2 , The preparation method of the bionic flexible force sensor provided by the present invention, the preparation method mainly includes the bionic structure inversion process, silver nanowire spraying process, reactive ion etching process, device packaging process and so on. Among them, the bionic structure inversion process is used to replicate the microstructure of the leaf surface of Arrowroot velvet leaf. Through two inversions, the microstructure can be completely and effectively replicated; the silver nanowire spraying process is mainly used to prepare triboelectrodes, signal The back electrode and the shielding layer electrode are drawn out; the reactive ion etching process is mainly used to prepare a hydrophobic surface during the secondary inversion process of the leaf surface microstructure, which is convenient for the demoulding process after the inversion; the device packaging process is mainly used for the force sensor. assembly p...

Embodiment 1

[0061] The preparation method of the bionic flexible force sensor provided by Embodiment 1 of the present invention mainly includes the following steps:

[0062] (1) Rinse the velvet arrowroot leaves with deionized water for 2 minutes, and then blow dry the surface with nitrogen; then, blow the glass slides clean with nitrogen, and stick 3M double-sided adhesive on the glass slides, and cover the front of the leaves Apply face up to the slide, then cut off the excess, and blow the surface dust off again with nitrogen.

[0063] (2) Mix the polydimethylsiloxane prepolymer and the curing agent according to the mass ratio of 10:1, stir for 5 minutes, and then put the obtained mixture into a vacuum box with a vacuum degree of -0.1 MPa to evacuate 20 minutes to remove air bubbles from the mixture. Among them, polydimethylsiloxane adopts the Sylgard184 model of Dow Corning Company.

[0064] (3) Draw 9.4ml of polydimethylsiloxane with a syringe, inject the polydimethylsiloxane on th...

Embodiment 2

[0076] The preparation method of the bionic flexible force sensor provided by Embodiment 2 of the present invention mainly includes the following steps:

[0077] S1, rinse the velvet arrowroot leaves with deionized water for 2 minutes, and then blow dry the surface with nitrogen; then, blow the glass slides clean with nitrogen, and stick 3M double-sided adhesive on the glass slides, and put the leaves facing Stick it on the glass slide, then cut off the excess part, and blow off the dust on the surface again with nitrogen gas.

[0078] S2, stir the polydimethylsiloxane prepolymer and the curing agent according to the mass ratio of 10:1 for 5 minutes, and then put the obtained mixture into a vacuum box with a vacuum degree of -0.1 MPa for 20 minutes to remove air bubbles. Among them, polydimethylsiloxane adopts the Sylgard 184 model of Dow Corning Company.

[0079] S3, draw 9.4ml of polydimethylsiloxane with a syringe and inject it on the glass slide with velvet arrowroot lea...

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Abstract

The invention belongs to the related technical field of flexible electronics, and discloses a bionic flexible force sensor and a preparation method thereof, the method comprises the following steps: (1) preparing a flexible substrate through a reverse mold technology, and forming a bionic microstructure on the surface of the flexible substrate; (2) preparing a layer of silver nanowire and a layerof micro hair on the bionic microstructures of the two flexible substrates respectively, and preparing a shielding layer and a negative friction layer back electrode on the surfaces, opposite to the surface where the bionic microjunctions are located, of the two corresponding flexible substrates respectively, so as to obtain a positive friction layer and a negative friction layer; and (3) packaging the positive friction layer and the negative friction layer to form a flexible force sensor, wherein the bionic microstructure of the positive friction layer and the bionic microstructure of the negative friction layer are interlocked to form interlocking. According to the invention, a complex micro-nano manufacturing process is avoided, the flow is simplified, the process is simple, and the implementation is easy.

Description

technical field [0001] The invention belongs to the technical field related to flexible electronics, and more specifically relates to a bionic flexible force sensor and a preparation method thereof. Background technique [0002] With the development of the Internet of Things and robot technology, human beings put forward higher requirements for human-computer interaction, which promotes the birth and rapid development of flexible electronic technology. This technology plays an important role in electronic skin, human-computer interaction interface, physiological signal detection, etc. role. Compared with traditional silicon-based electronics, flexible electronics have excellent adaptability on different kinds of substrates (soft, hard, flat, curved). With this unique advantage, a large number of flexible electronic products have been broken through and various applications have been developed, such as light-emitting diodes, batteries, antennas, and sensors. [0003] A flex...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81B5/00B82Y40/00G01L1/00
CPCB81C1/00134B81C1/00698B81B5/00B82Y40/00G01L1/005
Inventor 吴豪姚果李洋洋
Owner HUAZHONG UNIV OF SCI & TECH
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