Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof

A technology of acceleration sensor and structural capacitance, applied in the direction of measurement of acceleration, microstructure device composed of elements that move relative to each other, velocity/acceleration/shock measurement, etc., can solve the problems of large cross-sensitivity, large output, etc.

Active Publication Date: 2010-10-13
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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Problems solved by technology

But usually the elastic beam of this structure is not in the same plane as the center of the sensitive mass, which will cau

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  • Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof
  • Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof
  • Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof

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Embodiment Construction

[0042] The following examples illustrate the substantive characteristics and remarkable progress of the micro-acceleration sensor and its manufacturing method involved in the present invention, but the present invention is by no means limited to the examples described.

[0043] Such as figure 1 As shown in (a) and (b), one end of the combined elastic beam structure 1 is connected to the middle of the side of the central mass 2 , and the other end is connected to the external support frame 3 . That is to say, one end of the L beam in the composite elastic beam is connected to the center or any position of the external support frame 3, one end of the straight elastic beam is connected to the middle of the frame beam, and the other end of the straight elastic beam is located in the center of the side of the central mass block 2; Such as figure 2 As shown in (a) and (b), one end of the straight elastic beam in the combined elastic beam structure 1 is connected to one top end of ...

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Abstract

The invention relates to a capacitive micro-acceleration sensor with a symmetrically combined elastic beam structure and a production method thereof. The acceleration sensor comprises a symmetric center mass block, an external support frame, eight symmetric straight beams, two symmetric frame beams, a combined elastic beam structure, an upper cover plate and a lower cover plate, wherein the eight symmetric straight beams are used for connecting the center mass block with the external support frame, and the combined elastic beam structure is formed by connecting eight symmetric L-shaped beams together; and the other end of each straight elastic beam connected with the frame beams is connected to the middle or a vertex angle at the top end and the bottom end of the lateral face of the center mass block, and the other end of each L-shaped beam connected with the frame beams is connected to the inner side face of the external support frame. The acceleration sensor adopts the combined elastic beam structure which is formed by connecting the symmetric straight beams, the frame beams and the L-shaped beams together, has high symmetry and can remarkably reduce the cross-sensitivity of the sensor; and the sensor is produced by adopting a microelectronic mechanical system technology and is the capacitive micro-acceleration sensor with high sensitivity.

Description

technical field [0001] The invention relates to a capacitive micro-acceleration sensor with a symmetrical composite elastic beam structure, which belongs to the field of micro-electromechanical systems. Background technique [0002] The development of MEMS has greatly promoted the progress of sensor technology and realized the miniaturization of acceleration sensors. The capacitive acceleration sensor made by micromachining technology has advantages in measurement accuracy, temperature characteristics, closed-loop measurement and self-inspection using electrostatic force, and easy integration with electronic circuits. It can be widely used in oil exploration, earthquake monitoring, and medical treatment. Instruments, aerospace, weaponry and many other fields have broad market application prospects. [0003] Common micromechanical acceleration sensors are mainly divided into three types based on the sensitive principle: piezoresistive, piezoelectric and capacitive. The basi...

Claims

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Application Information

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IPC IPC(8): G01P15/125B81B5/00B81C3/00
Inventor 车录锋李伟孙腾肖育华王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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