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Light element device and method for manufacturing same

A technology for light-emitting components and manufacturing methods, which is applied to electrical components, electrical solid-state devices, semiconductor devices, etc., and can solve problems such as failure, overflow light-emitting diodes, and extrusion of bonding layers.

Active Publication Date: 2009-02-04
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the bonding of the solder layer will cause the molten bonding layer to extrude and even overflow to the side wall of the light-emitting diode due to the bonding and pressing, causing the p-n semiconductor layer of the light-emitting stack to be short-circuited and causing the component to fail

Method used

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  • Light element device and method for manufacturing same
  • Light element device and method for manufacturing same
  • Light element device and method for manufacturing same

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Embodiment Construction

[0022] Please refer to Figure 3A The light-emitting device according to the present invention includes a light-emitting diode 40 and a base unit 50. The light emitting diode 40 includes a transparent substrate 41 whose material is, for example, Al 2 O 3 , GaN, glass, GaP, SiC, or CVD diamond; the first contact layer 42 is formed on the transparent substrate 41, the first contact layer 42 has a first area a and a second area b; the light-emitting stack 43 is substantially formed on the first A first area a and a second area b on a contact layer 42. The light emitting stack includes a first electrical type semiconductor layer 431, an active layer 432, and a second electrical type semiconductor layer 433 in sequence. The layer 43 emits light when driven by voltage, and its material can be red, yellow, or green light (Al z Ga 1-z ) 0.5 In 0.5 P quaternary series, or Al that emits blue or purple light x In y Ga (1-x-y) N gallium nitride series; the second contact layer 44 corresponds ...

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Abstract

The invention discloses a luminous element and a fabrication method thereof. The luminous element comprises a luminous diode and a pedestal; wherein the luminous diode is composed of electrodes and a junction layer formed on the electrodes, and the pedestal comprises a junction pad and a plurality of lug bosses and / or pits which are formed on the junction pad. The method for fabricating the luminous diode includes the following steps: providing a luminous diode which has electrodes and a junction layer which is arranged on the electrodes; providing a pedestal which comprises at least a junction pad; forming a plurality lug bosses and / or pits on the junction pad; and jointing the luminous diode and the pedestal.

Description

Technical field [0001] The present invention relates to a light-emitting element and a manufacturing method thereof. Background technique [0002] In the application of light emitting diodes (Light Emitting Diodes; LEDs) in high-power lighting applications, in addition to continuing to increase the brightness, heat dissipation is another major issue that needs to be resolved. When the light extraction efficiency of the light emitting diode is not good, the light that cannot pass through the light emitting element (the light emitting diode and its package) will be converted into heat energy. If the heat energy cannot be effectively conducted out of the light-emitting element, the temperature of the light-emitting diode will rise during operation, thus causing reliability problems of the element. In the prior art, many methods have been proposed to solve the heat dissipation problem of components. For example, in the growth of gallium nitride series light-emitting diodes on sapphir...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L23/488H01L23/498H01L33/62
CPCH01L2924/0002H01L2224/73257H01L2224/48463
Inventor 林锦源
Owner EPISTAR CORP
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