13results about How to "Improve bonding yield" patented technology

The invention relates to an epitaxial layer transfer method and a manufacturing method of a light-emitting chip, and the epitaxial layer transfer method of the light-emitting chip comprises the steps: forming a semi-solid first etching type glue layer on a bearing substrate, and forming a semi-solid second etching type glue layer on an epitaxial layer borne by a substrate; the thickness of at least one of the first etching type adhesive layer and the second etching type adhesive layer is reduced through etching; the first etching type adhesive layer and the second etching type adhesive layer which are subjected to the thinning treatment are subjected to alignment press fit; and removing the substrate. The etching type adhesive layer can be etched to any required thickness by controlling the etching rate and the etching time, so that the etching type adhesive layer which is thin enough can be manufactured. Bonding is carried out after the etching type adhesive layer is thinned, the overall thickness of a bonding layer formed after the first etching type adhesive layer and the second etching type adhesive layer are pressed can be reduced, laser stripping in the follow-up manufacturing process is facilitated, residues of the adhesive layers on the light-emitting face of the light-emitting chip can be reduced, and the light-emitting effect of the light-emitting chip is optimized.

The invention discloses a matching and laminating method for a silicon-based OLED (Organic Light Emitting Diode) product. The matching and laminating method comprises the following steps of: a primary sorting step: sorting a wafer and a color film CF which are subjected to the same level judgment into a same front open type wafer transfer box Foup; an intelligent matching step: carrying out weight calculation on the overlapped graph of the Wafer Map and the CF Map, and matching an optimal CF through Fop matching and Slot layer matching by taking the Wafer as a reference; and a secondary sorting step: according to the Slot of the Wafer in the Fop, adjusting the Slot of the matched CF in the Fop to ensure that the Slot of the Wafer and the Slot of the CF in the Fop are consistent, and obtaining the matching information of the Wafer and the CF. The method has the advantages that matching between the wafer and the color film CF in silicon-based OLED production is achieved in an intelligent matching mode, matching is more accurate and reliable, the attaching yield can be increased, and production efficiency is improved.

The vacuum laminating clamp comprises a plastic film, a bottom plate, a TP, two OCAs and two TFTs, a sealing plate is arranged on the plastic film; the clamp comprises a base plate, a clamp body is arranged on the base plate, a plurality of hollow grooves are formed in the clamp body, a plurality of threaded holes are formed in one side of the clamp body, and a sealing ring is arranged in the clamp body. According to the vacuum attaching clamp, the TFT, the OCA and the TP can be arranged at the top of the clamp through the design of the size and the shape between the clamp and the TFT, the OCA and the TP, and the TP, the OCA and the TFT between the clamp and the plastic film can be located in a sealed structure through the hollow groove, the threaded hole and the sealing ring which are arranged on the clamp and the sealing plate designed on the plastic film. And meanwhile, bubbles generated during lamination are eliminated through vacuum of the vacuum cavity, so that the aim of greatly increasing the lamination yield is fulfilled.

The utility model discloses magnetic traction roller laminating equipment which comprises a rack and further comprises a jig positioning and adjusting mechanism, a threading assembly mechanism, a stretching mechanism and an electromagnet traction mechanism, the jig positioning and adjusting mechanism is used for positioning and clamping a surrounding screen and adjusting the position of the surrounding screen in the X direction, and the threading assembly mechanism comprises a fixed roller. The stretching mechanism is used for fixing, stretching and guiding the protective film, the end of the protective film is in lap joint with the fixed rolling wheel, and the electromagnet traction mechanism is used for attaching the protective film in place to the surrounding screen. According to the device, all the mechanisms are matched with one another, it is guaranteed that the protective film can be accurately and tightly attached to the surrounding screen, the position and height can be accurately controlled, the automation degree and efficiency of the attaching process are high, the attaching quality can be guaranteed, and therefore the attaching yield of surrounding screen products is increased, and meanwhile the production efficiency is improved.

A display device is provided. The display device includes: a substrate; a pixel electrode disposed on the substrate; a light emitting element disposed on the pixel electrode and including a first semiconductor layer, a second semiconductor layer, and an active layer interposed between the first semiconductor layer and the second semiconductor layer; a connection electrode provided between the pixel electrode and the light emitting element; an adhesive layer disposed between the connection electrode and the pixel electrode; and a common electrode disposed on the light emitting element. The first semiconductor layer includes a body portion adjacent to the active layer and a support portion protruding from the body portion toward the pixel electrode, and the adhesive layer overlaps the support portion of the first semiconductor layer in a horizontal direction of the substrate.

The invention relates to a display substrate, a preparation method and a display device, and relates to the technical field of display, the display substrate comprises an array substrate, and an electrode layer and a light-emitting function layer which are sequentially arranged on the array substrate, the electrode layer comprises electrode units distributed in an array, and electrodes of the electrode units comprise a first layer structure electrically connected with the array substrate; a second layer structure located on the outer peripheral side of the first layer structure; the third-layer structure is located on the side, away from the array substrate, of the first-layer structure and electrically connected with the light-emitting functional layer. The second-layer structure blocks the third-layer structure which is melted into the liquid state, and connection of two adjacent electrodes is avoided, so that electrode short circuit is avoided, and the bonding yield is improved.

The invention discloses a MicroLED micro display device and a preparation method thereof. The preparation method comprises the following steps: providing a driving substrate and a plurality of first epitaxial wafers emitting first color light; patterning the first epitaxial wafer to form a plurality of first epitaxial partitions which are distributed at intervals and have epitaxial structures; the first epitaxial wafer is cut to form a plurality of first epitaxial sub-wafers with preset shapes, and each first epitaxial sub-wafer is provided with a plurality of first epitaxial partitions; bonding the plurality of first epitaxial sub-wafers on a driving substrate in sequence to form a first bonding wafer; and processing and forming a plurality of first light-emitting units which are provided with epitaxial structures and are separated from one another on the first bonding sheet. The wafer reconstruction technology is adopted, a large-size driving substrate does not need to be cut, small-size monochromatic epitaxial wafers are processed into epitaxial sub-wafers, then the epitaxial sub-wafers are bonded to the driving substrate one by one, the epitaxial sub-wafers are fully paved to the maximum extent, invalid waste of driving substrate materials is avoided, and the auxiliary material cost and the overall production cost are remarkably reduced.

The utility model discloses a kind of holding unit and bonding equipment, belong to the technical field of semiconductor material processing equipment. Holding unit includes holding assembly and connecting assembly. Holding assembly includes first holding piece and second holding piece of laminated arrangement, first holding piece includes first side and second side, first side is set back to second holding piece and is configured to be used to carry semiconductor material, second side is set to second holding piece and is configured to be used to receive external force. Second holding piece includes a through region, the through region satisfies that external force can be applied to the second side of first holding piece, and second holding piece is used to connect external driving assembly. Connecting assembly is used to connect first holding piece and second holding piece, elastic piece is configured as when external force is applied to the second side of first holding piece, elastic piece is in compression tendency to reduce the force that connecting assembly conducts to second holding piece. The utility model can reduce the possibility that pressurizing equipment causes influence to moving mechanism, improve bonding yield.

The invention relates to the technical field of display, and particularly discloses a display panel, a flexible circuit board and a display device.The display panel comprises a first binding area, the first binding area comprises at least one row of multiple first binding pads arranged in the first direction, and the width of the first binding pads in the first direction is larger than the length of the first binding pads in the second direction; the first binding area comprises a first center datum line, the first center datum line extends in the second direction, the first binding bonding pads arranged in each row are symmetrical about the first center datum line, and the widths of the multiple first binding bonding pads, located on the same side of the first center datum line, in each row of first binding bonding pads are gradually increased in the first direction. The first binding pads in the display panel are transversely arranged, and the width of the first binding pads farther from the first center datum line in the first direction is larger, so that the size of the first binding pads in the first direction can be increased, alignment binding of the display panel and the flexible circuit board is facilitated, and the binding yield is improved.

The utility model discloses an automatic laminating device of OCA optical adhesive and glass cover plate, including the lamination unit of connection in rack carrier platform, CG feeding unit and OCA feeding unit, and CG feeding unit includes CG feeding manipulator, CG transfer platform and the CG cleaning sub -unit of setting in the below of CG feeding manipulator, and OCA feeding unit includes OCA stock bin, OCA feeding manipulator, OCA transfer platform and the OCA cleaning sub -unit of setting in the above of OCA transfer platform, and lamination unit includes laminating lower platform, laminating upper platform and OCA transfer manipulator. The scheme of this application, from the feeding supply and dust cleaning treatment of glass cover plate, to the feeding supply and dust cleaning treatment of OCA optical adhesive, to the mutual lamination of OCA optical adhesive and glass cover plate and the discharge and feeding of next process, all realize automation, thereby improve the lamination efficiency and lamination yield of OCA optical adhesive and glass cover plate, and further improve the production efficiency of liquid crystal display screen.

The invention provides a chip atom magnetometer gas chamber integration method and a chip atom magnetometer atomic gas chamber, and the method comprises the steps: 1, precisely placing one end of a glass tube shell on the surface of a first silicon wafer according to an overlay mark, and placing the glass tube shell in anodic bonding equipment for anodic bonding; step 2, filling the glass tube shell subjected to anodic bonding in the step 1 with an alkali metal compound; step 3, carrying out anodic bonding on the other end of the glass tube shell and a second silicon wafer, and simultaneously vacuumizing an inner cavity of the glass tube shell to ensure a vacuum environment of an air chamber; 4, heating the bonded silicon wafer at a set temperature for reaction, and completing release of the alkali metal and the nitrogen buffer gas in the gas chamber; and step 5, performing laser scribing on the first silicon wafer and the second silicon wafer according to the overlay mark to complete scribing separation of the atom magnetometer gas chamber. According to the technical scheme, the technical problem that the application range of the atom magnetometer is limited due to the fact that the meter head of the atom magnetometer is large in size in the prior art is solved.

The present application discloses a heterogeneous thin film wafer and a preparation method, wherein a heterogeneous thin film wafer comprises a substrate layer and a volume expansion layer located on the substrate layer, wherein the volume expansion layer is used to form a structure protruding toward the bonding surface when the wafer is bonded; the bonding surface direction refers to the direction in which the volume expansion layer is away from the substrate layer; an isolation layer is provided on the side of the volume expansion layer away from the substrate layer, and the isolation layer is used to strengthen the bonding strength when the wafer is bonded; a functional film layer is provided on the side of the isolation layer away from the volume expansion layer, and the functional film layer is used to prepare devices and chips; a stress compensation layer is provided on the side of the substrate layer away from the volume expansion layer, and the stress compensation layer is used to improve the morphology of the wafer. The heterogeneous thin film wafer realizes that the wafer contacts from the middle point during the bonding process and then gradually expands to the surrounding areas, thereby improving the bonding yield. At the same time, by adjusting the thickness of the stress compensation layer, the curvature and warpage of the wafer are close to 0, thereby improving the morphology of the wafer.

The invention discloses an optical adjustment device, method and system, and the device comprises a display module which comprises a display module and a first backlight module which is assembled with the display module after a testing stage; the display module comprises a plurality of display partitions; the first backlight module comprises a plurality of first backlight subareas, the first backlight subareas provide backlight for the display subareas, and the first backlight module is used for adjusting backlight parameters of the first backlight subareas according to backlight compensation data, provided by the display module, of at least one display subarea after assembly is completed. In the invention, after backlight assembly, a display module provides backlight compensation data corresponding to a display partition to a first backlight module; during actual display, the first backlight module controls the first backlight subarea to provide the compensated backlight, accurate adjustment of the backlight of each display subarea is achieved, the display color cast condition of the display module is effectively improved, the display effect of the display module is improved, and the product attaching yield is increased.