29results about How to "Improve bonding yield" patented technology

The invention relates to the technical field of adhesives, in particular to a dual-curing UV tackifying adhesive and a product thereof. The dual-curing UV tackifying adhesive is prepared from the following components in parts by weight: 73 to 92 parts of acrylate copolymer, 6 to 25 parts of UV polyester resin, 0.4 to 1.7 parts of thermal curing agent and 0.3 to 1 part of photoinitiator. According to the dual-curing UV tackifying adhesive disclosed by the invention, the components are compounded, so that the adhesive can be endowed with relatively low and appropriate bonding strength in a thermocuring stage, the bonding and positioning requirements are met, and the dual-curing UV tackifying adhesive can be stripped from an adhered object and has excellent reworkability; and after positioning, the bonding force between the adhesive and the pasted object is increased through UV illumination, so that the pasting effect of the adhesive on the pasted object is ensured.

The invention relates to the technical field of semiconductors, in particular to a power semiconductor manufacturing method, which comprises the following steps of: S100, bonding a pin frame on a DBC (Direct Bonding Copper) board by utilizing ultrasonic energy of an ultrasonic terminal bonding machine; a plurality of pins are arranged on the pin frame; s200, carrying out a push-pull force test on the DBC board; s300, carrying out static electricity removal and purging treatment on the DBC board; s400, mounting a plurality of chips on the DBC board, and bonding metal wires between the DBC board and the chips and between the chips to form electric connection between the DBC board and the chips and electric connection between the chips; s500, performing glue pouring treatment on the chip and the metal wire on the DBC board, and performing curing treatment on the DBC board; and S600, performing rib cutting treatment on the DBC board. By adopting the scheme, the influence of thermal stress generated by high temperature during chip welding on the pin bonding area can be avoided, and the product power pin bonding yield is improved.

The invention relates to an epitaxial layer transfer method and a manufacturing method of a light-emitting chip, and the epitaxial layer transfer method of the light-emitting chip comprises the steps: forming a semi-solid first etching type glue layer on a bearing substrate, and forming a semi-solid second etching type glue layer on an epitaxial layer borne by a substrate; the thickness of at least one of the first etching type adhesive layer and the second etching type adhesive layer is reduced through etching; the first etching type adhesive layer and the second etching type adhesive layer which are subjected to the thinning treatment are subjected to alignment press fit; and removing the substrate. The etching type adhesive layer can be etched to any required thickness by controlling the etching rate and the etching time, so that the etching type adhesive layer which is thin enough can be manufactured. Bonding is carried out after the etching type adhesive layer is thinned, the overall thickness of a bonding layer formed after the first etching type adhesive layer and the second etching type adhesive layer are pressed can be reduced, laser stripping in the follow-up manufacturing process is facilitated, residues of the adhesive layers on the light-emitting face of the light-emitting chip can be reduced, and the light-emitting effect of the light-emitting chip is optimized.

The invention provides a display panel which comprises a first substrate, a second substrate, a liquid crystal layer, a first polaroid, a second polaroid and a circuit board. The first substrate is provided with a display area and a bonding area outside the display area. The second substrate is overlapped with the first substrate, and the bonding area of the first substrate is exposed. The liquid crystal layer is arranged between the first substrate and the second substrate and overlaps the display area. The first polaroid is arranged on the surface, away from the second substrate, of the first substrate. The second polaroid is arranged on the surface, away from the first substrate, of the second substrate. The circuit board is bonded to the bonding area of the first substrate. The first side wall, facing the joint area, of the second substrate is tangent and flush with the second side wall, facing the joint area, of the second polaroid. The invention also provides a manufacturing method of the display panel.

The present invention discloses a hot melt adhesive film for laminating a four-sided curved display screen, including a laminating unit, wherein the laminating unit has a reserved cutout, and the reserved cutout is located at the four corners of the laminating unit. The hot melt adhesive film for laminating a four-sided curved display screen in the present invention can reduce wrinkles of the laminating unit at the corners of the display screen and avoid glue overflow at the corners of the display screen by setting reserved cutouts at the four corners of the laminating unit, and can avoid glue overflow at the corners of the display screen. The laminating unit in a molten state can automatically flow to the reserved cutout and fill the reserved cutout in other areas, thereby improving the laminating flatness and laminating yield of the display screen at the reserved cutout, and optimizing the display effect of the four-sided curved display screen.

The invention discloses a lithium niobate / lithium tantalate bonding method, and belongs to the technical field of single crystal thin film preparation. The method comprises the following steps: obtaining a lithium niobate / lithium tantalate slide and a substrate slide; the single-side surface of at least one of the lithium niobate / lithium tantalate slide and the substrate slide is uniformly covered with bonding glue; and aligning the lithium niobate / lithium tantalate slide with the substrate slide, positioning the bonding glue between the lithium niobate / lithium tantalate slide and the substrate slide, vacuumizing, pressurizing, defoaming and fixing, and irradiating the photoresist by using a light source to perform photochemical reaction to complete bonding. The problems of warping, fragmentation and the like of lithium niobate / lithium tantalate caused by high temperature and high pressure in a traditional hot gluing bonding process are solved, the bonding yield is improved, meanwhile, the process time is shortened, the energy consumption is reduced, the cost is reduced, and a reliable technical scheme is provided for batch preparation of large-size single crystal lithium niobate / lithium tantalate films.

The invention discloses a matching and laminating method for a silicon-based OLED (Organic Light Emitting Diode) product. The matching and laminating method comprises the following steps of: a primary sorting step: sorting a wafer and a color film CF which are subjected to the same level judgment into a same front open type wafer transfer box Foup; an intelligent matching step: carrying out weight calculation on the overlapped graph of the Wafer Map and the CF Map, and matching an optimal CF through Fop matching and Slot layer matching by taking the Wafer as a reference; and a secondary sorting step: according to the Slot of the Wafer in the Fop, adjusting the Slot of the matched CF in the Fop to ensure that the Slot of the Wafer and the Slot of the CF in the Fop are consistent, and obtaining the matching information of the Wafer and the CF. The method has the advantages that matching between the wafer and the color film CF in silicon-based OLED production is achieved in an intelligent matching mode, matching is more accurate and reliable, the attaching yield can be increased, and production efficiency is improved.

The embodiment of the invention provides a display device and a supporting assembly, the display device is provided with a plane area and a bending area located on at least one side of the plane area, and the display device comprises the supporting assembly which comprises a supporting layer and a first bonding layer which are arranged in a mutually stacked mode; the display panel is arranged on the side, away from the supporting layer, of the first bonding layer, the supporting assembly and the display panel both extend to the bending area from the plane area, a notch is formed in the supporting layer, and the notch is located in the bending area. The supporting layer is provided with the notch located in the bending area, by arranging the notch, the rigidity of the position, where the notch is located, of the supporting layer can be reduced, bending deformation of the supporting layer according to the bending requirement is facilitated, and the attaching yield of the supporting layer and the display panel in the bending area is improved.

The vacuum laminating clamp comprises a plastic film, a bottom plate, a TP, two OCAs and two TFTs, a sealing plate is arranged on the plastic film; the clamp comprises a base plate, a clamp body is arranged on the base plate, a plurality of hollow grooves are formed in the clamp body, a plurality of threaded holes are formed in one side of the clamp body, and a sealing ring is arranged in the clamp body. According to the vacuum attaching clamp, the TFT, the OCA and the TP can be arranged at the top of the clamp through the design of the size and the shape between the clamp and the TFT, the OCA and the TP, and the TP, the OCA and the TFT between the clamp and the plastic film can be located in a sealed structure through the hollow groove, the threaded hole and the sealing ring which are arranged on the clamp and the sealing plate designed on the plastic film. And meanwhile, bubbles generated during lamination are eliminated through vacuum of the vacuum cavity, so that the aim of greatly increasing the lamination yield is fulfilled.

The utility model provides a special-shaped cover plate limiting structure, which comprises a special-shaped cover plate body, a bearing sheet and a double-sided adhesive tape, the bearing sheet is adhered to a first surface of the special-shaped cover plate body through the double-sided adhesive tape, and the size of the bearing sheet at least can completely cover the special-shaped cover plate body. Thus, the fitting fixture with the structure is used for limiting the special-shaped cover plate, limiting according to the actual shape of the special-shaped cover plate body is not needed, limiting is only needed according to the shape of the bearing piece, the manufacturing difficulty of the fitting fixture is reduced, the fitting precision is improved, after fitting is completed, a fitting semi-finished product is separated from the bearing piece, and a fitting finished product can be obtained. And the laminating yield is improved.

The utility model discloses magnetic traction roller laminating equipment which comprises a rack and further comprises a jig positioning and adjusting mechanism, a threading assembly mechanism, a stretching mechanism and an electromagnet traction mechanism, the jig positioning and adjusting mechanism is used for positioning and clamping a surrounding screen and adjusting the position of the surrounding screen in the X direction, and the threading assembly mechanism comprises a fixed roller. The stretching mechanism is used for fixing, stretching and guiding the protective film, the end of the protective film is in lap joint with the fixed rolling wheel, and the electromagnet traction mechanism is used for attaching the protective film in place to the surrounding screen. According to the device, all the mechanisms are matched with one another, it is guaranteed that the protective film can be accurately and tightly attached to the surrounding screen, the position and height can be accurately controlled, the automation degree and efficiency of the attaching process are high, the attaching quality can be guaranteed, and therefore the attaching yield of surrounding screen products is increased, and meanwhile the production efficiency is improved.

A display device is provided. The display device includes: a substrate; a pixel electrode disposed on the substrate; a light emitting element disposed on the pixel electrode and including a first semiconductor layer, a second semiconductor layer, and an active layer interposed between the first semiconductor layer and the second semiconductor layer; a connection electrode provided between the pixel electrode and the light emitting element; an adhesive layer disposed between the connection electrode and the pixel electrode; and a common electrode disposed on the light emitting element. The first semiconductor layer includes a body portion adjacent to the active layer and a support portion protruding from the body portion toward the pixel electrode, and the adhesive layer overlaps the support portion of the first semiconductor layer in a horizontal direction of the substrate.

The invention relates to a display substrate, a preparation method and a display device, and relates to the technical field of display, the display substrate comprises an array substrate, and an electrode layer and a light-emitting function layer which are sequentially arranged on the array substrate, the electrode layer comprises electrode units distributed in an array, and electrodes of the electrode units comprise a first layer structure electrically connected with the array substrate; a second layer structure located on the outer peripheral side of the first layer structure; the third-layer structure is located on the side, away from the array substrate, of the first-layer structure and electrically connected with the light-emitting functional layer. The second-layer structure blocks the third-layer structure which is melted into the liquid state, and connection of two adjacent electrodes is avoided, so that electrode short circuit is avoided, and the bonding yield is improved.

The invention discloses a MicroLED micro display device and a preparation method thereof. The preparation method comprises the following steps: providing a driving substrate and a plurality of first epitaxial wafers emitting first color light; patterning the first epitaxial wafer to form a plurality of first epitaxial partitions which are distributed at intervals and have epitaxial structures; the first epitaxial wafer is cut to form a plurality of first epitaxial sub-wafers with preset shapes, and each first epitaxial sub-wafer is provided with a plurality of first epitaxial partitions; bonding the plurality of first epitaxial sub-wafers on a driving substrate in sequence to form a first bonding wafer; and processing and forming a plurality of first light-emitting units which are provided with epitaxial structures and are separated from one another on the first bonding sheet. The wafer reconstruction technology is adopted, a large-size driving substrate does not need to be cut, small-size monochromatic epitaxial wafers are processed into epitaxial sub-wafers, then the epitaxial sub-wafers are bonded to the driving substrate one by one, the epitaxial sub-wafers are fully paved to the maximum extent, invalid waste of driving substrate materials is avoided, and the auxiliary material cost and the overall production cost are remarkably reduced.

The present invention provides a chip-on-film packaging structure, comprising a flexible circuit carrier and a chip. The flexible circuit carrier comprises a flexible substrate and a circuit structure. The circuit structure is arranged on the flexible substrate and comprises a plurality of first pins, a plurality of second pins and at least one dummy pin. The first pin is arranged on the first surface of the flexible substrate and comprises a plurality of inner pin portions located in a chip bonding area. The second pin and the dummy pin are arranged on the second surface of the flexible substrate. The dummy pin extends into the chip bonding area. The chip comprises a plurality of bumps respectively connected to the inner pin portions and at least one dummy bump. The dummy pin extends along a first direction and divides the width of the orthographic projection of the dummy bump on the flexible substrate in a second direction perpendicular to the first direction within an allowable tolerance. The chip-on-film packaging structure of the present invention can provide confirmation of alignment during pin bonding and pin offset after bonding, so as to improve the reliability of the packaging structure.

The utility model discloses a kind of holding unit and bonding equipment, belong to the technical field of semiconductor material processing equipment. Holding unit includes holding assembly and connecting assembly. Holding assembly includes first holding piece and second holding piece of laminated arrangement, first holding piece includes first side and second side, first side is set back to second holding piece and is configured to be used to carry semiconductor material, second side is set to second holding piece and is configured to be used to receive external force. Second holding piece includes a through region, the through region satisfies that external force can be applied to the second side of first holding piece, and second holding piece is used to connect external driving assembly. Connecting assembly is used to connect first holding piece and second holding piece, elastic piece is configured as when external force is applied to the second side of first holding piece, elastic piece is in compression tendency to reduce the force that connecting assembly conducts to second holding piece. The utility model can reduce the possibility that pressurizing equipment causes influence to moving mechanism, improve bonding yield.

The invention relates to a display panel and a display device. The display panel comprises a driving substrate, a conductive adhesive layer and a light-emitting chip. The conductive adhesive layer is arranged on one side of the driving substrate and at least comprises a first adhesive layer, the first adhesive layer comprises conductive particles, and a guide groove is formed in the side, away from the driving substrate, of the first adhesive layer; the light-emitting chip is arranged on the side, away from the driving substrate, of the conductive adhesive layer, the light-emitting chip and the guide groove are arranged in an aligned mode, and at least the electric contact portion of the light-emitting chip and the first adhesive layer is contained in the guide groove. According to the display panel and the display device, the problem of chip deviation occurring when a light-emitting chip is bonded through a conductive adhesive in the prior art can be effectively solved, and the bonding yield of the light-emitting chip is increased.

The utility model discloses a structure for reducing visual foreign matters of a transparent product. The structure comprises a touch panel, an atomization film and a liquid crystal display panel, the touch panel comprises a glass cover plate, an upper optical adhesive layer, an upper electrode layer, a lower optical adhesive layer and a lower electrode layer which are sequentially arranged from top to bottom; a layer of atomization film is additionally arranged on the attaching face of the touch panel and the liquid crystal display panel to increase the haze, on the premise that the transmittance of a product is not affected, the overall haze of the product is improved, the touch panel with the high haze can cover some micron-sized dust particles in the visual aspect, the visuality of the dust particles is reduced, and the product quality is improved. And the lamination yield can be effectively improved.

The present invention belongs to the technical field of mobile phone backlight module identification, and provides a method for identifying the front and back of a mobile phone backlight module, wherein the front and back images of the mobile phone backlight module are identified by an identification mechanism; the positions of a glass cover plate and the mobile phone backlight module are aligned according to the front and back images of the mobile phone backlight module; a UVW platform is corrected according to the front and back images of the mobile phone backlight module, and the center point, coordinate parameters and initial rotation angle of the UVW platform are determined; the center point and coordinate parameters of the front and back images are calculated by the edge coordinates of the front and back images of the mobile phone backlight module; and the target rotation angle of the front and back images of the mobile phone backlight module is calculated with reference to the coordinate parameters of the corrected glass cover plate. The method for identifying the front and back of a mobile phone backlight module of the present invention not only saves a set of visual modules and a set of motion modules, but also keeps the spatial size of the device unchanged, and improves the bonding yield without increasing the cost.

The invention relates to the technical field of display, and particularly discloses a display panel, a flexible circuit board and a display device.The display panel comprises a first binding area, the first binding area comprises at least one row of multiple first binding pads arranged in the first direction, and the width of the first binding pads in the first direction is larger than the length of the first binding pads in the second direction; the first binding area comprises a first center datum line, the first center datum line extends in the second direction, the first binding bonding pads arranged in each row are symmetrical about the first center datum line, and the widths of the multiple first binding bonding pads, located on the same side of the first center datum line, in each row of first binding bonding pads are gradually increased in the first direction. The first binding pads in the display panel are transversely arranged, and the width of the first binding pads farther from the first center datum line in the first direction is larger, so that the size of the first binding pads in the first direction can be increased, alignment binding of the display panel and the flexible circuit board is facilitated, and the binding yield is improved.

The invention relates to a bonding structure, a manufacturing method thereof and a miniature light-emitting diode device, and the method comprises the steps: providing a first substrate and a second substrate, one side of the first substrate comprises a first bonding surface and a first bonding part, one side of the second substrate comprises a second bonding surface and a second bonding part, and the first bonding surface is provided with a first bonding groove; bonding the first bonding surface with the second bonding surface to obtain a pre-bonding structure; and determining that the first bonding groove and the second bonding surface in the pre-bonding structure form a sealing cavity of which the internal air pressure is less than one standard atmospheric pressure, and bonding the first bonding part and the second bonding part in the pre-bonding structure to obtain the bonding structure, thereby providing a novel high-precision bonding structure. And the yield loss caused by insufficient bonding precision can be reduced.

The utility model discloses an automatic laminating device of OCA optical adhesive and glass cover plate, including the lamination unit of connection in rack carrier platform, CG feeding unit and OCA feeding unit, and CG feeding unit includes CG feeding manipulator, CG transfer platform and the CG cleaning sub -unit of setting in the below of CG feeding manipulator, and OCA feeding unit includes OCA stock bin, OCA feeding manipulator, OCA transfer platform and the OCA cleaning sub -unit of setting in the above of OCA transfer platform, and lamination unit includes laminating lower platform, laminating upper platform and OCA transfer manipulator. The scheme of this application, from the feeding supply and dust cleaning treatment of glass cover plate, to the feeding supply and dust cleaning treatment of OCA optical adhesive, to the mutual lamination of OCA optical adhesive and glass cover plate and the discharge and feeding of next process, all realize automation, thereby improve the lamination efficiency and lamination yield of OCA optical adhesive and glass cover plate, and further improve the production efficiency of liquid crystal display screen.

The invention provides a chip atom magnetometer gas chamber integration method and a chip atom magnetometer atomic gas chamber, and the method comprises the steps: 1, precisely placing one end of a glass tube shell on the surface of a first silicon wafer according to an overlay mark, and placing the glass tube shell in anodic bonding equipment for anodic bonding; step 2, filling the glass tube shell subjected to anodic bonding in the step 1 with an alkali metal compound; step 3, carrying out anodic bonding on the other end of the glass tube shell and a second silicon wafer, and simultaneously vacuumizing an inner cavity of the glass tube shell to ensure a vacuum environment of an air chamber; 4, heating the bonded silicon wafer at a set temperature for reaction, and completing release of the alkali metal and the nitrogen buffer gas in the gas chamber; and step 5, performing laser scribing on the first silicon wafer and the second silicon wafer according to the overlay mark to complete scribing separation of the atom magnetometer gas chamber. According to the technical scheme, the technical problem that the application range of the atom magnetometer is limited due to the fact that the meter head of the atom magnetometer is large in size in the prior art is solved.

The utility model relates to the technical field of semiconductor manufacturing, and provides a bonding equipment pressure detection tool, which comprises a detection main body, a pressure bearing piece and at least two pressure sensors, the pressure sensor is located between the detection main body and the pressure-bearing piece, the pressure sensor is arranged at the first end of the detection main body, and the pressure-bearing piece is supported on the pressure sensor. In the use process of the bonding equipment pressure detection tool, the detection tool is placed on the lower disc device, the pressure-bearing piece faces the upper disc device, the upper disc device moves downwards to apply downward pressure to the pressure-bearing piece, and the pressures of different positions of the pressure-bearing piece are detected through the pressure sensors so as to detect the stress uniformity of the pressure-bearing piece. The position and posture of the disc loading device are adjusted according to the measured data, so that the pressure uniformity of the disc loading device during pressure applying is improved, the bonding effect is improved, and the bonding yield is improved.

The present application discloses a heterogeneous thin film wafer and a preparation method, wherein a heterogeneous thin film wafer comprises a substrate layer and a volume expansion layer located on the substrate layer, wherein the volume expansion layer is used to form a structure protruding toward the bonding surface when the wafer is bonded; the bonding surface direction refers to the direction in which the volume expansion layer is away from the substrate layer; an isolation layer is provided on the side of the volume expansion layer away from the substrate layer, and the isolation layer is used to strengthen the bonding strength when the wafer is bonded; a functional film layer is provided on the side of the isolation layer away from the volume expansion layer, and the functional film layer is used to prepare devices and chips; a stress compensation layer is provided on the side of the substrate layer away from the volume expansion layer, and the stress compensation layer is used to improve the morphology of the wafer. The heterogeneous thin film wafer realizes that the wafer contacts from the middle point during the bonding process and then gradually expands to the surrounding areas, thereby improving the bonding yield. At the same time, by adjusting the thickness of the stress compensation layer, the curvature and warpage of the wafer are close to 0, thereby improving the morphology of the wafer.

The invention discloses an optical adjustment device, method and system, and the device comprises a display module which comprises a display module and a first backlight module which is assembled with the display module after a testing stage; the display module comprises a plurality of display partitions; the first backlight module comprises a plurality of first backlight subareas, the first backlight subareas provide backlight for the display subareas, and the first backlight module is used for adjusting backlight parameters of the first backlight subareas according to backlight compensation data, provided by the display module, of at least one display subarea after assembly is completed. In the invention, after backlight assembly, a display module provides backlight compensation data corresponding to a display partition to a first backlight module; during actual display, the first backlight module controls the first backlight subarea to provide the compensated backlight, accurate adjustment of the backlight of each display subarea is achieved, the display color cast condition of the display module is effectively improved, the display effect of the display module is improved, and the product attaching yield is increased.

The embodiment of the invention relates to the field of semiconductors, and provides a bonding method which comprises the following steps: providing a wafer which comprises a plurality of first chips and a plurality of second chips; forming a plurality of contact plugs on the wafer, wherein the contact plugs are electrically connected with the first chip and the second chip of the wafer; a pseudo passivation layer is formed on the first chip of the wafer, a passivation layer is formed in the area except the first chip, and the pseudo passivation layer and the passivation layer jointly cover the plurality of contact plugs; the passivation layer is patterned to expose part of the surface of the contact plug, a bonding pad is formed in the patterned passivation layer, and the bonding pad covers part of the surface of the contact plug and is electrically connected with the second chip through the contact plug; and carrying out hybrid bonding on the at least two wafers to form a bonding structure.

The invention relates to the technical field of semiconductors, in particular to a silicon-based heterogeneous substrate structure, a preparation method thereof and a semiconductor device. The silicon-based heterogeneous substrate structure comprises a supporting substrate, a first oxide layer located on the surface of one side of the supporting substrate, and a functional thin film layer located on the surface of the side, away from the supporting substrate, of the first oxide layer. A chamfering structure is arranged on the edge of one side, with the first oxide layer, of the supporting substrate and / or the edge of one side, facing the first oxide layer, of the functional film layer; according to the technical scheme of the invention, the edge of one side, provided with the first oxide layer, of the supporting substrate is provided with the chamfer structure, and / or the edge of one side, facing the first oxide layer, of the functional film layer is provided with the chamfer structure, so that the functional wafer is prevented from being broken in the bonding process, and the bonding yield is further improved.