5results about How to "Improve bonding yield" patented technology

The utility model discloses magnetic traction roller laminating equipment which comprises a rack and further comprises a jig positioning and adjusting mechanism, a threading assembly mechanism, a stretching mechanism and an electromagnet traction mechanism, the jig positioning and adjusting mechanism is used for positioning and clamping a surrounding screen and adjusting the position of the surrounding screen in the X direction, and the threading assembly mechanism comprises a fixed roller. The stretching mechanism is used for fixing, stretching and guiding the protective film, the end of the protective film is in lap joint with the fixed rolling wheel, and the electromagnet traction mechanism is used for attaching the protective film in place to the surrounding screen. According to the device, all the mechanisms are matched with one another, it is guaranteed that the protective film can be accurately and tightly attached to the surrounding screen, the position and height can be accurately controlled, the automation degree and efficiency of the attaching process are high, the attaching quality can be guaranteed, and therefore the attaching yield of surrounding screen products is increased, and meanwhile the production efficiency is improved.

The invention discloses a MicroLED micro display device and a preparation method thereof. The preparation method comprises the following steps: providing a driving substrate and a plurality of first epitaxial wafers emitting first color light; patterning the first epitaxial wafer to form a plurality of first epitaxial partitions which are distributed at intervals and have epitaxial structures; the first epitaxial wafer is cut to form a plurality of first epitaxial sub-wafers with preset shapes, and each first epitaxial sub-wafer is provided with a plurality of first epitaxial partitions; bonding the plurality of first epitaxial sub-wafers on a driving substrate in sequence to form a first bonding wafer; and processing and forming a plurality of first light-emitting units which are provided with epitaxial structures and are separated from one another on the first bonding sheet. The wafer reconstruction technology is adopted, a large-size driving substrate does not need to be cut, small-size monochromatic epitaxial wafers are processed into epitaxial sub-wafers, then the epitaxial sub-wafers are bonded to the driving substrate one by one, the epitaxial sub-wafers are fully paved to the maximum extent, invalid waste of driving substrate materials is avoided, and the auxiliary material cost and the overall production cost are remarkably reduced.

The utility model discloses a kind of holding unit and bonding equipment, belong to the technical field of semiconductor material processing equipment. Holding unit includes holding assembly and connecting assembly. Holding assembly includes first holding piece and second holding piece of laminated arrangement, first holding piece includes first side and second side, first side is set back to second holding piece and is configured to be used to carry semiconductor material, second side is set to second holding piece and is configured to be used to receive external force. Second holding piece includes a through region, the through region satisfies that external force can be applied to the second side of first holding piece, and second holding piece is used to connect external driving assembly. Connecting assembly is used to connect first holding piece and second holding piece, elastic piece is configured as when external force is applied to the second side of first holding piece, elastic piece is in compression tendency to reduce the force that connecting assembly conducts to second holding piece. The utility model can reduce the possibility that pressurizing equipment causes influence to moving mechanism, improve bonding yield.

The utility model discloses an automatic laminating device of OCA optical adhesive and glass cover plate, including the lamination unit of connection in rack carrier platform, CG feeding unit and OCA feeding unit, and CG feeding unit includes CG feeding manipulator, CG transfer platform and the CG cleaning sub -unit of setting in the below of CG feeding manipulator, and OCA feeding unit includes OCA stock bin, OCA feeding manipulator, OCA transfer platform and the OCA cleaning sub -unit of setting in the above of OCA transfer platform, and lamination unit includes laminating lower platform, laminating upper platform and OCA transfer manipulator. The scheme of this application, from the feeding supply and dust cleaning treatment of glass cover plate, to the feeding supply and dust cleaning treatment of OCA optical adhesive, to the mutual lamination of OCA optical adhesive and glass cover plate and the discharge and feeding of next process, all realize automation, thereby improve the lamination efficiency and lamination yield of OCA optical adhesive and glass cover plate, and further improve the production efficiency of liquid crystal display screen.

The invention provides a chip atom magnetometer gas chamber integration method and a chip atom magnetometer atomic gas chamber, and the method comprises the steps: 1, precisely placing one end of a glass tube shell on the surface of a first silicon wafer according to an overlay mark, and placing the glass tube shell in anodic bonding equipment for anodic bonding; step 2, filling the glass tube shell subjected to anodic bonding in the step 1 with an alkali metal compound; step 3, carrying out anodic bonding on the other end of the glass tube shell and a second silicon wafer, and simultaneously vacuumizing an inner cavity of the glass tube shell to ensure a vacuum environment of an air chamber; 4, heating the bonded silicon wafer at a set temperature for reaction, and completing release of the alkali metal and the nitrogen buffer gas in the gas chamber; and step 5, performing laser scribing on the first silicon wafer and the second silicon wafer according to the overlay mark to complete scribing separation of the atom magnetometer gas chamber. According to the technical scheme, the technical problem that the application range of the atom magnetometer is limited due to the fact that the meter head of the atom magnetometer is large in size in the prior art is solved.