589 results about "Chip on film" patented technology

A liquid crystal display device includes a liquid crystal panel comprising a first substrate and a second substrate, a seal pattern arranged in the edge provided between the first and second substrates, and a liquid crystal layer, a plurality of first electrodes and second electrodes crossing each other and arranged in the seal pattern on an outer surface of the second substrate, a pad electrode for the touch panel partially overlapping the seal pattern on the outer surface of the second substrate, a pad electrode for the liquid crystal panel arranged at the outside of the seal pattern on the first substrate, a chip-on-film (COF) connected to the pad electrode for the liquid crystal panel, a printed circuit board for driving the liquid crystal panel, connected to the chip-on-film, a routing line to connect the pad electrode for the touch panel to the first electrodes and the second electrodes on the outer surface of the second substrate, and a flexible printed cable connected to pad electrodes for the touch panel, to receive driving signals of the first and second electrodes, the flexible printed cable connected to the printed circuit board.

A chip-on-film (COF) package and method for image sensor has been disclosed. According to the method a COF film with opening is provided. The COF film has an upper surface, a lower surface and at least an opening. An image sensing chip is flip-chip mounted on the upper surface of the COF film. A transparent glass is bonded to the lower surface of the COF film. The opening is clipped by the transparent glass and the image sensing chip to form a hermetic space. The active surface of the image sensing chip includes an image sensing region toward the transparent glass through the opening and is sealed in the hermetic space by a limited filling material in order to prevent the image sensing region of the image sensing chip from contamination by means of COF tape packaging method.

A chip on film according to an exemplary embodiment includes: a driving film, a wire layer formed on a first surface of the driving film, a driving chip connected to the wire layer, and an electromagnetic wave blocking layer formed on a second surface of the driving film, in which a mesh portion may be formed on a portion of the electromagnetic wave blocking layer.

A chip-on-film package includes a base film, a test line, and an integrated circuit chip. The base film includes a bent area in which a bending occurs. The test line is disposed on the base film, and at least a portion of the test line is overlapped with the bent area. The integrated circuit chip is disposed on the base film and includes a first terminal and a second terminal. The first terminal is connected to one end of the test line to output a first signal and the second terminal is connected to the other end of the test line to receive a second signal. The integrated circuit chip detects whether a crack occurs in the bent area based on a difference value in signal characteristics.

A chip assembly includes a semiconductor chip, a bump and an external circuit. The semiconductor chip includes a semiconductor substrate, a transistor in and on the semiconductor substrate, multiple dielectric layers over the semiconductor substrate, a metallization structure over the semiconductor substrate, wherein the metallization structure is connected to the transistor, and a passivation layer over the metallization structure, over the dielectric layers and over the transistor. The bump is connected to the metallization structure through an opening in the passivation layer, wherein the bump includes an adhesion/barrier layer and a gold layer over the adhesion/barrier layer. The external circuit can be connected to the bump using a tape carrier package (TCP), a chip-on-film (COF) package or a chip-on-glass (COG) assembly.

An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

Provided is a display device including: a display panel; a chip on film (COF) coupled to the display panel; a flexible printed circuit board (FPCB) coupled to the chip on film, the flexible printed circuit board including a plurality of conductive layers and a plurality of insulating layers, the insulating layers being interposed between the conductive layers or being located at opposite sides of the flexible printed circuit board; and a protecting sheet at one side of the display panel and including a conductive region. One of the insulating layers at one side of the flexible printed circuit board is an opening region of the one of the insulating layers and exposes a corresponding one of the conductive layers to at least partially contact the conductive region.

The invention discloses a display panel and a manufacturing method thereof, and a display device. After a chip on film is adhered by adhesive to a side away from the display surface of a display substrate, signal lines around the display surface of the display substrate can be connected with connecting terminals arranged on the chip on film through a conductive material arranged in connecting holes which at least penetrate through the display substrate, the signal lines and an insulating layer. Thus, a connecting terminal bending process is omitted, there is no connecting terminal bending area around a display panel, and the display panel has a narrower bezel. Moreover, as the insulating layer is provided with multiple depressions around the connecting holes, the conductive material can be in contact with the surfaces of the signal lines in the depressions, the contact area of the conductive material and the signal lines is increased, hole drilling and conductive material filling failure are prevented, and the yield of the product is improved.

The invention discloses a flexible display panel, a display device and a binding method for the flexible display panel. The flexible display panel comprises a plurality of fanout leads, wherein the fanout leads are arranged in a fanout region along the first direction; virtual extension lines of the fanout leads in a side region of the fanout region are at least intersected at a first intersection point in a reference line vertical to the first direction; a chip on film comprises a plurality of output pads which are arranged along the first direction and correspond to the fanout leads one by one; and virtual extension lines of the output pads corresponding to the fanout leads in the side region are at least intersected at a second intersection point in the reference line. When the size of the flexible display panel changes along the first direction, the included angles between the virtual extension lines of the output pads and the fanout leads, which are in one-to-one correspondence, and the reference line are the same, so that correct alignment of the output pads and the fanout leads is achieved by adjusting the relative positions of the flexible display panel and the chip on film in the direction vertical to the first direction and then binding the flexible display panel and the chip on film, and the binding yield and the reliability are improved.

A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area.

A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top inner output conductive patterns, a plurality of bottom inner output conductive patterns and a plurality of landing vias. The top inner output conductive patterns are formed on the top surface of the base film and respectively connected to chip inner output pads formed on a bottom surface of the semiconductor chip. The bottom inner output conductive patterns are formed on a bottom surface of the base film. The landing vias are formed to vertically penetrate the base film and to respectively connect the top inner output conductive patterns and the bottom inner output conductive patterns. The landing vias are arranged within the chip mounting region to form a two-dimensional shape.

The invention provides an array substrate, a chip on film and a display device and belongs to the technical field of display. The display device provided by the invention comprises the array substrate and the chip on film, wherein the array substrate comprises a plurality of first bonding pads which are arranged side by side; the chip on film comprises a plurality of second bonding pads which are arranged side by side; the array substrate is bound to the second bonding pads of the chip on film through the first bonding pads; each first bonding pad comprises a first side, a second side, a third side and a fourth; each first side and each second side are oppositely arranged in a column direction; each third side and each fourth side are oppositely arranged in the column direction; the first side and the second side of each first bonding pad are not arranged in parallel; and each second bonding pad and the bound first bonding pad have the same structure. The array substrate, the chip on film and the display device can be applied to a flexible display panel.

An electrophoretic display device includes: an electrophoretic display panel; a COF (Chip On Film) attached to at least one side of the display panel and having a driving element mounted thereon; and a support frame installed on a rear surface of the electrophoretic display panel, wherein the COF is attached to the support frame through a double-sided tape.

The invention discloses a liquid display device. The liquid display device comprises a back light module, a liquid crystal panel and a chip on film, wherein the backlight module is composed of a lightemitting surface and a back surface opposite to the light emitting surface; the liquid crystal panel is arranged on the light emitting surface of the backlight module, and the front surface of the liquid crystal panel, which backs to the backlight module, is provided with a signal binding end; the chip on film is composed of a flexible circuit board, a binding unit and a driving chip, the bindingunit and the driving chip are arranged on the first surface of the flexible circuit board, the flexible circuit board is electrically connected to the signal binding end through the binding unit andis bent to extend towards the back surface of the backlight module; in the part of the flexible circuit board which is bent to extend towards the back surface of the backlight module, the first surface of the flexible circuit board comprises a first area back to the backlight module, and the driving chip is connected inside the first area. The liquid display device can reduce influence of heat generated by the backlight module on the driving chip, thereby improving the reliability of the driving chip.

There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 μm, and the specular gloss was made to be 250 or more when the incident angle is 60°.

The invention provides a display panel and a preparation method thereof and a display device. Conductive films are arranged at the end parts of an array substrate and a color film substrate of which the sides are flush with each other. A lead angle is formed at the edge, corresponding to the color film substrate or the array substrate, of a binding area. A chip on film is attached to the conductive film, and the chip on film is bent along the lead angle to realize binding. Therefore, the border width of the display panel is reduced, and the risk of line breakage easily occurring in the borderarea of the display panel is reduced.

The chip on film structure for a liquid crystal display is disclosed. The chip on film structure includes a film substrate, a driver chip disposed on the film substrate, a plurality of the input pad, and a plurality of output pads. The input pads and the output pads are disposed on two opposite sides of the driver chip, and are electrically connect to the driver chip respectively. Each input pad comprises an extending portion extending from the input pads to a first cutting edge respectively, and a width of the extending portion is thinner than a width of the input pad, and the extending portions are cut along the first cutting edge.

The invention discloses a chip on film packaging structure, which comprises a flexible substrate, a lead layer, an insulating layer and an elastic layer. The flexible substrate has a surface; the lead layer is formed on the surface and is provided with a plurality of leads; the insulating layer is formed on the lead layer; and the elastic layer is formed on the insulating layer and corresponds to at least one of the leads. When the flexible substrate is bent under the action of an external force, the elastic layer can buffer the deformation of the corresponding lead. Therefore, the rupture, caused by over deformation, of the corresponding lead can be avoided. The invention also provides a chip on film packaging method, which can improve the folding endurance of the chip on film packaging structure so as to solve the problem of the prior art.

The invention provides a display panel and a preparation method thereof. The display panel comprises an array substrate, a color film substrate and a chip-on-film; a first oblique face is arranged at the edge of one side of the array substrate; the color film substrate is arranged on the surface of one side of the array substrate; a second oblique face is arranged at the edge of one side of the color film substrate and is in the same plane together with the first oblique face; and the chip-on-film is bound to the first oblique face and the second oblique face. The preparation method of the display panel comprises the following steps: providing of the array substrate, arranging of the color film substrate, cutting and binding. The display panel and the preparation method thereof have the technical effects that the thickness of a lower frame of the display panel is decreased, and the screen-to-body ratio is increased.

The embodiment of the invention discloses an organic light emitting display panel which comprises an array substrate, a polarizer formed above the array substrate, and a binding region formed on the array substrate along one side of a first direction, wherein bending regions are formed on the binding region along two sides of a second direction, a covering layer covers the bending regions, and thefirst direction is perpendicular to the second direction. According to the technical solution provided by the embodiment of the invention, the problem of display failure of the display panel caused by the breakage of metal film layers in the bending regions at two sides of a chip on film of the display panel easily caused by the 3D bonding of an existing curved display screen can be solved.