A display panel and a
display device, the display panel includes a circuit substrate, a plurality of light emitting elements, a side edge circuit and a thin film
flip chip packaging structure. The circuit substrate includes a circuit structure on a first surface. The side edge circuit includes a first bonding portion, a first extending portion, a second extending portion and a second bonding portion. The first bonding portion is disposed on the first surface of the circuit substrate and bonded to the circuit structure. The first extending portion is disposed on a side surface of the circuit substrate. The second extending portion is disposed on a second surface of the circuit substrate and overlaps a
peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate and its
orthographic projection overlaps a display region. The first bonding portion, the first extending portion, the second extending portion and the second bonding portion are connected in sequence and have the same resistivity. The thin film
flip chip packaging structure is bonded to the second bonding portion.