444 results about "Line scanning" patented technology

The invention discloses a stainless steel tube surface defect detection method and system. The method comprises the following steps: S1, collecting stainless steel tube scanning images under dark field and bright field illumination; s2, splicing the line scanning images into dark field and bright field cylindrical expanded images, and executing brightness equalization and reflection suppression processing; s3, carrying out pixel-level fusion on the dark field and bright field cylindrical expansion images according to a set weight; s4, inputting the fusion cylinder expansion image into a YOLO network trunk of an integrated Swin Transform module, and extracting a multi-scale feature map; s5, performing feature fusion and bounding box prediction, and outputting a bounding box, confidence and a category label of the defect; s6, performing semantic segmentation, gray segmentation and weighted fusion in the detection frame area to generate a final defect mask; and S7, calculating the area, length, width and centroid coordinates of the defect, and converting the actual size and the spatial position. The stainless steel tube surface defect recognition accuracy and stability are improved.

The invention discloses a method for realizing high-quality stripping of large-size diamond by double-laser composite modification, which comprises the following steps: placing and fixing a sample on a three-dimensional mobile platform, and the upper surface of the sample is a crystal face (100); laser generated by an ultrafast laser generator penetrates through the upper surface of a sample and is focused into the sample, and then the laser generated by the ultrafast laser generator is used for performing first spot scanning on the sample to form an independent lattice structure; laser generated by the ultrafast laser generator is adopted to carry out secondary spot scanning on the sample to form a crack interconnected lattice structure; performing third-time line scanning on the sample by using laser generated by a nanosecond laser generator; and ultrasonically stripping the sample in water bath. By adopting a dual-laser composite modification process and combining bionic'honeycomb 'and'turtle shell' crack structure design, the crack is effectively guided to directionally extend along the crystal face (100), the problem of oblique crack when the stripping face is the crystal face (111) in the past is avoided, and the integrity and flatness of the stripping face are greatly improved.

The invention discloses an ultra-thin glass defect detection system and positioning method based on line scanning and phase deflection, and the system comprises a line scanning camera module, a distortionless phase deflection detection module, a high-magnification microscope module and a central processing unit. The line scanning camera module is used for collecting a 2D grayscale image of the ultrathin glass; the distortionless phase deflection technology detection module is used for collecting a surface height map of the ultra-thin glass; the high-magnification microscope module is used for carrying out depth positioning on the interlayer defect judged by the central processing unit; the central processing unit is used for receiving the 2D gray level image and the surface height map, executing an image registration and defect classification algorithm and sending a depth positioning control instruction to the high-magnification microscope module, a multi-module cooperative work detection system is constructed, the detection efficiency and the detection precision are both considered, and data support is provided for production process improvement.

The invention provides a steel plate surface defect detection method and system based on multi-source data fusion, and relates to the technical field of steel production automatic detection.The method comprises the steps that water stain pretreatment is conducted on the surface of a steel plate, the residual humidity is reduced to be below a preset low humidity threshold value, and a dry surface is obtained; based on the dry surface, collecting multi-source data through a 3D laser line scanning camera and a 2D industrial line scanning camera which are synchronously triggered, obtaining line scanning laser point cloud data, a line scanning reflectivity gray level image, a line scanning depth gray level image and an area array reflectivity color image, and establishing a space corresponding relation among the multi-source data; and forming a multi-source data set based on the spatial correspondence among the multi-source data. According to the method, a high-precision and high-robustness steel plate surface defect detection system covering the whole detection process is constructed by eliminating water stain interference, unifying a multi-source data reference, optimizing data quality, accurately identifying defects and realizing automatic feedback and data closed loop.

The invention discloses an industrial art material detection method based on multi-modal deep learning, particularly relates to the field of material analysis, and is used for solving the problems that cross-modal data alignment of curved surface utensils in highlight and multi-layer coating scenes is difficult, and material boundaries are easy to drift along with shooting batches and visual directions. The method comprises the following steps of: positioning a hyperspectral line scanning fragment; constructing a local reference grid to realize initial pairing; generating pixel-level residual image quantization dislocation; estimating luminosity mapping to form consistent bimodal data pairs after eliminating a high-reflectivity region; iteratively supplementing anchor points or adjusting grid rigidity, generating a stable material graph, updating an index table and a consistency record, ensuring cross-batch reusability and traceability, and improving the material detection precision.

The invention discloses a chip packaging body defect detection method, and relates to the field of chip detection.The chip packaging body defect detection method comprises the steps that a feeding position, a visible light detection position, a material connection position, an infrared light detection position and a discharging position are arranged on a rack side by side; the first conveying module lifts the carrier plate at the visible light detection position so that the scanning head can carry out line scanning imaging on the carrier plate units, the second conveying module lifts the carrier plate at the infrared light detection position so that the infrared system can carry out imaging, and physical separation and process relay of visible light and infrared detection are achieved. On the basis, position offset and surface defects are obtained based on visible light images of the carrier plate units, internal subfissures are recognized in combination with infrared images of the chip bodies, and unit-level judgment is generated by integrating multi-source results, so that the efficiency bottleneck of a traditional start-stop mode is avoided, and the coverage blind area of single-mode detection is overcome; and the takt, the integrity and the accuracy of chip packaging body defect detection under a high-productivity production line are remarkably improved.

The invention discloses a coherent interference-based coaxial transceiving line scanning three-dimensional profile measurement system and method. The system comprises a low-coherence light source; the beam splitter is used for collimating light emitted by the low-coherence light source and then dividing the light into two paths; the measuring light is focused into a linear light beam through the cylindrical lens and is emitted to the surface of the to-be-measured sample, and the measuring light reflected by the surface of the to-be-measured sample returns to the beam splitter along the original path; the reference light is emitted to a reference mirror with a certain inclination angle and is reflected back to the beam splitter through the reference mirror; the measuring light reflected by the surface of the sample to be measured and the reference light reflected by the reference mirror are subjected to beam combination interference through a beam splitter and are imaged to enter a camera for interference pattern acquisition; the signal processing system is used for processing the interference patterns to obtain height distribution of the to-be-measured sample on a line field, and three-dimensional profile measurement of the to-be-measured sample is realized by transversely moving or transversely scanning the to-be-measured sample and overlapping the interference patterns measured at different positions. Therefore, high-efficiency measurement can be realized while the micro-nano precision is kept.

The invention provides a calibration method suitable for a single-camera high-precision scanning system. The calibration method comprises the following steps: S1, carrying out area array mode calibration on a linear array camera; by adjusting the exposure time of the line-scan digital camera, moving the base station to image at different positions of the checkerboard, and solving internal parameters and distortion parameters of the line-scan digital camera; s2, line scanning mode calibration; performing line scanning imaging on the checkerboard to obtain pixel coordinates of angular points of the checkerboard; and separating the actual rotation angle of the checkerboard from the projection error, and further deducing the rotation angle of the real camera, thereby completing calibration. According to the calibration requirement of the linear array camera in a scanning imaging scene, a two-stage algorithm combining area array mode modeling and linear scanning imaging correction is provided, and the problem that a traditional calibration method is not applicable under the condition that a single camera is fixed and moves in a single direction is effectively solved.

The invention relates to the technical field of industrial visual inspection, and discloses an asynchronous exposure double-view-field imaging system and method, and the system can achieve the merging of independent view field images collected by two parallel lenses into a single linear array camera through a reflector and a non-polarization beam splitting cube based on the asynchronous exposure double-view-field imaging system. Meanwhile, in cooperation with precise time sequence control, the system drives two independent stroboscopic light sources to be synchronous with line trigger signals of the camera, different view fields are alternately illuminated in odd-even line periods, the camera is made to perform asynchronous exposure, and two paths of image information are collected in a time-sharing mode; and finally, reconstructing two complete, independent and seamlessly spliced detection images from the interleaved data streams through an odd-even line separation algorithm. According to the invention, with the hardware cost of a single camera, the detection visual field is obviously expanded, the detection efficiency and the image geometric precision under the high-line scanning frequency are ensured, and the excellent balance of the performance, the cost and the efficiency is realized.

The invention relates to the technical field of image analysis and mode recognition, in particular to a state monitoring and fault diagnosis method and system based on artificial intelligence. The invention discloses a state monitoring and fault diagnosis method based on artificial intelligence. The method comprises the following steps: S1, acquiring oil sample type data, performing background purification processing, and then executing a high-precision panoramic imaging process; the X-direction shooting number and the Y-direction shooting number are obtained based on the two-axis motion platform; s2, generating a grid coordinate sequence covering the deposition area according to the X-direction shooting number and the Y-direction shooting number, and forming a line-by-line scanning path; and synthesizing a full-focal-plane image based on the scanning path, and outputting a fused panoramic depth panorama according to the synthesized full-focal-plane image. According to the invention, through background purification, panoramic imaging, improved Mask-R-CNN mode recognition model segmentation and multivariate index fusion, precise recognition of wear particles and intelligent early warning and grading of wear states are realized.

The invention discloses an image enhancement processing method and system for an unmanned aerial vehicle monitoring video stream, and relates to the technical field of data processing, and the method comprises the steps: responding to a triggering instruction that an unmanned aerial vehicle enters a hovering verification state, extracting a current exposure line index, and resolving a target light beam projection angle corresponding to the current exposure line index, generating a scanning driving signal based on the linkage mapping relation of the two, performing line-by-line scanning exposure, and limiting the space coverage range of the physical projection light beam in a physical space slice corresponding to a pixel line which is currently in an exposure opening state, so that environmental near-field suspended particles outside the physical space slice are kept in a non-illumination state; and collecting the optical signal reflected by the physical space slice, and generating an enhanced video frame for suppressing near-field scattering interference. According to the application, the airborne linear light source and the exposure line are synchronously scanned, and the light beam coverage range is strictly limited in the physical space slice corresponding to the current exposure line, so that the near-field dust does not generate scattered light because the near-field dust is not illuminated.

The invention provides a driving circuit, a display panel and a display device.The driving circuit is composed of cascaded driving units, each driving unit is composed of a gate driving unit and a light-emitting driving unit, and the output end of each light-emitting driving unit is used for outputting a light-emitting signal; the gate driving unit comprises a first pull-up control module, a first pull-up module, a first pull-down module, a first pull-up control node and a first pull-down control node, and the first pull-up module and the first pull-down module control to output line scanning signals; the first pull-down control node and the first pull-down module of the gate driving unit are connected with the output end of the light-emitting driving unit and multiplex the light-emitting signal as the pull-down control signal, so that the structures of the gate driving unit and the driving circuit are simplified, and the narrow frame design of the display panel can be further realized.

The invention discloses a wafer surface defect detection system and method based on a high-speed line scanning camera, and belongs to the technical field of wafer defect detection, and the system comprises an illumination system which is used for providing bright field illumination and illumination with an adjustable illumination angle, and forming a line light spot with an adjustable size on the surface of a wafer through a line light spot generation device; the wafer scanning assembly comprises a carrying table used for carrying a wafer and a displacement control assembly used for driving the carrying table to move; the imaging system comprises a bright field imaging assembly; the high-speed line scanning camera is used for carrying out high-speed scanning imaging on the signals collected by the imaging system and balancing the signal-to-noise ratio, the dynamic range and the detection resolution through a programmable pixel merging function; and the control system is used for coordinating and controlling all system components and realizing parameter optimization and online self-adaptive calibration. According to the invention, high-resolution and high-sensitivity wafer surface micro-nano defect detection can be realized while high detection speed is ensured.

The invention provides a processing quality monitoring system and method for a precision part with a complex structure. The method comprises the following steps: generating a fusion feature map through a multispectral image sequence after a target precision part is processed; identifying spatial distribution features of the suspected processing defect area by fusing texture features in the feature map and spectral reflection characteristic distribution in combination with a preset processing defect knowledge map; controlling a three-dimensional line scanning module to perform three-dimensional point cloud reconstruction on the suspected processing defect area based on the spatial distribution characteristics to generate three-dimensional shape data; extracting a morphology deviation field of the suspected machining defect area according to the three-dimensional morphology data and a reference CAD model of the target precision part; and processing quality classification is carried out on the target precision part based on the local surface instability features in the morphology deviation field and the multispectral feature vectors in the fusion feature map. According to the technical scheme provided by the invention, the problem of monitoring efficiency reduction caused by full-field scanning of point cloud data in precision part quality monitoring can be solved.

A lithium secondary battery according to the present invention includes a positive electrode and a negative electrode disposed opposite the positive electrode. The slip step difference of the positive electrode is 20 nm or less. The slip segment difference is defined in such a manner that, in a line scan pattern obtained by measuring the surface of the positive electrode in a fully discharged state after 500 times of charging and discharging of the battery using an atomic force microscope (AFM), the distance between a pair of parallel lines in which the slope of the observed mountain shape is not zero may include two or more.

The utility model belongs to the field of spectral imaging, provide a kind of split type rotating structure plant spectral imaging system, including main body frame, the upper crossbeam of main body frame top fixed mounting, the middle crossbeam of main body frame middle part fixed mounting, the lower crossbeam of main body frame bottom fixed mounting, several light sources are installed on middle crossbeam, the side fixed mounting of upper crossbeam is equipped with camera fixed support, detection camera is installed on camera fixed support, the inside of main body frame bottom is equipped with sliding plate, detection object placement subassembly is fixedly installed at the middle position of sliding plate top, the side fixed mounting of sliding plate top is equipped with electric cabinet;The utility model has simple structure, manufacture easily, cheap, easy to pack, transport and carry, firm and durable, easy maintenance and other characteristics, light source and sample placement position are more flexible, applicable to various optical cameras and spectral imaging instrument, such as the surface imaging spectral camera of various wave bands, line scanning spectral imaging instrument, single-point spectral spectrometer, Raman spectrometer etc.

The present invention presents improved systems and methods for performing multi-photon lithography. A line-scanning temporally focused two-photon lithography (LS-TFTPL) technique is capable of patterning three-dimensional structures with high throughput. An example LS-TFTPL system may include a pulsed laser, first optical components for expanding light pulses into an elongated or line cross section, a digital micromirror device for modulating the light pulses with a linear pattern and dispersing spectral components of the modulated light pulses, and second optical components for focusing the dispersed spectral components of the modulated light pulse at a line in or on a target material. The focused spectral components may alter the target material within selected voxels along the line, where the selected voxels spatially correspond to the linear pattern.

The present application relates to laser processing simulation method, specifically relates to a kind of single line scribing simulation method and multi-line scanning simulation method based on section lofting, for solving the problem that the calculation efficiency of existing pulse laser ablation simulation model is limited, simulation calculation time is still longer.The single line scribing simulation method based on section lofting provided by the present application, processing track is decomposed into stable section and unstable section, a small amount of key point pulse is obtained by discrete sampling on stable section, and the ablation section line of all key point pulse is calculated and obtained;The ablation section line of lofting key point pulse is obtained, the ablation surface of stable section is obtained, and then its ablation topography is obtained;The single line scribing simulation method based on section lofting of the present application, since only the ablation section line of a small amount of key point pulse is calculated, and lofting time is unrelated to pulse number, the calculation efficiency of workpiece ablation topography is greatly improved, and the more the total number of pulse, the higher the calculation efficiency is improved.

The invention discloses a penetration probability-based characteristic line neutron transport calculation accelerated scanning method, which comprises the following steps of: firstly, establishing characteristic line information, and dividing each characteristic line into a plurality of characteristic line segments; establishing a penetration probability coefficient from the incident boundary angle flux to the emergent boundary angle flux directly along each characteristic line; scanning the whole characteristic line in all directions, calculating an emergent boundary angle flux from the incident boundary angle flux by using the penetration probability coefficient, obtaining an incident boundary angle flux of the boundary point in the other direction from the emergent boundary angle flux, calculating the emergent boundary angle flux from the incident boundary angle flux by using the corresponding penetration probability coefficient again, and repeating the process to obtain the emergent boundary angle flux of the boundary point in the other direction. The incident boundary angular flux in all directions of the boundary point is converged; and for each feature line in all directions, only one time of feature line segment-by-segment calculation is carried out, flux information on the fine grid is obtained, and scanning is ended. According to the method, multiple times of feature line segment-by-segment calculation before convergence are avoided, the calculation amount is reduced, and the calculation efficiency of the feature line method is improved.

The invention provides a method for testing the copper diffusion depth of an aluminum alloy clad aluminum plate. The method comprises the following steps: pretreating the aluminum alloy clad aluminum plate; and carrying out line scanning on the pretreated aluminum alloy clad aluminum plate by utilizing an energy disperse spectroscopy, and obtaining the copper diffusion depth of the aluminum alloy clad aluminum plate according to an obtained Cu element curve. According to the test method provided by the invention, the concentration distribution gradient of the Cu element in the coating layer of the aluminum alloy coated aluminum plate is reflected by utilizing energy disperse spectroscopy line scanning, the influence caused by test operations such as etching is avoided, the copper diffusion depth of the coating layer can be truly reflected, and the accuracy of copper diffusion depth data is ensured.

The application provides a point melting forming method and system based on an electron beam heat source, and the method comprises the following steps: model slicing and path planning, adaptively slicing a three-dimensional model to obtain two-dimensional contour data of each layer section; point array processing, dividing a single layer section area into a contour point array and a filling point array, adaptively discretizing and sampling the contour point array based on curvature change, and generating a basic point array mode with regular arrangement for the filling point array; scanning sequence generation and optimization, converting the discretized point array into an ordered scanning instruction sequence, predicting thermal field evolution under different scanning sequences by establishing a thermal influence model, and iteratively optimizing the scanning sequence based on a multi-objective optimization algorithm; and layer-by-layer point melting forming, controlling electron beam point-by-point melting of metal powder according to the optimized point scanning sequence. The application replaces continuous line scanning with a discrete point melting mode, significantly reduces thermal accumulation and thermal stress, and improves the size accuracy and surface quality of the formed part.

The present application belongs to the technical field of industrial vision detection, and discloses a kind of copper foil adhesive tape bubble and pinhole defect multi-light source detection method;In the process of copper foil adhesive tape transmission, through the time division multiplexing illumination of coaxial light source and multi-azimuth oblique light source, combined with the line scanning acquisition technology of transmission speed synchronization to obtain multi-lighting mode image set.Process the image distortion caused by high-speed transmission using motion blur compensation technology, and execute local contrast anomaly detection on motion compensation image to extract candidate defect area.Through calculating radial morphological features and stereoscopic protrusion discrimination features, accurate discrimination of bubble and pinhole defects is realized.The present application has self-adaptive optimization capability, can dynamically adjust light source parameters and reacquire for the area with low discrimination confidence, and output defect position, type and severity level.The present application overcomes the influence of motion blur, improves the accuracy of defect classification, and provides accurate basis for production process parameter adjustment.

The invention discloses a current type micro-display device pixel point and a driving circuit design thereof, and provides a corresponding driving method at the same time. The pixel point circuit comprises four metal-oxide-semiconductor field effect transistors (MOSFETs), a storage capacitor and a light emitting diode load; the four MOSFETs are regulated and controlled by two driving signals, one pixel enable signal and one data input signal, and functions of the four MOSFETs are realized by combining a driving circuit and a driving method. According to the line scanning driving circuit disclosed by the invention, the scanning input signal, the enabling input signal, the line control input signal, the line scanning clock and the frame cutting clock are combined to obtain the driving signal and the pixel enabling signal required by a pixel point circuit, and the power consumption of a current type micro display device is reduced. According to the driving method disclosed by the invention, the pixel point circuit has three working stages in a frame of light emitting period, and the threshold voltage is extracted and stored in the capacitor, so that the current stability of the pixel point circuit in the light emitting stage is improved, and normal light emitting of the micro-display device is realized.

The utility model discloses a fingerprint module, a display screen and electronic equipment, and relates to the technical field of electronic equipment. The fingerprint module comprises: a circuit board; the supporting component is arranged on the circuit board; the PMOLED module is arranged on the side, away from the circuit board, of the supporting component and is opposite to the circuit board; the lighting component is electrically connected with the circuit board and is positioned below the PMOLED module; and the fingerprint identification camera module is electrically connected with the PMOLED module and the circuit board respectively. According to the utility model, the problems that in the prior art, fingerprint identification is carried out through an algorithm after a camera is placed under a screen to shoot fingerprints on the screen, but the camera and the PMOLED screen drive principle are line-by-line scanning, and the scanning frequencies of the camera and the PMOLED screen drive principle are difficult to be consistent or multiplied, so that a picture shot by the camera has stripes, and the fingerprint identification effect is poor are solved. Therefore, the problem that fingerprints cannot be identified or are identified mistakenly exists.

The invention provides a ceramic film cutting all-in-one machine, which relates to the technical field of ceramic film cutting, and comprises a rack mechanism, and a ceramic film material roll unwinding mechanism, a ceramic film cutting mechanism, a dislocation carrying mechanism, a blanking carrying mechanism, an OK and an NG stock bin which are arranged in the rack mechanism, the ceramic film material roll unwinding mechanism is used for feeding ceramic film roll materials, performing line scanning detection on holes, adsorbing and cutting films at the two ends of the side edge and collecting waste ceramic films; the staggered carrying mechanism is used for conveying ceramic films in a staggered mode and adsorbing and supporting the ceramic films. Laser cutting is replaced by a mechanical cutting mode of combining an inclined cutter and a circular cutter, thermal damage of high temperature to a film material is effectively avoided, potential safety hazards of laser cutting in an anti-explosion scene are eliminated, the circular cutter is cooperatively driven by a servo and an air cylinder to achieve elastic cutting, and cooperative design of adsorption fixation and film material movement transmission is matched, so that the anti-explosion effect of the film material is improved. And the cutter synchronism is greatly improved, and the problems of irregular notches and burrs of the wide film material are solved.

This invention provides a method for measuring pulsed laser parameters based on titanium nanofilms, belonging to the field of pulsed laser parameter measurement methods. The method first prepares titanium nanoparticle ink; then, a titanium deposition layer is prepared by inkjet printing or spin coating; finally, the titanium deposition layer is placed within the laser scanning range, a single-point or line scanning mode is set, and images of the sintered titanium region are recorded. The corresponding laser parameters are obtained through image processing software analysis. This method can intuitively, conveniently, and cost-effectively obtain key pulsed laser parameters, and can accurately obtain parameters such as spot size and repetition frequency.

This invention discloses a wafer and chip defect detection system and method based on linear array Brillouin microscopy, belonging to the fields of optical precision measurement and wafer inspection. The system connects a Brillouin scattering detection module, a bright-field detection module, and a signal processing and feedback module; the signal processing and feedback module is connected to a displacement module; the signal processing and feedback module is also connected to an imaging and analysis module, transmitting single-shot linear beam measurement data to the imaging and analysis module; the displacement module is connected to the sample; and the Brillouin scattering detection module and bright-field detection module are connected to the sample to acquire sample information. This invention enables line-scan confocal measurement of the mechanical properties of wafers and non-transparent chips using the Brillouin scattering detection module, significantly improving the speed of Brillouin scattering detection; the combination of bright-field linear array detection and Brillouin scattering linear array detection allows for the simultaneous acquisition of geometric and mechanical stress defects in wafer and chip samples, broadening the range of defect detection parameters.

The invention provides a steel plate defect detection method and system based on machine vision, and relates to the technical field of steel plate defect detection.The method comprises the steps that upper and lower surface sensors, an electrical cabinet, a detection server and a camera computer are deployed on a production line, and power supply connection is conducted through the electrical cabinet; irradiating the steel plate by using an LED light source, and triggering a line scanning camera by an encoder to acquire upper and lower surface and edge images; processing and filtering pseudo defects through a camera computer, identifying real defects and extracting images, and determining defect types, positions and severity by combining a multi-level classifier and an expert database; after related data are stored, quality files such as coiled material reports are automatically generated, sound-light alarm is triggered when the defect severity threshold value is exceeded, the field control unit is linked to execute feedback operation or output I / O signals, online detection, classification, storage, report generation and threshold-exceeding alarm linkage of steel plate defects can be achieved, and the detection efficiency and the quality control level are improved.

This invention provides a system and method for scanning the properties of micro-regions in solar cells. The system includes: a one-dimensional laser source configured to generate a one-dimensional line-scan laser; a sample stage for holding the solar cell sample to be tested; a precision displacement device configured to cause relative movement between the one-dimensional laser source and the sample stage, enabling the one-dimensional line-scan laser to scan the measured region of the solar cell sample, comprising multiple micro-regions, in a cross-scan manner; a micro-region property measurement unit configured to acquire property data of the scanned measured region; and an automatic control and data processing unit configured to collect the property data from the micro-region property measurement unit, extract property information at the perpendicular intersections of the cross-scans based on the property data, and determine the distribution of micro-region properties based on the property information at the perpendicular intersections. This reduces the number of steps required for micro-region scanning, shortens the scanning time, and reduces the number of sampling operations.

The invention discloses an H-shaped steel bar plate automatic centering placing method and a steel bar plate welding processing device, and relates to the technical field of profile steel processing, the placing method comprises the following steps: using a scanner to scan intersection points of wing plates and web plates on two sides of H-shaped steel, and obtaining coordinates of the two intersection points; according to the coordinate information of the two intersection points, central position coordinates of a linear scanning area of the scanner in the H-shaped steel tank are calculated; the rib plate grabbing mechanical arm is used for centrally placing the rib plate in a corresponding line scanning area of the H-shaped steel according to the central position coordinates, so that the rib plate can be accurately centrally placed in a steel groove of the H-shaped steel; using the scanner again to scan the intersection points of the wing plates and the web plates on the two sides of the H-shaped steel, calculating the coordinates of the scanning surface of the scanner in the central position in the H-shaped steel tank, judging whether the new central position coordinates are consistent or not, and if so, not adjusting; if not, the rib plate grabbing mechanical arm is adjusted to drive the rib plate to move to the new center position, and it is guaranteed that the rib plate is located at the correct position before welding.