15 results about "ChIP-on-chip" patented technology

The invention discloses an on-chip integrated wavelength division demultiplexing structure and a photonic integrated chip. The on-chip integrated wavelength division demultiplexing structure comprises a slice demultiplexer and M optical multiplexers, the slice demultiplexer is provided with a first input waveguide and M groups of first output waveguides, each group of first output waveguides comprises at least two first output waveguides, the M optical multiplexers respectively correspond to the M groups of first output waveguides, and each optical multiplexer is optically connected with one group of first output waveguides; the method comprises the following steps: firstly, demultiplexing optical signals of each optical channel by using a slice demultiplexer, subdividing the signal of each optical channel into a plurality of sub-wavelength division signals with narrow linewidth, and then multiplexing the plurality of sub-wavelength division signals corresponding to the same channel into one optical signal with flat-topped bandwidth through an optical multiplexer. And the design difficulty and requirements of the wavelength division demultiplexing device are reduced, so that wavelength division demultiplexing with flat-topped bandwidth and low loss can be realized more easily.

This utility model discloses a heating plate with an electrically offset input structure, comprising: a cover, a first insulator, a heating component, a second insulator, and a chassis assembly. The heating component includes a chip and a heating wire, with the heating wire wound around the chip. One side of the chip has an inlet hole and an outlet hole. The second insulator includes a first upper insulating sheet and a first lower insulating sheet. The first upper insulating sheet has a first clearance groove, and the first lower insulating sheet has a second clearance groove, which are offset from the first clearance groove. This application utilizes the internal structure of the second insulator below the inlet and outlet ends of the heating wire to fold and press some of the heating wire into the heating gap area. The position of the inlet and outlet ends of the heating wire can be adjusted closer to the edge, solving the problem of large areas without heating wire winding at the inlet and outlet ends, resulting in more uniform heating of the entire plate. Furthermore, it addresses the issue of the outlet end position being adjustable according to customer needs.

The utility model discloses a kind of multi-station burning seat, including lower base, upper pressure seat, circuit board, chip detection component and chip clamping component, upper pressure seat is connected movably with lower base upside down, chip detection component is installed in the installation groove of lower base, circuit board is installed in the lower surface of lower base, chip detection component is equipped with multiple side-by-side arrangement chip detection station, chip clamping component includes oppositely arranged first clamping component and second clamping component, first clamping component has multiple first clamps corresponding with chip detection station one by one, second clamping component has multiple second clamps corresponding with chip detection station one by one, upper pressure seat can drive first clamps and second clamps to be active, to make first clamps and second clamps hold or loosen chip on chip detection station, the utility model can test multiple chips at a time, effectively improve chip test efficiency, reduce production cost.

The utility model discloses a power module temperature measurement structure, which comprises a copper substrate, an insulating substrate is arranged on the copper substrate, the insulating substrate comprises a plurality of chip units, each chip unit is provided with a copper layer and a plurality of power chips connected with the copper layer, and the power chips are connected with the copper layer. A plurality of chip units are arranged on the copper substrate, a distributed temperature sensor is embedded in the copper substrate, the distributed temperature sensor sequentially passes through the plurality of chip units, the distributed temperature sensor comprises a linear extension part, and the linear extension part is arranged adjacent to a plurality of power chips on the chip units. According to the utility model, power module temperature field distribution monitoring can be realized, and local temperature rise abnormity can be timely sensed.

The utility model provides a device for automatically replacing defective products on a chip carrier tape with good products, which comprises a first feeding device, a first chip detection device, a second feeding device and a chip detection and replacement device, the first feeding device is used for conveying the chip carrier tape to the first chip detection device, and the second feeding device is used for conveying the chip carrier tape to the second chip detection device. The first chip detection device is used for detecting whether a chip on a chip carrier tape is a good product or not, the second feeding device is used for conveying a standby chip carrier tape to the chip detection and replacement device, and the chip detection and replacement device firstly takes out a defective product from the chip carrier tape and throws the defective product to a recovery box. According to the invention, the spare chip carrier tape is arranged on the chip carrier tape, and then the non-defective chips are taken out from the spare chip carrier tape and are placed in the chip grooves of the chip carrier tape, so that the defective products on the chip carrier tape are automatically replaced by non-defective products, each chip on the chip carrier tape used in the production process of electronic products is ensured to be a non-defective product, the production quality of the electronic products is ensured, and the production efficiency of the electronic products is improved. And the effective efficiency is improved.

The utility model discloses a chip write-in jig convenient to wind, which relates to the field of chip production and comprises a workbench and a mounting plate, the mounting plate is vertically fixed on the workbench, a base is fixed on the workbench, the base is in sliding connection with a chip material belt, a data write-in actuator is mounted on the base, and the data write-in actuator is connected with the mounting plate. The data write-in actuator is located below the chip material belt, and the chip material belt is connected with the winding mechanism. According to the chip writing jig convenient to wind, the continuous intermittent winding mechanism is adopted, a chip material belt can intermittently move, continuous writing of data of multiple chips is achieved, automatic winding of the chip material belt can also be achieved, basic guarantee is provided for data writing of the chips on the chip material belt, the elastic pressing mechanism is matched, and the chip material belt can be conveniently wound. Certain resistance can be generated on movement of the chip material belt, so that the chip material belt can be ensured to be in a straightened state, and normal operation of the device is further ensured.

An integrated sensor component includes a chip carrier and a first semiconductor chip and a second semiconductor chip, wherein either both semiconductor chips are arranged on the chip carrier or (alternatively) the second semiconductor chip is arranged on the chip carrier and the first semiconductor chip is arranged on the second semiconductor chip (chip-on-chip). The integrated sensor component further includes a first sensor element integrated in the first semiconductor chip and a second sensor element integrated in the second semiconductor chip, as well as a housing formed by a potting compound, which has an opening. Both the first sensor element and the second sensor element are located within the opening so that they can interact with the atmosphere surrounding the sensor component.

The invention discloses a mushroom multi-mode intelligent sorting and RFID traceability system and method, an ESP32 chip and Raspberry Pi 4B are used as main control chips, the Raspberry Pi 4B carries a YOLOv8 model, and the Raspberry Pi 4B is externally connected with a USB camera module to realize deep learning machine vision identification of mushrooms so as to obtain appearance characteristics, classification varieties and quality grades of the mushrooms. The humidity sensor, the gas sensor, the weight sensor and the RFID module are integrated on the ESP32 chip, the ESP32 chip transmits information of various sensors to the Raspberry Pi 4B, the Raspberry Pi 4B classifies shiitake mushrooms by fusing the information of various sensors and shiitake mushroom image identification information on the basis of timestamps, and classification results are written into the RFID module to be made into RFID tags. By the adoption of the system and method, the problem that an existing shiitake mushroom sorting system cannot comprehensively evaluate physical and chemical indexes and recessive quality of shiitake mushrooms is solved.

The application relates to the field of semiconductors and discloses a common-source common-gate GaN device and a preparation method thereof. The common-source common-gate GaN device comprises a lead frame base island, a MOS chip and a GaN chip. The lead frame base island is provided with a first conductive area serving as a source of the GaN device. The source of the MOS chip is arranged on the back surface, and the gate and the drain are arranged on the front surface. The source on the back surface of the MOS chip is electrically connected with the first conductive area. The GaN chip is stacked on the MOS chip. The source, the gate and the drain of the GaN chip are arranged on the front surface, and the back surface of the GaN chip is also provided with the source. The source on the back surface of the GaN chip is electrically connected with the drain on the front surface of the MOS chip. Alternatively, the front surface of the MOS chip is also provided with the source, the front surface of the GaN chip is provided with the drain, the back surface is provided with the source and the gate, and the source and the gate on the back surface of the GaN chip are electrically connected with the drain and the source on the front surface of the MOS chip in correspondence. The application can reduce the size of the GaN device and lower the cost.

The application relates to the technical field of chip packaging, in particular to a laser radar module applying a chip stacking structure and a chip stacking method thereof, wherein the module comprises: Vcsel chips and SPAD chips; the Vcsel chips are flip-chip attached on the SPAD chips, the Vcsel chips and the SPAD chips are respectively provided with a plurality of connecting pins on the attaching surfaces thereof, and the connecting pins of the Vcsel chips are connected with the connecting pins of the SPAD chips in correspondence. The scheme can reduce the structural size of a dToF module product.

The utility model discloses a mirror surface photodiode of high light transmission, including chip substrate and array setting mirror surface chip on chip substrate, mirror surface chip includes bottom piece, diode crystal, light -transmitting lens, package cover shell, conducting sheet and first paster pin, bottom piece top is connected with diode crystal through conducting sheet, and diode crystal is used for sensing light, conducting sheet passes through first paster pin and the electrical connection of second paster pin of chip substrate bottom, the package cover shell is located bottom piece top, and the package cover shell is equipped with light -transmitting lens, and light -transmitting lens is used for making light ray penetrate and enter diode crystal, the utility model discloses through array arrangement mirror surface chip on chip substrate, can form a large range of photosensitive area, thereby improve the photosensitive coverage range of whole photodiode, make photosensitive diode can large -area capture light ray, effectively improve the photoelectric conversion efficiency and response speed of photosensitive diode.

This invention discloses a microfluidic chip, its fabrication method, and a molecular measurement method utilizing the same. The microfluidic chip includes an upper chip and a lower chip. The lower surface of the upper chip and the upper surface of the lower chip can be attached to each other, and the upper and lower chips can slide relative to each other along the attached surfaces. The lower surface of the upper chip has a first fluid channel structure for loading a first reactant and a second fluid channel structure for loading a second reactant. The upper surface of the lower chip has a microporous structure. When the upper and lower chips slide relative to each other, the vertical projection of the first or second fluid channel structure can be aligned with the microporous structure, allowing the first and second reactants to enter the microporous structure stepwise. This invention can increase the magnetic bead loading rate to approximately 90%, significantly improving detection performance. Furthermore, the stepwise loading scheme of this invention can significantly reduce background values, offering a more significant advantage in multiplex detection.

This invention belongs to the field of optical detection technology for biological samples, specifically relating to an optical detection system for converging detection light. This invention provides an optical detection system for converging detection light, aiming to solve the problem of low detection accuracy caused by the inability of existing optical detection systems to converge light. An optical detection system for converging detection light includes a base; a detection cavity is provided within the base to prevent external light from entering and to accommodate at least a portion of a test tube; a chip for receiving light is provided on the base, and the inner wall of the detection cavity serves as a focusing surface that reflects the light emitted by the sample in the test tube onto the chip. By setting up a detection cavity, and ensuring that the inner wall of the detection cavity reflects the light emitted by the sample in the test tube onto the focusing surface of the chip, this invention allows more light emitted by the sample in the test tube to be reflected onto the chip, enabling the chip to receive more light and thus improving detection accuracy.

The utility model discloses a chip surface cleaning mechanism for a chip mounter. The chip surface cleaning mechanism comprises a wiping structure, wherein the wiping structure comprises a support column I; the upper side of the first supporting column is fixedly connected with a moving structure, and the moving structure comprises a second supporting column, a first connecting plate and a sliding rail. The moving structure is arranged, when the motor is started, the motor firstly drives the first transmission wheel to rotate, and when the first transmission wheel rotates, the transmission belt is driven to operate between the first transmission wheel and the second transmission wheel; when the transmission belt moves, the transmission belt acts on the driving column to move left and right on the upper side of the sliding rail, and finally the absolute ethyl alcohol storage device and the spray head are driven to move at the same time, absolute ethyl alcohol is sprayed to patches on the patch transmission belt, and oil stains on the surfaces of the patches are cleaned. And the spraying head can be driven to spray sewage ethanol to the veneering surface, oil stains on the veneering surface can be dissolved, large-range spraying can be achieved, and cleaning comprehensiveness is guaranteed.

The application discloses a kind of integrated wave division demultiplexing receiver structure and chip on chip, including wave division demultiplexing module and multiple groups of photoelectric detector, wave division demultiplexing module includes cascaded first stage wave division demultiplexer and second stage wave division demultiplexer.By wave division demultiplexing module, one original light multiplex signal containing N channels is demultiplexed into N first sub-optical signals and N second sub-optical signals.Then the sub-optical signals from the same channel are input into the corresponding photoelectric detector in the same group of photoelectric detector, to be converted into corresponding electrical signal and output respectively.Finally, all electrical signals output by the same group of photoelectric detector are configured as superimposed output, to be used as the optical detection output of corresponding channel.Compared with prior art, not only the effect of large channel bandwidth, low insertion loss and low crosstalk can be achieved, but also the effect of accurately monitoring the intensity of optical signal of each channel is achieved.