25 results about "ChIP-on-chip" patented technology

The utility model discloses a portable biochemical blood coagulation analysis device which comprises a shell, a power supply, a control module and a detection module, the detection module is composed of a lamp source, a support, a detection chamber, a spectrograph, an in-out cabin and a chip, a direct-current brushless motor is fixed to the in-out cabin, a chip fixing seat is fixed to the upper end of the direct-current brushless motor, a circle of teeth are arranged on the chip fixing seat, the teeth are meshed with teeth on the chip through the teeth, and the chip is fixed to the detection chamber through the detection chamber. The circumferential locking of the chip is realized; an NFC chip is attached to the chip, and an NFC detection module is arranged at the upper end of the detection chamber. According to the utility model, the diluent is arranged in the chip, the diluent does not need to be additionally added during detection, the chip and the chip fixing seat are attracted by a magnet and locked by tooth meshing, the structure is simpler, chip information is stored on one NFC chip, the chip automatically reads the information when entering a constant-temperature cabin, and the action of scanning a code to read the chip information is reduced.

The invention discloses an on-chip integrated wavelength division demultiplexing structure and a photonic integrated chip. The on-chip integrated wavelength division demultiplexing structure comprises a slice demultiplexer and M optical multiplexers, the slice demultiplexer is provided with a first input waveguide and M groups of first output waveguides, each group of first output waveguides comprises at least two first output waveguides, the M optical multiplexers respectively correspond to the M groups of first output waveguides, and each optical multiplexer is optically connected with one group of first output waveguides; the method comprises the following steps: firstly, demultiplexing optical signals of each optical channel by using a slice demultiplexer, subdividing the signal of each optical channel into a plurality of sub-wavelength division signals with narrow linewidth, and then multiplexing the plurality of sub-wavelength division signals corresponding to the same channel into one optical signal with flat-topped bandwidth through an optical multiplexer. And the design difficulty and requirements of the wavelength division demultiplexing device are reduced, so that wavelength division demultiplexing with flat-topped bandwidth and low loss can be realized more easily.

This utility model discloses a heating plate with an electrically offset input structure, comprising: a cover, a first insulator, a heating component, a second insulator, and a chassis assembly. The heating component includes a chip and a heating wire, with the heating wire wound around the chip. One side of the chip has an inlet hole and an outlet hole. The second insulator includes a first upper insulating sheet and a first lower insulating sheet. The first upper insulating sheet has a first clearance groove, and the first lower insulating sheet has a second clearance groove, which are offset from the first clearance groove. This application utilizes the internal structure of the second insulator below the inlet and outlet ends of the heating wire to fold and press some of the heating wire into the heating gap area. The position of the inlet and outlet ends of the heating wire can be adjusted closer to the edge, solving the problem of large areas without heating wire winding at the inlet and outlet ends, resulting in more uniform heating of the entire plate. Furthermore, it addresses the issue of the outlet end position being adjustable according to customer needs.

The utility model discloses a kind of multi-station burning seat, including lower base, upper pressure seat, circuit board, chip detection component and chip clamping component, upper pressure seat is connected movably with lower base upside down, chip detection component is installed in the installation groove of lower base, circuit board is installed in the lower surface of lower base, chip detection component is equipped with multiple side-by-side arrangement chip detection station, chip clamping component includes oppositely arranged first clamping component and second clamping component, first clamping component has multiple first clamps corresponding with chip detection station one by one, second clamping component has multiple second clamps corresponding with chip detection station one by one, upper pressure seat can drive first clamps and second clamps to be active, to make first clamps and second clamps hold or loosen chip on chip detection station, the utility model can test multiple chips at a time, effectively improve chip test efficiency, reduce production cost.

The utility model discloses a power module temperature measurement structure, which comprises a copper substrate, an insulating substrate is arranged on the copper substrate, the insulating substrate comprises a plurality of chip units, each chip unit is provided with a copper layer and a plurality of power chips connected with the copper layer, and the power chips are connected with the copper layer. A plurality of chip units are arranged on the copper substrate, a distributed temperature sensor is embedded in the copper substrate, the distributed temperature sensor sequentially passes through the plurality of chip units, the distributed temperature sensor comprises a linear extension part, and the linear extension part is arranged adjacent to a plurality of power chips on the chip units. According to the utility model, power module temperature field distribution monitoring can be realized, and local temperature rise abnormity can be timely sensed.

The invention provides a flexible electrode packaging structure of an on-chip integrated chip and a packaging method and application of the flexible electrode packaging structure. The flexible electrode packaging structure comprises a flexible electrode, a printed circuit board and an integrated circuit chip. The flexible electrode comprises an insulating layer and a conductive layer which are arranged in a laminated manner, and the conductive layer is provided with a signal acquisition channel and a leading-out site; the printed circuit board comprises a carrier plate, a first welding site and a second welding site, the first welding site and the second welding site are arranged on the carrier plate, the first welding site is matched with the leading-out site of the flexible electrode, and the second welding site is matched with the pin site of the integrated circuit chip; the integrated circuit chip is provided with an analog-to-digital converter. According to the flexible electrode packaging structure, the analog-to-digital converter is integrated on the electrode, the analog signal transmission distance and the number of interfaces are obviously reduced, and only digital signal lines need to be led out, so that the anti-interference capacity of a system is improved, high-quality electrophysiological signals are finally obtained, and large-scale application and popularization are facilitated.

The utility model provides a device for automatically replacing defective products on a chip carrier tape with good products, which comprises a first feeding device, a first chip detection device, a second feeding device and a chip detection and replacement device, the first feeding device is used for conveying the chip carrier tape to the first chip detection device, and the second feeding device is used for conveying the chip carrier tape to the second chip detection device. The first chip detection device is used for detecting whether a chip on a chip carrier tape is a good product or not, the second feeding device is used for conveying a standby chip carrier tape to the chip detection and replacement device, and the chip detection and replacement device firstly takes out a defective product from the chip carrier tape and throws the defective product to a recovery box. According to the invention, the spare chip carrier tape is arranged on the chip carrier tape, and then the non-defective chips are taken out from the spare chip carrier tape and are placed in the chip grooves of the chip carrier tape, so that the defective products on the chip carrier tape are automatically replaced by non-defective products, each chip on the chip carrier tape used in the production process of electronic products is ensured to be a non-defective product, the production quality of the electronic products is ensured, and the production efficiency of the electronic products is improved. And the effective efficiency is improved.

The utility model discloses a chip write-in jig convenient to wind, which relates to the field of chip production and comprises a workbench and a mounting plate, the mounting plate is vertically fixed on the workbench, a base is fixed on the workbench, the base is in sliding connection with a chip material belt, a data write-in actuator is mounted on the base, and the data write-in actuator is connected with the mounting plate. The data write-in actuator is located below the chip material belt, and the chip material belt is connected with the winding mechanism. According to the chip writing jig convenient to wind, the continuous intermittent winding mechanism is adopted, a chip material belt can intermittently move, continuous writing of data of multiple chips is achieved, automatic winding of the chip material belt can also be achieved, basic guarantee is provided for data writing of the chips on the chip material belt, the elastic pressing mechanism is matched, and the chip material belt can be conveniently wound. Certain resistance can be generated on movement of the chip material belt, so that the chip material belt can be ensured to be in a straightened state, and normal operation of the device is further ensured.

The invention relates to the technical field of vacuum-solid mixed digital low-light-level devices, and particularly discloses a novel digital low-light-level imaging device and a manufacturing method of the novel digital low-light-level imaging device, and the novel digital low-light-level imaging device is characterized in that a photoelectric cathode is arranged below an input window; the micro-channel plate is arranged below the photoelectric cathode; the anode assembly is arranged below the microchannel plate, the anode assembly comprises a multilayer ceramic base, a chip heat dissipation assembly, a CMOS chip, a fluorescent screen and a getter, the chip heat dissipation assembly is arranged on the multilayer ceramic base, the CMOS chip is arranged on the chip heat dissipation assembly, the fluorescent screen is arranged on the CMOS chip, the CMOS chip is used for receiving optical signals output by the fluorescent screen, and the getter is arranged on the fluorescent screen. The signal is converted into a digital signal to be output; the input window, the photoelectric cathode, the front-end tube shell and the anode assembly are packaged together from top to bottom to form a vacuum cavity; and the high-voltage power supply provides working voltage for the digital low-light imaging device and realizes self-adaptive control of the output brightness of the device along with the working illumination according to a rear-end signal, and the high-voltage power supply comprises three paths of high-voltage outputs, namely cathode voltage, micro-channel plate voltage and anode voltage.

An integrated sensor component includes a chip carrier and a first semiconductor chip and a second semiconductor chip, wherein either both semiconductor chips are arranged on the chip carrier or (alternatively) the second semiconductor chip is arranged on the chip carrier and the first semiconductor chip is arranged on the second semiconductor chip (chip-on-chip). The integrated sensor component further includes a first sensor element integrated in the first semiconductor chip and a second sensor element integrated in the second semiconductor chip, as well as a housing formed by a potting compound, which has an opening. Both the first sensor element and the second sensor element are located within the opening so that they can interact with the atmosphere surrounding the sensor component.

The invention discloses a mushroom multi-mode intelligent sorting and RFID traceability system and method, an ESP32 chip and Raspberry Pi 4B are used as main control chips, the Raspberry Pi 4B carries a YOLOv8 model, and the Raspberry Pi 4B is externally connected with a USB camera module to realize deep learning machine vision identification of mushrooms so as to obtain appearance characteristics, classification varieties and quality grades of the mushrooms. The humidity sensor, the gas sensor, the weight sensor and the RFID module are integrated on the ESP32 chip, the ESP32 chip transmits information of various sensors to the Raspberry Pi 4B, the Raspberry Pi 4B classifies shiitake mushrooms by fusing the information of various sensors and shiitake mushroom image identification information on the basis of timestamps, and classification results are written into the RFID module to be made into RFID tags. By the adoption of the system and method, the problem that an existing shiitake mushroom sorting system cannot comprehensively evaluate physical and chemical indexes and recessive quality of shiitake mushrooms is solved.

The application relates to the field of semiconductors and discloses a common-source common-gate GaN device and a preparation method thereof. The common-source common-gate GaN device comprises a lead frame base island, a MOS chip and a GaN chip. The lead frame base island is provided with a first conductive area serving as a source of the GaN device. The source of the MOS chip is arranged on the back surface, and the gate and the drain are arranged on the front surface. The source on the back surface of the MOS chip is electrically connected with the first conductive area. The GaN chip is stacked on the MOS chip. The source, the gate and the drain of the GaN chip are arranged on the front surface, and the back surface of the GaN chip is also provided with the source. The source on the back surface of the GaN chip is electrically connected with the drain on the front surface of the MOS chip. Alternatively, the front surface of the MOS chip is also provided with the source, the front surface of the GaN chip is provided with the drain, the back surface is provided with the source and the gate, and the source and the gate on the back surface of the GaN chip are electrically connected with the drain and the source on the front surface of the MOS chip in correspondence. The application can reduce the size of the GaN device and lower the cost.

The application provides a liquid electrolyte-based MEMS electrochemical gas sensor and a preparation method thereof, and belongs to the technical field of gas sensors, and aims to solve the technical problem of poor sealing of the MEMS electrochemical gas sensor.The sensor comprises an upper chip and a lower chip, the upper chip is bonded above the lower chip, a microcavity, an air inlet hole and a working electrode, the working electrode has a part of regions in contact with electrolyte in the microcavity and another part of regions in contact with air through the air inlet hole, and a counter electrode, the counter electrode is located on the inner wall of the microcavity, the inner wall where the counter electrode is arranged is provided with a through hole, the counter electrode is arranged on the through hole, the through hole penetrates the upper chip or the lower chip and is in communication with the outside, and the through hole is filled with a metal conductor and is connected with the counter electrode.The MEMS electrochemical gas sensor arranges the lead wire and the pad on the non-bonding surface of the sensor by using the glass through hole or the silicon through hole technology, so that the silicon-glass bonding surface is free of other substances, the bonding is compact, and the sealing performance of the sensor is improved.

The invention belongs to the technical field of optical detection of biological samples, and particularly relates to an optical detection system for converging detection light. The invention provides an optical detection system for converging detection light, and aims to solve the problem of low detection precision caused by the fact that an optical detection system in the prior art cannot converge light. The invention discloses an optical detection system for converging detection light. A detection cavity for preventing external light from entering and accommodating at least one part of the test tube is formed in the base; a chip for receiving light rays is arranged on the base, and the inner wall of the detection cavity is a light condensing surface for reflecting the light rays emitted by a sample in the test tube to the chip; according to the invention, the detection cavity is arranged, and the inner wall of the detection cavity is the light condensing surface for reflecting the light emitted by the sample in the test tube to the chip, so that more light emitted by the sample in the test tube can be reflected to the chip, and the chip can receive more light, thereby improving the detection precision.

The application relates to the technical field of photoelectric packaging, and discloses a CPO packaging structure based on a glass carrier plate, which comprises a glass carrier plate, an ASIC chip, a silicon optical chip, an electronic chip, a laser element, a positioning socket and a fiber array, the ASIC chip, the silicon optical chip and the positioning socket are all mounted on the glass carrier plate, and the electronic chip and the laser element are arranged on the silicon optical chip; the ASIC chip and the electronic chip are electrically connected with a rewiring layer of the glass carrier plate, and the laser element is optically connected with a waveguide layer of the silicon optical chip; the fiber array is also provided with a plug structure, the plug structure is detachably connected with the positioning socket; the fiber array is also provided with a protruding end, the protruding end is located on a side of the positioning socket away from a fiber body, a first coupling part is arranged on a lower part of the protruding end, the first coupling part is optically connected with the fiber body; a second coupling part is arranged on an upper part of a side of the silicon optical chip close to the positioning socket, the second coupling part is optically connected with the waveguide layer, and the first coupling part and the second coupling part are optically connected in a top-bottom opposite mode.

The heat exchanger comprises a core body, the core body comprises at least two sets of chip assemblies which are sequentially arranged in a stacked mode in the vertical direction, each chip assembly comprises an upper chip and a lower chip which are sequentially arranged in a stacked mode from top to bottom, and the upper chips and the lower chips are correspondingly provided with circulation openings which communicate with each other; a lower chip which is located above an upper chip and is adjacent to the upper chip in a core body is defined as a first chip, the peripheral edge of a circulation opening of the upper chip extends upwards to form a flange, the top edge of the flange is provided with a limiting piece, and at least part of the limiting piece is located in a circulation opening of the first chip; at least part of the outer wall face of the limiting piece makes contact with the corresponding position of the peripheral edge of the first chip circulation opening, a space ring is arranged between every two adjacent chip assemblies, and the space rings are arranged on the peripheries of the turned-over edges in a sleeving mode and connected with the adjacent upper chips and the lower chips. Therefore, the strength of the heat exchanger is better, and the service life of the heat exchanger is prolonged. The production complexity is reduced, and the production is convenient.

The utility model relates to the technical field of test auxiliary equipment, in particular to a multi-light compensation device for chip dispensing detection, which comprises an image collector and a double-color light source for supplementing light to a chip, the double-color light source comprises an annular light source main body, and a red light source and a blue light source which are arranged on the light source main body, the middle of the light source body is hollowed out, and the image collector is located above the double-color light source and right faces the hollowed-out middle of the light source body. The chip channel is used for allowing the chip to move, the blocking piece comprises a blocking rod capable of moving, the moving direction of the blocking rod is perpendicular to the moving direction of the chip on the chip channel, the side edge of the blocking rod can make contact with the chip, and the double-color light source is arranged above the blocking rod. By adopting the scheme, light source supplementation can be performed for image acquisition in the chip production process, and the definition of the acquired image is improved.

The invention relates to the field of semiconductors, and discloses a cascode GaN device and a preparation method thereof, and the cascode GaN device comprises a lead frame base island, an MOS chip and a GaN chip. A first conductive region serving as a source electrode of the GaN device is arranged on the lead frame base island; a source electrode of the MOS chip is arranged on the back surface, and a grid electrode and a drain electrode are arranged on the front surface; a source electrode on the back surface of the MOS chip is electrically connected with the first conductive region; the GaN chip is stacked on the MOS chip, a source electrode, a grid electrode and a drain electrode of the GaN chip are arranged on the front surface of the GaN chip, a source electrode of the GaN chip is also arranged on the back surface of the GaN chip, and the source electrode on the back surface of the GaN chip is electrically connected with the drain electrode on the front surface of the MOS chip; or the front surface of the MOS chip is also provided with a source electrode, the front surface of the GaN chip is provided with a drain electrode, the back surface of the GaN chip is provided with a source electrode and a grid electrode, and the source electrode and the grid electrode on the back surface of the GaN chip are correspondingly and electrically connected with the drain electrode and the source electrode on the front surface of the MOS chip. The size of the GaN device can be reduced, and the cost of the GaN device is reduced.

The application relates to the technical field of chip packaging, in particular to a laser radar module applying a chip stacking structure and a chip stacking method thereof, wherein the module comprises: Vcsel chips and SPAD chips; the Vcsel chips are flip-chip attached on the SPAD chips, the Vcsel chips and the SPAD chips are respectively provided with a plurality of connecting pins on the attaching surfaces thereof, and the connecting pins of the Vcsel chips are connected with the connecting pins of the SPAD chips in correspondence. The scheme can reduce the structural size of a dToF module product.

The utility model discloses a mirror surface photodiode of high light transmission, including chip substrate and array setting mirror surface chip on chip substrate, mirror surface chip includes bottom piece, diode crystal, light -transmitting lens, package cover shell, conducting sheet and first paster pin, bottom piece top is connected with diode crystal through conducting sheet, and diode crystal is used for sensing light, conducting sheet passes through first paster pin and the electrical connection of second paster pin of chip substrate bottom, the package cover shell is located bottom piece top, and the package cover shell is equipped with light -transmitting lens, and light -transmitting lens is used for making light ray penetrate and enter diode crystal, the utility model discloses through array arrangement mirror surface chip on chip substrate, can form a large range of photosensitive area, thereby improve the photosensitive coverage range of whole photodiode, make photosensitive diode can large -area capture light ray, effectively improve the photoelectric conversion efficiency and response speed of photosensitive diode.

This invention discloses a microfluidic chip, its fabrication method, and a molecular measurement method utilizing the same. The microfluidic chip includes an upper chip and a lower chip. The lower surface of the upper chip and the upper surface of the lower chip can be attached to each other, and the upper and lower chips can slide relative to each other along the attached surfaces. The lower surface of the upper chip has a first fluid channel structure for loading a first reactant and a second fluid channel structure for loading a second reactant. The upper surface of the lower chip has a microporous structure. When the upper and lower chips slide relative to each other, the vertical projection of the first or second fluid channel structure can be aligned with the microporous structure, allowing the first and second reactants to enter the microporous structure stepwise. This invention can increase the magnetic bead loading rate to approximately 90%, significantly improving detection performance. Furthermore, the stepwise loading scheme of this invention can significantly reduce background values, offering a more significant advantage in multiplex detection.

This invention belongs to the field of optical detection technology for biological samples, specifically relating to an optical detection system for converging detection light. This invention provides an optical detection system for converging detection light, aiming to solve the problem of low detection accuracy caused by the inability of existing optical detection systems to converge light. An optical detection system for converging detection light includes a base; a detection cavity is provided within the base to prevent external light from entering and to accommodate at least a portion of a test tube; a chip for receiving light is provided on the base, and the inner wall of the detection cavity serves as a focusing surface that reflects the light emitted by the sample in the test tube onto the chip. By setting up a detection cavity, and ensuring that the inner wall of the detection cavity reflects the light emitted by the sample in the test tube onto the focusing surface of the chip, this invention allows more light emitted by the sample in the test tube to be reflected onto the chip, enabling the chip to receive more light and thus improving detection accuracy.

The application provides a preloading device for chip handle, which is used for preloading chip handle on a chip, and the chip is carried on a carrier mechanism, and the preloading device comprises a preloading mechanism and a preloading manipulator; the preloading mechanism comprises a preloading support, a carrying assembly, a transfer assembly and a pressing assembly; the carrying assembly is arranged on the preloading support in a liftable manner; the transfer assembly and the pressing assembly are arranged on the carrying assembly; the preloading manipulator is used for placing the chip handle on the transfer assembly; the carrying assembly drives the transfer assembly to move above the carrier mechanism used for carrying the chip; and the pressing assembly is used for pressing the chip handle on the transfer assembly on one end of the chip of the carrier mechanism. The scheme can greatly improve the work efficiency, accurately and safely preloads the chip handle on the chip, and improves the qualified rate of chip handle installation.

The utility model discloses a chip surface cleaning mechanism for a chip mounter. The chip surface cleaning mechanism comprises a wiping structure, wherein the wiping structure comprises a support column I; the upper side of the first supporting column is fixedly connected with a moving structure, and the moving structure comprises a second supporting column, a first connecting plate and a sliding rail. The moving structure is arranged, when the motor is started, the motor firstly drives the first transmission wheel to rotate, and when the first transmission wheel rotates, the transmission belt is driven to operate between the first transmission wheel and the second transmission wheel; when the transmission belt moves, the transmission belt acts on the driving column to move left and right on the upper side of the sliding rail, and finally the absolute ethyl alcohol storage device and the spray head are driven to move at the same time, absolute ethyl alcohol is sprayed to patches on the patch transmission belt, and oil stains on the surfaces of the patches are cleaned. And the spraying head can be driven to spray sewage ethanol to the veneering surface, oil stains on the veneering surface can be dissolved, large-range spraying can be achieved, and cleaning comprehensiveness is guaranteed.

The application discloses a kind of integrated wave division demultiplexing receiver structure and chip on chip, including wave division demultiplexing module and multiple groups of photoelectric detector, wave division demultiplexing module includes cascaded first stage wave division demultiplexer and second stage wave division demultiplexer.By wave division demultiplexing module, one original light multiplex signal containing N channels is demultiplexed into N first sub-optical signals and N second sub-optical signals.Then the sub-optical signals from the same channel are input into the corresponding photoelectric detector in the same group of photoelectric detector, to be converted into corresponding electrical signal and output respectively.Finally, all electrical signals output by the same group of photoelectric detector are configured as superimposed output, to be used as the optical detection output of corresponding channel.Compared with prior art, not only the effect of large channel bandwidth, low insertion loss and low crosstalk can be achieved, but also the effect of accurately monitoring the intensity of optical signal of each channel is achieved.