4results about How to "Improve process capability" patented technology

A semiconductor processing device and its base support assembly include a central support pillar and at least three edge support pillars. The central support pillar coincides with the central axis of the base, limiting base eccentricity after heating and solving the eccentricity problem caused by the different linear expansion of the support pillar and the base. By reducing the cross-sectional area of ​​the central support pillar, the influence of light refraction and reflection on the thermal radiation optical path of the base is reduced. By reducing the contact area between the support pillar and the base, temperature conduction is reduced, thereby improving temperature uniformity. Each support pillar includes an upper pillar and a lower pillar made of different materials. The light absorption rate of the upper pillar is the same as or similar to that of the base, making the temperature difference between the upper pillar and the base approach zero, ensuring good temperature uniformity of the base. The upper pillar has extremely low thermal conductivity, which can block heat conduction from the upper pillar to the lower pillar, reducing heat loss, ensuring heat balance of the base, and improving the temperature distribution uniformity of the substrate.

The application provides a semiconductor device manufacturing method, an etching control method, a system and a storage medium. The semiconductor device comprises a substrate and a semiconductor structure on the substrate. The semiconductor device manufacturing method comprises: performing first etching on the semiconductor device to form a first opening on the semiconductor device; obtaining parameter changes of the first etching during the formation of the first opening and forming a data record; determining etching process parameters of second etching according to the data record and a preset data record; and performing second etching on the semiconductor device according to the etching process parameters of the second etching and the first opening to form a second opening comprising the first opening in the semiconductor device. The etching process parameters of the second etching are determined according to the data record and the preset data record, so that the process size of the formed second opening is stable, and the yield and process capability of the device are improved.

The utility model relates to the technical field of machining, in particular to a cutter for solving the sealing problem of a pressing shell. The tool comprises a tool handle, a tool apron and a tool bit, the two groups of tool bits are fixed on the tool apron; the tool apron is used for being connected with the tool handle and is of a central symmetry structure. After the cutter holder is connected with the cutter handle, the two groups of cutter heads arranged on the cutter holder are symmetrically arranged relative to the axis of the cutter handle; the cutter handle is connected with a spindle of a machining center. And the machining center drives the main shaft to rotate so as to drive the cutter to rotate at a high speed to machine the to-be-machined pressing shell. The tool bit comprises a flat machining part and a convex machining part; the convex machining parts are arranged on the side, close to the symmetry axis, of the flat machining part, the flat machining part is used for machining a pipe orifice face, and the convex machining parts are used for machining sealing grooves; the pipe orifice surface and the sealing groove are formed by one-step processing; the machining efficiency is improved, the machining precision is guaranteed, and the working procedure capability is greatly improved.

The utility model discloses a lockset reshaping jig which comprises an upper die base, a lower die base, a lockset and reshaping blocks, a reshaping cavity is formed in the top of a lower die, a plurality of reshaping blocks are arranged in the reshaping cavity, the lockset is located in the reshaping cavity and located between the reshaping blocks on the two sides, and the lockset is formed through powder metallurgy injection molding. The production efficiency is improved, the precision is improved, the cost is reduced (traditional die-casting and stamping processes are replaced), the processing capability of the product is improved, the next process can be carried out only when the size, the appearance and the surface roughness can meet the requirements, and the yield of the product is improved.