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5results about How to "Increase layout area" patented technology

Intelligent host and wearable device

ActiveCN224140802UIncrease layout areaIncrease the number of placementsSensorsDiagnostic recording/measuringEmergency medicineHuman health
The utility model relates to the technical field of wearable equipment, in particular to an intelligent host and wearable equipment. The intelligent host comprises a housing; the health monitoring module is arranged in the machine shell, and the monitoring end of the health monitoring module faces the near-skin side of the machine shell; the card support assembly is arranged in the machine shell and located on the far-skin side of the health monitoring module; the charging part is arranged on the side face of the machine shell, and the charging part is used for charging the intelligent host. The accuracy of monitoring the human body health index by the health monitoring module can be improved; and the charging part is arranged on the side surface of the shell, so that the charging part can be farther away from the health monitoring module, the negative influence of an electromagnetic field and heat generated by the charging part during charging on the health monitoring module can be reduced, and the service life of the health monitoring module is prolonged.
Owner:GUANGDONG XIAOTIANCAI TECH CO LTD

Display panel and display device

The embodiment of the invention provides a display panel and a display device. The display panel comprises a substrate, a conductive layer, an interval insulating layer, a driving circuit layer and a light-emitting layer, the conductive layer is arranged on one side of the substrate, the conductive layer comprises metal wires, and at least part of the metal wires are multiplexed as antenna units; the interval insulating layer is arranged on one side, deviating from the substrate, of the conductive layer; the driving circuit layer is arranged on one side, deviating from the substrate, of the interval insulating layer; the light-emitting layer is arranged on the side, away from the first substrate, of the driving circuit layer. The antenna unit is arranged between the substrate and the light-emitting layer, the arrangement area of the antenna unit and the flexibility of the arrangement position are improved, the radiation intensity of the antenna unit is improved, and the use performance of the display panel is improved.
Owner:YUNGU GUAN TECH CO LTD

Folding multi-satellite distributor and unfolding and releasing method thereof

The invention provides a folding multi-satellite distributor and an unfolding and releasing method thereof, and belongs to the technical field of spacecraft launching. The foldable multi-star distributor comprises a plurality of single distributor bodies, distributor connecting columns and distributor unfolding arms. In the launching process, the multiple single distributors are longitudinally stacked and pressed through the distributor connecting columns to form a compact overall stacked body, folding of the layout area is achieved, and the space utilization rate in the fairing is increased. After orbit injection, the distributor unfolding arms drive the adjacent single distributors to generate spatial dislocation unfolding, and unfolding bodies for separation of the small satellites are formed. Through folding and unfolding of the distributor, on the premise that the size of the fairing is not increased, the arrangement area of the small satellites and the single-rocket launching number are multiplied, the carrying capacity is improved, and the single-rocket multi-satellite networking launching device is particularly suitable for one-rocket multi-satellite networking launching.
Owner:SHANGHAI SATELLITE ENG INST

A plastic processing air-cooled structure for injection molding

ActiveCN224465193Uspeed up coolingIncrease layout areaThermal waterCooling pipe
The utility model discloses a kind of air cooling structures for plastic processing injection molding, including injection molding movable mould, injection molding fixed mould, left half end air cooling frame and right half end air cooling frame, the upper side of one side of the injection molding movable mould is equipped with movable mould cold water inlet, the upper side of one side of the injection molding fixed mould is equipped with fixed mould cold water inlet, the lower side of the other side of the injection molding movable mould and injection molding fixed mould is equipped with hot water outlet, the left half end air cooling frame is equipped in the bottom surface of injection molding movable mould, the right half end air cooling frame is equipped in the bottom surface of injection molding fixed mould, the inside of the left half end air cooling frame is equipped with left air cooler. The utility model can be equipped with cooling pipe in the inside of left air cooler and right air cooler, the installation structure can increase the area of cooling pipe layout, to expand the range of cooling, not only cooling injection molding product located in mould, but also cooling plastic product after mould stripping, so that it has the effect of double cooling, improve the effect of cooling.
Owner:SUZHOU OUBANG PLASTIC CO LTD

Packaging structure of power semiconductor module

PendingCN121941351AElongate air discharge pathincrease electrical clearanceSemiconductor chipCeramic substrate
The invention provides a packaging structure of a power semiconductor module, which relates to the technical field of semiconductor packaging and comprises a shell, a direct copper-clad ceramic substrate is fixed on the inner wall of the bottom of the shell, and a power semiconductor chip, a signal terminal and a power terminal are welded on the direct copper-clad ceramic substrate; insulating baffles are arranged at the connecting positions of the side faces of the shell, and / or insulating parts are arranged on the outer walls of the two sides of the shell in the width direction respectively. The beneficial effects are that on the premise of being compatible with the original installation environment, the electrical safety and the installation convenience are synchronously improved.
Owner:STARPOWER SEMICON LTD