147results about How to "Increase layout area" patented technology

An assembly structure for an embedded passive device is provided, including at least one passive device embedded in a through hole of a core layer in a circuit substrate. The embedded passive device comprises plural electrodes, which electrically connect through the top side and the bottom side of the core layer. Because the vertically embedded passive device does not occupy the layout area of internal circuit of the circuit substrate, the layout area of the circuit substrate can be increased, the signal transmission route can be reduced, and the performance of signal transmission can be enhanced.

Bandgap reference voltage generation circuit in semiconductor memory device includes a first current generator configured to generate a first current proportional to a change of a temperature by using temperature characteristic of a diode-connected MOS transistor, a second current generator configured to generate a second current inversely proportional to the change of the temperature by using the temperature characteristic of a diode-connected MOS transistor and a summation unit configured to mirror and sum the output currents of the first current generator and the second current generator, and output a reference voltage.

A display device includes a pixel array unit and a driver unit. A sampling transistor samples a signal potential to hold the signal potential in a holding capacitor. A driver transistor flows a drive current to a light emitting element in accordance with the signal potential held. A power supply scanner in the driver unit changes a power supply line from a first potential to a second potential before the sampling transistor samples the signal potential. A main scanner in the driver unit makes the sampling transistor conductive to apply a reference potential from the signal line to the gate of the driver transistor and to set the source of the driver transistor to a second potential. The power supply scanner changes the power supply line from the second potential to the first potential to hold a voltage corresponding to a threshold voltage off the driver transistor in the holding capacitor.

A semiconductor memory device includes a replica circuit including a plurality of replica cells (RMC) having the same elements as those of memory cells in a memory array and outputting signals with levels in the stage number to a common replica bit line, and a sense amplifier control circuit for receiving a signal of the replica bit line to control a timing of a signal SAE for starting a sense amplifier circuit. The replica circuit includes a switching circuit (SW) for switching the stage number of the replica cells to be activated among the plurality of replica cells in a programmable manner.

Metal-oxide semiconductor (MOS) transistor offset-cancelling (OC), zero-sensing (ZS) dead zone, current-latched sense amplifiers (SAs) (CLSAs) (OCZS-SAs) for sensing differential voltages are provided. An OCZS-SA is configured to amplify received differential data and reference input voltages with a smaller sense amplifier offset voltage to provide larger sense margin between different storage states of memory bitcell(s). The OCZS-SA is configured to cancel out offset voltages of input and complement input transistors, and keep the input and complement input transistors in their activated state during sensing phases so that sensing is not performed in their “dead zones” when their gate-to-source voltage (Vgs) is below their respective threshold voltages. In other aspects, sense amplifier capacitors are configured to directly store the data and reference input voltages at gates of the input and complement input transistors during voltage capture phases to avoid additional layout area that would otherwise be consumed with additional sensing capacitor circuits.

A semiconductor device capable of high-speed operation. The semiconductor device includes a first transistor, a second transistor, and a capacitor. One of a source and a drain of the first transistor is supplied with a first signal. One of a source and a drain of the second transistor is supplied with a first potential. A gate of the second transistor is supplied with a second signal. A first electrode of the capacitor is electrically connected to the other of the source and the drain of the first transistor. A second electrode of the capacitor is electrically connected to the other of the source and the drain of the second transistor. In a first period, the first signal is low and the second signal is high. In a second period, the first signal is high and the second signal is either low or high.

A level shift element adjusting a voltage level at the time of selection of a word line according to fluctuations in threshold voltage of a memory cell transistor is arranged for each word line. This level shift element lowers a driver power supply voltage, and transmits the level-shifted voltage onto a selected word line. The level shift element can be replaced with a pull-down element for pulling down the word line voltage according to the threshold voltage level of the memory cell transistor. In either case, the selected word line voltage level can be adjusted according to the fluctuations in threshold voltage of the memory cell transistor without using another power supply system. Thus, the power supply circuitry is not complicated, and it is possible to achieve a semiconductor memory device that can stably read and write data even with a low power supply voltage.

According to an exemplary embodiment, an ESD protection structure situated in a semiconductor die includes a FET including a gate and first and second active regions, where the gate includes at least one gate finger, and where the at least one gate finger is situated between the first and second active regions. The ESD protection structure further includes at least one contact-via chain connected to the first active region, where the at least one contact-via chain includes a contact connected to a via. The at least one contact-via chain forms a ballast resistor for increased ESD current distribution uniformity. The contact is connected to the via by a first metal segment situated in a first interconnect metal layer of a die. The at least one contact-via chain is connected between the first active region and a second metal segment situated in a second interconnect metal layer of the die.

A current source circuit for the multi-parallel circuited LED driven by a single reference current including: a current mirror, a error amplifier, a regulator tube, a reference current, other multi-driving tubes and VDS clamp circuit. The characteristic is that: the VDS clamp circuit respectively connects with the drain-leakage end of the MN1 and the input of the error amplifier. The current mirror and the grid terminals of other multi-driving tubes are driven by a common Vdrive signal. During the normal working hours, the MN0 and MN1 drain-leakage end voltages of the MOS tube keep consistent under the effects of the error amplifier and the regulator tubes, the other driving tubes and MN1 can obtain a good current-matching even there is a small difference between the drain-leakage end voltages. During the abnormal working hours, the VDS clamp circuit can provide an appropriate bias voltage to make sure that the other driving tubes do not guide a high current and keep the LED in a normal state regardless of the leakage of MN1.

A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.

The invention relates to a touch control display panel, which comprises a substrate, a light shielding matrix layer and a sensing circuit, wherein the sensing circuit is positioned on one side surface of the substrate to form a single layer structure, is positioned in a vertical projection part of the light shielding matrix layer and comprises a plurality of driving electrodes, a plurality of sensing electrodes and a plurality of conducting wires, in addition, the driving electrodes and the sensing electrodes are mutually insulated and separated, and the conducting wires are respectively connected with each driving electrode and each sensing electrode, wherein the sensing electrodes, the driving electrodes and the conducting wires are all positioned in the single layer. The invention also discloses a touch control display device. The touch control display panel and the touch control display device provided by the invention have the advantages that under the condition of not increasing the light transmission loss, the distribution area of the sensing circuit can be increased, so that the goals of improving the sensitivity of the touch control display panel and the touch control display device, reducing the integral resistance-capacitance load and improving the integral efficiency are achieved.

A shift register circuit including a logic circuit capable of controlling the threshold voltage of a transistor and outputting a signal corresponding to an input signal by changing only the potential of a back gate without changing the potential of a gate is provided. In a shift register circuit including a logic circuit with a first transistor and a second transistor having the same conductivity type, a first gate electrode of the first transistor is connected to a source electrode or a drain electrode of the first transistor, an input signal is supplied to a second gate electrode of the first transistor, a clock signal is supplied to a gate electrode of the second transistor, and the first gate electrode and the gate electrode are formed from the same layer.

The invention discloses an improved cascode radio frequency power amplifier. A common-source-stage transistor grid electrode G1, a common-source-stage transistor source electrode S, a common-grid-stage transistor grid electrode G2 and a common-grid-stage transistor drain electrode D are transversely arranged on a substrate, a radio frequency input end RFin is connected with the common-source-stage transistor grid electrode G1 through a metal routing wire, the common-source-stage transistor source electrode S is connected with a grounding hole array through a metal routing wire, the common-grid-stage transistor grid electrode G2 is connected with a bias circuit through a metal routing wire, and the common-grid-stage transistor drain electrode D is connected with a radio frequency output end RFout through a metal routing wire. A cascode structure is adopted, and a layout structure is optimized, so that the improved cascode radio frequency power amplifier has the advantages of high gain, high power, high linearity, high efficiency and the like; layout area equivalent to that of a single-transistor common-source structure radio frequency power amplifier is maintained, so that low cost is realized.

A pixel array including a pixel electrode and an active device is provided. The active device includes a gate, a channel layer, a source, a drain, a connection electrode, a first branch portion and a second branch portion. The gate is electrically connected with a scan line. The channel layer located at a side of the gate is electrically isolated from the gate. The source, the drain and the connection electrode are disposed on a part region of the channel layer. The first branch portion disposed on a part region of the channel layer is connected with an end of the connection electrode. The first branch portion surrounds the source located on the channel layer. The second branch portion disposed on a part region of the channel layer is connected with the other end of the connection electrode. The second branch portion surrounds the drain located on the channel layer.

The invention provides a pre-embedded and prefabricated magnetic attraction end guiding type building crack repairing device and a method based on magnetic force. The device comprises a steel bar pre-embedded in a reinforced concrete beam body; the steel bar is wound with a tinned copper wire; the tinned copper wire penetrates through a reserved wire interface pre-formed in the reinforced concrete beam body; the tinned copper wire is connected with an electromagnetic induction device used for providing current; a guide hole is formed in the position, where a crack easily occurs, of the reinforced concrete beam body; and the guide hole is connected with a high-pressure jet grouting machine through a grouting pipe, and then magnetic mortar is injected into the crack. The magnetic mortar is injected into a required position under the guide adsorption of different magnetic attraction ends, so that the sufficient grouting effect is achieved, and the crack repairing and filling rate is increased. According to the pre-embedded and prefabricated magnetic attraction end guiding type building crack repairing device and the method based on the magnetic force, the needed materials are simple, the assembly cost is low, and the device has prefabrication performance, is fast to operate, and is high in crack repair guiding effect and long in duration time.

An apparatus for finely adjusting the input capacitance of a semiconductor device and a method of fabricating the apparatus are disclosed. The invention adjusts finely the input capacitance without increasing a layout area of the device by using a capacitor constructed with a poly layer/device isolation layer/P-type substrate. The poly layer is formed on an unnecessary space provided by the device isolation layer under an input pad.

A mobile terminal which includes a housing and an image pickup module disposed on the housing, the frame of the shell is provided with perforations, the image pickup module includes an image sensor, alight-transmitting device and a first lens and a second lens facing the front and rear sides of the mobile terminal, respectively, the image sensor is movably disposed on the housing, and switchablebetween a first position and a second position, the first lens is fixed on the image sensor, the second lens and the light transmitting device are fixed in the inner cavity of the housing, and the mobile terminal is provided with a window opposite to the second lens. When the image sensor is in the first position, the first lens extends out of the housing through the hole of the image sensor, andthe first lens is used for guiding light into the image sensor. When the image sensor is in the second position, the first lens moves with the image sensor into the lumen and is blocked by the housing, and the light transmitting device conducts light passing through the second lens to the image sensor. The scheme can solve the problem that the screen occupancy of the mobile terminal is relativelysmall.

A mobile terminal includes a housing (100) and an imaging module (200) provided on the housing (100), An image pickup module 200 includes an image sensor 210, a light conduct device (220), and a firstlens 230 and a second lens 240, which are fixed on both sides of the light conduction device, and facing the front and rear sides of the mobile terminal, a light conductive device (220) is movably disposed on the housing (100) and is switchable between a first position in which the light conductive device (220) conduct light entering the first lens (230) to the image sensor (220) and a second lens (240) is shield by the housing (100) and a second position in which the light conductive device (220) conducts light entering the second lens (240) to the image sensor (220), and the first lens (230) is blocked by the housing (100). The scheme can solve the problem that the screen occupancy of mobile terminal is relatively small.