63results about How to "Improve design flexibility" patented technology

The invention provides an electronic device, a ceramic substrate and a preparation method thereof, and relates to the technical field of semiconductors. The ceramic substrate comprises a ceramic base body and a liquid channel layer, the liquid channel layer is arranged in the ceramic base body, the liquid channel layer and the ceramic base body are integrally sintered and formed, the liquid channel layer comprises a liquid channel, the liquid channel is used for containing a cooling medium, and the liquid channel extends in the ceramic base body along a three-dimensional space path. The preparation method of the ceramic substrate comprises the following steps: preparing slurry containing ceramic powder, preparing a sacrificial template matched with a target liquid channel in shape, pouring the slurry to coat the sacrificial template, filling a mold with the slurry to obtain a ceramic blank, removing the sacrificial template to form a hollow channel in the ceramic blank, and sintering to form the ceramic substrate with the liquid channel. The electronic device comprises the ceramic substrate, a component and a liquid cooling circulation system.

This application discloses an inductor structure and its fabrication method, equipment, and dielectric. The inductor structure includes an inductor winding, a magnet, and a metal frame. The magnet encloses the inductor winding to form a cuboid inductor body. The metal frame covers the top and / or bottom of the cuboid inductor body and connects to the inductor winding terminals that are extended and bent to the top and / or bottom of the cuboid inductor body. By adding a metal frame to the inductor surface, an inductor structure with electrical interconnect design is achieved, which is compatible with mature molding inductor manufacturing methods and semiconductor processes. Advanced system-in-package (SIIP) requires higher dimensional accuracy than general inductor manufacturing capabilities, limiting the flexibility of package design. The electrode reconfiguration method provided by this invention can solve this accuracy mismatch and improve design flexibility.

The application relates to a planetary shaft structure in the technical field of differentials, which comprises a left half shaft gear, a right half shaft gear arranged opposite to the left half shaft gear, and four planetary gears arranged in a cross shape between the left half shaft gear and the right half shaft gear and meshed with the two gears, wherein a main support is arranged through the coaxial two planetary gears of one opposite arrangement, an auxiliary support is arranged through the coaxial two planetary gears of the other opposite arrangement, the two auxiliary supports are respectively arranged on the two sides of the main support, and each auxiliary support is connected with the main support through a positioning piece; the whole planetary shaft structure is simple and clear, the setting of a planetary support is cancelled, the self-strength and mounting strength of the left half shaft gear, the right half shaft gear and the four planetary gears are improved, the design flexibility of the whole planetary shaft structure is improved, and the design complexity and cost of the differential assembly are reduced.

The invention discloses a resonance regulation and control system based on symmetry control. The resonance regulation and control system comprises a low-symmetry metal spiral structure and an excitation microstrip circuit. The low-symmetry metal spiral structure is composed of four metal spiral arms, and the four metal spiral arms have two different lengths. The excitation microstrip circuit sequentially comprises a metal strip, a dielectric substrate layer and a metal ground plane; the resonator introduces an electromagnetic resonance mode excited by a first-order current through the asymmetric design of a low-symmetry metal spiral structure, and realizes the regulation and control of resonance characteristics.

The utility model belongs to the technical field of electronic atomization, and provides a light-emitting assembly and an electronic atomizer thereof, the light-emitting layer, the light guide layer and the light uniformizing layer are arranged in a stacked mode, light emitted by the light-emitting layer sequentially passes through the light scattering effect of the light guide layer and the light uniformizing layer, and the uniformity of the light emitted outwards by the light-emitting assembly is ensured. Through the guiding and uniform dispersing effects of the light guide layer and the light equalizing layer on the light emitted by the light emitting part, the uniform light emitting effect is achieved, the phenomenon that the local brightness of the area where the light emitting part is located is highlighted is effectively avoided, and the phenomenon that lamp beads are exposed is avoided.

The application discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a pixel structure and a scanning driving circuit. The pixel structure is electrically connected with the scanning driving circuit. In the direction perpendicular to the plane where the substrate is located, the pixel structure and the scanning driving circuit are located on opposite sides of the substrate. The technical scheme of the embodiment of the application can improve the screen-to-body ratio of the display panel and the design flexibility of the scanning driving circuit.

The utility model provides a single-sided board multiplexing structure applied to a wireless charging system. The single-sided board multiplexing structure comprises a first single-sided FPC board which comprises a first copper layer, a first base film and a cover film; the second single-sided FPC board comprises a second copper layer, a second base film and a covering film; the thickness of the bonding layer is 3-8 microns, and the bonding layer is located between the first single-face FPC board and the second single-face FPC board and used for fixing the first single-face FPC board and the second single-face FPC board; and the copper layers of the first single-sided FPC board and the second single-sided FPC board are respectively positioned on the outer sides, and interlayer conduction is realized through the bonding layer. According to the utility model, two single-sided boards are overlapped to replace a traditional double-sided board structure, so that the material cost is reduced by more than 25%; through hole electroplating (PTH), double-side etching and other complex processes are omitted, the production process is simplified, and the comprehensive cost is reduced by 18%-22%; the single-sided board is processed in a split manner, so that the alignment error of double-sided imaging is avoided, and the yield loss is reduced; interlayer conduction is achieved through filling of the conductive adhesive or the solder, a traditional electroplating process is replaced, and the process complexity and the defect risk are reduced.

The invention relates to the technical field of textiles, and discloses a preparation process of a light-weight environment-friendly automotive trim non-woven fabric. According to the process, three layers of fiber components including regenerated polyester, bio-based polyester and natural fibers are prepared; a sandwich structure is constructed by adopting multi-guide-bar parallel net forming, online electrostatic spinning is performed on a bio-based microporous membrane between layers, and low-melting-point hot melt adhesive powder is applied; and after needling reinforcement and gradient hot air curing are conducted, far infrared preheating is combined with a cold pressing mold for hot punching forming. While the gram weight is reduced, the sound absorption coefficient is improved, and the sound absorption material has excellent flame retardance, self-cleaning performance and full-life-cycle closed-loop recycling capacity.

This disclosure provides a junction field-effect transistor (JFET) device, its fabrication method, and an electronic device. The p-type gate region is formed by implantation ions on the side of the n-drift layer away from the n+ substrate. Therefore, it eliminates the need for high-energy p-type ion deep implantation to achieve the p-type gate region, thereby improving production efficiency. The n-type channel layer can be formed using homoepitaxial growth, which improves device design flexibility and channel mobility. Therefore, compared to Figure 1, this disclosure avoids using deep p-type ion implantation to form the bottom p-type gate region and deep n-type ion implantation to form the n-type channel layer, thus improving device design flexibility, production efficiency, and channel mobility.

The application provides a kind of pareto optimal design method of wireless charging coil, medium, coil and system, it is related to wireless power transmission technical field.The application obtains scene parameters and constraint conditions, defines the boundary conditions and input of optimization;By integrating the weight vector into the state space of reinforcement learning, using the powerful exploration ability of deep reinforcement learning as an efficient search tool, quickly traversing the complex solution space, thus efficiently and globally exploring and obtaining the pareto optimal solution set reflecting the complete trade-off relationship between transmission efficiency and anti-offset performance.The application uses deep reinforcement learning to efficiently explore the design space and obtain a complete set of pareto optimal solutions, allowing for quick selection of optimal coil parameters based on different design preferences, significantly reducing the design cycle, and ensuring that the designed coil achieves the optimal trade-off in physical performance.

The utility model discloses a frame body structure of a cooling fan, which comprises a fan body, the fan body comprises a fan frame body, a fan device arranged in the fan frame body and a water tank arranged at the lower end of the fan frame body, the fan frame body is respectively provided with an air inlet and an air outlet, and the fan frame body is arranged in a circular shape. The lower end of the fan frame extends to be provided with a connecting part used for being connected with a water tank, the front end and the rear end of the fan frame are provided with an impeller assembly and a dustproof filter plate, an air inlet groove used for arranging the dustproof filter plate is formed in the fan frame along the air inlet, and an air outlet groove used for arranging an impeller is formed in the fan frame along the air outlet. The fan is reasonable in structural design, the fan is tightly and conveniently connected with a water tank through the circular connecting part at the lower end of the fan frame body, water leakage is avoided, the impeller assembly greatly improves impeller rotation stability, noise and collision are reduced, the service life is prolonged, the protective cover is rotationally clamped with the fixing clamping groove through the clamping teeth, installation and disassembly are convenient, and use is convenient. And later maintenance and replacement are facilitated.

The invention discloses a circuit board and a manufacturing method thereof, the circuit board comprises a first circuit layer, an insulating layer, a second circuit layer, a first conduction part and a conductive part, and the first circuit layer comprises a connecting pad; the insulating layer is located on the surface of the first circuit layer; the second circuit layer is located on the surface of the insulating layer, and a first through hole penetrates through the second circuit layer, the insulating layer and the connecting pad; the first conduction part penetrates through the first through hole, the first conduction part comprises a first part and a second part which are connected with each other, the first part is located in the first through hole, the second part protrudes out of the surface of the connecting pad, and the first conduction part is formed in an electroplating mode; the conductive portion covers the second portion and extends to a portion of the surface of the connection pad. According to the circuit board and the manufacturing method thereof, the second part protrudes out of the surface of the connecting pad, so that the connection reliability of the conduction part and the second part can be improved, the connection stability of an electronic element on the circuit board is further improved, and meanwhile, the size of the connecting pad can be effectively reduced.

The utility model discloses a kind of installation structures for cabinet air conditioner electric heating assembly in the technical field of air conditioning equipment, including shell, upper water pan, evaporator and lower water pan are sequentially arranged in vertical direction in shell, electric heating assembly and evaporator are spaced and parallelly arranged along front-back direction, bracket assembly is arranged in shell, bracket assembly includes support and support beam, along evaporator width direction, support is set in evaporator both sides, support is spaced and arranged with multiple mounting positions along evaporator length direction, support beam is detachably set on mounting position, and position can be switched between multiple mounting positions, installation part is set on any one of upper water pan and lower water pan, electric heating assembly has oppositely arranged first end and second end, electric heating assembly first end is connected with installation part, electric heating assembly second end is connected with support beam. The utility model solves the technical problem that the generality of electric heating assembly of existing installation structure is poor.

The application discloses a kind of convenient car door integrated type steel hinge bolt drop and take out structure, including the side wall outer plate, A column reinforcing plate and A column inner plate being sequentially arranged, there is cavity structure between A column reinforcing plate and A column inner plate, the middle part of cavity structure is provided with limit stopper reinforcing plate, lower end is provided with bolt drop prevention sealing plate, A column inner plate is provided with upper hinge inner installation bolt fixing tool via hole, lower hinge inner installation bolt fixing tool via hole and upper take-out port being arranged between the two, limit stopper reinforcing plate and upper take-out port position are opposite for accommodating dropped upper hinge inner installation bolt, bolt drop prevention sealing plate and lower hinge inner installation bolt fixing tool via hole position are opposite for accommodating dropped lower hinge inner installation bolt and / or upper hinge inner installation bolt.The bolt drop sealing plate structure is designed in the upper and lower hinges respectively in the application, can catch after dropping, not to slide into the deep cavity, while using magnetic tool, convenient to take out.

The utility model relates to the technical field of automobile LOGO lamp, especially a kind of automobile front sign LOGO lamp, including LOGO sign surface cover and bottom plate, LOGO sign surface cover and bottom plate buckle together form enclosed cavity, the cavity is equipped with light-emitting component, LOGO sign surface cover inner surface is coated with transparent primer layer and sputtering plating layer in sequence, and diffusion plate is additionally arranged in the cavity, can when not lighting, sputtering plating layer presents pure electroplating color by reflecting external light, when lighting, the light of light-emitting component can form soft white light after uniform diffusion by diffusion plate, realize the same front sign LOGO lamp in unlighted electroplating color and white light when lighting The double-state stable coexistence of two states and can be switched at any time, improve design flexibility;Moreover, the overall structure design is compact, and the installation space of existing automobile front grille is adapted.

The application discloses a kind of parameterized modeling-based optimization design method and system of centrifugal fan volute profile, belong to industrial centrifugal fan design field.The method includes: firstly, volute profile away from volute tongue side is constructed, determine the width of two circular arcs away from volute tongue side of volute;Second volute tongue profile parameterization constraint, define volute tongue opening degree β, volute tongue radius R, volute tongue center and impeller center distance D key parameter, volute tongue geometry is controlled by three parameters independently;Finally, profile fusion and optimization, adopt single circular arc to connect volute profile away from volute tongue side and volute tongue profile tangentially, avoid geometric over definition problem, complete overall modeling.By improving the degree of freedom of volute tongue area, effectively reduce the flow separation and impeller interference at volute tongue, optimize the uniformity of volute internal flow field.

The utility model discloses a square capacitor capable of realizing reutilization and self protection, which relates to the technical field of capacitors and mainly comprises a capacitor body and a protector body, the capacitor body is detachably connected with the protector body, the capacitor body comprises a packaging shell and a core body, an overcurrent protector is an overcurrent protector, and the protector body is a square capacitor. Moving notches are formed in the tops of the two side walls of the packaging shell; according to the utility model, through the arrangement of the double-end positioning piece, in an actual installation scene, once one elastic fastener is damaged due to overlarge stress, only the bridging strip needs to be simply deflected, and the positions of the two elastic fasteners are replaced, so that the installation of the overcurrent protector can be conveniently and manually implemented again in a short time; compared with an existing single elastic clamping piece fixing mode, the design flexibility of the positioning piece with the double ends is higher, even if the elastic clamping piece is damaged, installation parts do not need to be integrally replaced, the installation time is greatly shortened, and the installation difficulty and cost are reduced.

The invention relates to the field of mechanical surface engineering and bionic design, in particular to a bionic tooth surface microstructure concrete design method. The method comprises the following steps: acquiring point cloud data of a shell body surface, and constructing a shell body surface three-dimensional model by using the point cloud data; constructing a bionic coupling element matrix by using the shell body surface three-dimensional model; constructing an equal-arc-length parameter sequence and a gray mapping matrix based on the bionic coupling element matrix, and constructing a structural feature matrix by using the equal-arc-length parameter sequence and the gray mapping matrix; and establishing a tooth surface geometric model of the target gear, and mapping the structural feature matrix to a parameter domain of the tooth surface geometric model to obtain initial micro-texture geometric distribution. And constructing a morphological design parameter matrix, and regulating and controlling the initial micro-texture geometric distribution by using the morphological design parameter matrix to obtain a bionic tooth surface micro-texture model. The problem that in the prior art, a quantitative conversion method from biological structure geometric characteristics to engineering tooth surface micro-texture design parameters is lacked is solved.

The application discloses a flushing faucet arrangement method and device based on building water supply and drainage, and a medium, and belongs to the technical field of building water supply and drainage design, and is used for solving the technical problems that the existing building water supply and drainage design is more dependent on manual operation, and is prone to low efficiency, poor consistency, high error rate and complicated modification. The method comprises the following steps: performing position identification processing on a building water supply and drainage model related to a basement flushing faucet, and obtaining object type information to be arranged; performing distance position judgment on a sump area in the object type information to be arranged related to a surrounding wall type, and obtaining a first flushing faucet arrangement strategy; performing distance position judgment on a door position area related to the surrounding wall type, and obtaining a second flushing faucet arrangement strategy; and determining a flushing faucet arrangement strategy of the building water supply and drainage model based on the first flushing faucet arrangement strategy and the second flushing faucet arrangement strategy.

The utility model belongs to the LED photoelectric technical field, and specifically relates to an LED structure comprising a first substrate and a second substrate, the first substrate is internally provided with a bowl cup, the second substrate is provided with a positive electrode pad and a negative electrode pad which are connected with the bottom surface of the bowl cup, and the positive electrode pad or the negative electrode pad is provided with a die bonding area at a position in the bowl cup. A wafer and an electric lead used for conducting an electrode on the surface of the wafer with the positive electrode bonding pad or the negative electrode bonding pad are arranged on the wafer fixing area, the periphery of the wafer and the periphery of the electric lead are wrapped with packaging colloid, and heat conduction columns are further arranged at the positions, corresponding to the positive electrode bonding pad, the negative electrode bonding pad and the wafer fixing area, in the second substrate respectively. According to the utility model, an electroplating or sputtering coating design process adopted by a traditional support is broken through, compared with an integrated support mold opening electroplating, the manufacturing cost of design and development is lower, the flexibility of design and development is higher, and the support has the advantages of better product practicability, better compatibility, better effect and performance and the like.

The invention discloses a ferroelectric thin film transistor based on aluminum scandium nitride, aluminum nitride and aluminum scandium nitride multilayer structures and a preparation method of the ferroelectric thin film transistor, and relates to the field of semiconductor devices and ferroelectric memories. The ferroelectric thin film transistor based on the aluminum scandium nitride, aluminum nitride and aluminum scandium nitride multilayer structure comprises a multilayer ferroelectric gate stack structure and a channel layer matched with the multilayer ferroelectric gate stack structure, and the multilayer ferroelectric gate stack structure is a symmetrical laminated structure of aluminum scandium nitride / aluminum nitride / aluminum scandium nitride. According to the ferroelectric thin film transistor based on the aluminum scandium nitride, aluminum nitride and aluminum scandium nitride multi-layer structure, a basis is provided for decoupling residual polarization and a coercive field and relieving negative effects brought by a depolarization field from the structural level through hierarchical cooperation of a laminated structure, and meanwhile, the ferroelectric thin film transistor is compatible with the assembly logic of a conventional semiconductor device; and a structural space is reserved for subsequent performance optimization and material replacement.

This utility model discloses a voltage clamping circuit and an HVDC power supply system. The voltage clamping circuit includes a first transistor, a second transistor, a first resistor, a second resistor, a third resistor, and at least one voltage regulator. The first terminal of the first transistor is electrically connected to the first terminal of the second resistor, serving as a first terminal. The control terminal of the first transistor is electrically connected to the second terminal of the second resistor, the first terminal of the third resistor, and the first terminal of the second transistor. The control terminal of the second transistor is electrically connected to the first terminal of the first resistor, and the second terminal of the second transistor is electrically connected to the second terminal of the first resistor and the second terminal of the third resistor, serving as a second terminal. At least one voltage regulator is connected between the second terminal of the first transistor and the first terminal of the first resistor. The first terminal is electrically connected to the positive busbar, and the second terminal is electrically connected to the ground terminal, or the second terminal is electrically connected to the negative busbar, and the first terminal is electrically connected to the ground terminal.

This application relates to a sliding door assembly, belonging to the field of door and window hardware technology. It includes several support blocks, which are detachably connected to the bottom frame of the door frame via fasteners. These support blocks are arranged along the sliding direction of the sliding door. Support rollers are rotatably connected to each support block. A support rail is installed at the bottom of the sliding door's mounting frame, and the support rail simultaneously supports multiple support rollers. This application allows for the maintenance and replacement of the rollers without disassembling the glass door, improving the convenience of sliding door maintenance.

Embodiments of the present application provide a kind of board level structure and electronic equipment, it is related to electronic equipment technical field.The board level structure includes substrate, camera module, power supply wiring and suspension coil.Wherein, power supply is equipped on substrate.Cameras module is set to substrate, and cameras module includes magnetic component.At least part of power supply wiring is located at the outside of cameras module.At least part of suspension coil is located between cameras module and power supply wiring, when power supply inputs periodic variation input current to power supply wiring, coupling current with input current frequency same, opposite direction is generated in the suspension coil between cameras module and power supply wiring.The board level structure can reduce the electromagnetic interference that power supply wiring generates to the magnetic component in cameras module by setting suspension coil, and it is convenient to wiring, can solve the problem of higher difficulty in wiring in related art.

This invention relates to the field of semiconductor technology and discloses a curved cadmium telluride thin-film photovoltaic module and its fabrication method. The fabrication method includes: depositing a transparent conductive layer and a cell layer sequentially from bottom to top on one side surface of a glass substrate; forming a P1 laser groove penetrating the transparent conductive layer and the cell layer; sequentially forming a P2 laser groove penetrating the cell layer and a contact layer, the contact layer being located on the surface of the cell layer and covering the inner wall of the P2 laser groove; forming a P3 laser groove penetrating the contact layer and the cell layer, wherein the interior or bottom of the P3 laser groove is a filling layer; performing a hot bending process; forming a first back electrode layer on the surface of the filling layer and a second back electrode layer on the surface of the contact layer; the porosity of the first back electrode layer is greater than that of the second back electrode layer; and removing the filling layer and the first back electrode layer corresponding to the P3 laser groove position using a film removal solution to form a groove. This invention can meet the integration and fabrication of cadmium telluride thin-film modules with arbitrary curved shapes, improving the design flexibility and efficiency of the modules.

The invention provides a compact broadband band-pass filter adopting a parallel coupling line structure, which belongs to the technical field of microwave filters, and comprises a parallel coupling part and a loading microstrip part, on the premise of keeping the equivalent total electrical length as a quarter wavelength corresponding to the central working frequency, a plurality of resonance modes are excited, a plurality of transmission poles are formed in a passband, the broadband band-pass characteristic is realized, and the physical size is reduced; the loading microstrip part is composed of a plurality of microstrip lines, is arranged in a plane adjacent area of the parallel coupling part, and forms bypass loading in an out-of-band frequency band, so that main transmission signals and signals reflected by bypasses are subjected to destructive interference at a specific frequency, a plurality of transmission zero points are formed out of a band, the stop-band suppression range is expanded, and higher harmonics are suppressed. The filter adopts a single-layer planar microstrip structure, and has the advantages of compact structure, wide stop band, strong harmonic suppression capability and good adjustability of passband and stop band performance.

The invention discloses a foamy copper framework-based heterogeneous material for a friction nano-generator and a preparation method and application thereof, the foamy copper framework-based heterogeneous material takes foamy copper as a framework and platinum catalytic silicone rubber as a filler, and the foamy copper and the platinum catalytic silicone rubber form a three-dimensional interpenetrating structure. The preparation method comprises the following steps: (1) firstly putting foamy copper into absolute ethyl alcohol for ultrasonic cleaning, and then putting the foamy copper into diluted hydrochloric acid for ultrasonic cleaning; (2) preparing a platinum catalyzed silicone rubber liquid; (3) pouring platinum catalytic silicon rubber liquid into the foamy copper until pores of the foamy copper are completely filled with the platinum catalytic silicon rubber liquid; (4) after pouring is completed, the mold is transferred to be subjected to exhaust treatment under the ultrasonic condition; and (5) the mold is placed in a drying box to be subjected to curing treatment. The foamy copper framework-based heterogeneous material for the friction nano-generator prepared by the invention can be used for a three-dimensional electrode of the friction nano-generator, and the electric output performance of the friction nano-generator can be effectively improved.

A semiconductor terminal structure and its formation method are disclosed. The method includes: forming a hard mask layer on the surface of an epitaxial layer, comprising a first hard mask layer and a second hard mask layer located on the surface of the first hard mask layer, wherein the hard mask layer has a plurality of first openings, the width of the plurality of first openings gradually decreasing along a first direction, or gradually decreasing and then remaining constant; forming a plurality of first doped regions in the epitaxial layer using the hard mask layer as a mask and employing a first doping process; etching the first hard mask layer using an isotropic etching process using the second hard mask layer as a mask, thereby exposing one end of the top surface of the main junction region; and forming a second doped region in the epitaxial layer using a second doping process using the first hard mask layer as a mask, wherein the second doped region and the first doped region have a partially overlapping region, and the doping concentration of the overlapping region is less than or equal to the doping concentration of the main junction region. This structure can effectively reduce the terminal's occupied area, improve the process window, and improve the terminal's breakdown voltage.

This utility model discloses a connecting structure for shaped tube splicing, including a plate body. The plate body is made of metal, and multiple bends are formed in a straight line along the width direction of the plate body, arranged sequentially along the length direction of the plate body. The plate body can be bent along the bends, and the two ends of the plate body can be connected to form a shaped tube. Using a flat metal plate instead of a shaped steel tube blank as raw material significantly reduces material costs. Stamping to form the bends and punching holes in the unfolded flat state avoids the "flatness and height" difficulties caused by the shaped tube structure, resulting in more precise blanking dimensions and more accurate hole processing. This effectively solves the technical problems of large dimensional errors and difficulty in removing burrs inside holes and on the end faces in traditional processes, thereby improving product dimensional stability and overall quality.