1432results about How to "Improve design flexibility" patented technology

A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming wire bond z-interconnects between the upper and lower substrates.

A microfluidic substrate assembly includes a substrate body having at least one fluid inlet port. At least one microscale fluid flow channel in the substrate is in fluid communication with the inlet port for transport of a fluid to be tested. The substrate body also has a plurality of sockets, with each of one or sockets configured to receive an operative component. At least one socket is in communication with the microscale fluid flow channel.

The present invention relates to an apparatus and method for rapid flash-like volatilization of high and low vapor pressure components from liquid or solid emanators which is in contact with a point or localized heat source. Vaporization is promoted by a geometrically small electrically resistive heating element with variable activation for pulsed or cyclic heating of an emanating surface containing the volatile components. The apparatus is primarily directed towards the treatment of residential air for fragrancing, odor elimination, treatment of insects or pests, air sanitization, air and surface antibacterial or antimicrobial treatment, or other ambient air or surface modification by way of gas or vapor distribution.

In an electric vehicle inverter apparatus 100, a vehicle control controller 15 detects a switch open signal output from a collision detector 16 when the collision detector 16 is caused by a collision between electric vehicles to operate. Then, an inverter main circuit connection switch 10 of a high-voltage battery unit 8 is put into an open state. Thus, the direct-current power supply from a high-voltage battery 12 to a DC bus portion is interrupted. In addition, electric charges charged into a main circuit capacitor 7 are discharged by a forced discharge circuit portion 22b.

The present invention relates to a light-emitting device including a light source, a first light-emitting material spaced apart from the light source, and at least one additional light-emitting material. The first light-emitting material includes low reabsorbing semiconductor nanocrystals having an emission-center core, an exterior protective shell, and at least one inner light-absorbing shell. The device is useful for efficiently producing white light having a high color rendering index.

A photolithography mask for optically transferring a pattern formed in said mask onto a substrate and for negating optical proximity effects. The mask includes a plurality of resolvable features to be printed on the substrate, where each of the plurality of resolvable features has a longitudinal axis extending in a first direction; and a pair of non-resolvable optical proximity correction features disposed between two of the plurality of resolvable features, where the pair of non-resolvable optical proximity correction features has a longitudinal axis extending in a second direction, wherein the first direction of the longitudinal axis of the plurality of resolvable features is orthogonal to the second direction of the longitudinal axis of the pair of non-resolvable optical proximity correction features.

A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within the central opening. Each leadframe further includes a plurality of leads which are attached to the outer frame and extend toward the die pad in spaced relation to each other. The outer frames are integrally connected to each other and collectively define connecting bars which extend in multiple rows and columns and define saw streets. Semiconductor dies are attached to respective ones of the die pads, with the semiconductor dies being mechanically and electrically connected to the leads of respective ones of the leadframes. Thereafter, an encapsulant material is applied to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes, the semiconductor dies, and the conductive wires. The leadframe strip and the mold cap collectively define a package strip. Isolation cuts are formed through the package strip along at least some of the saw streets to effectively electrically isolate the leadframes from each other.

The IHUD is an interactive display system allowing the vehicle driver to select information and view information utilizing LCD and touch screen technology, employing the windshield as the platform. Basically the same LCD technology found on calculators in use and touch screen technology found on interactive video display screens.

An acoustic generator, comprising: a source of electro-magnetic radiation; a waveguide coupled to said source; and at least one absorbing region defined in said waveguide, said region being selectively absorbing for portions of said radiation meeting at least one certain criterion and having significantly different absorbing characteristics for radiation not meeting said criterion, both of said radiation portions being suitable for conveyance through said waveguide, wherein said absorbing region converts said radiation into an ultrasonic acoustic field. Optionally, said region comprises a volumetric absorber. Alternatively or additionally, said region comprises a plurality of regions.

A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-down configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

In a front end structure of a vehicle, a heat exchanger is arranged at a position lower than a bumper reinforcement member, so a position of an engine hood is lowered. Electric auxiliary devices such as a radar, electronic control units for lights, and an air cleaner are arranged at a position higher than the bumper reinforcement member or at the rear of the bumper reinforcement member. By this arrangement, the electric auxiliary devices are arranged at a position which is less likely to be affected by the bumper reinforcement member in a case of light frontal crush.

The invention is intended to present an insulated gate type semiconductor device that can be manufactured easily and its manufacturing method while realizing both higher withstand voltage design and lower on-resistance design. The semiconductor device comprises N+ source region 31, N+ drain region 11, P− body region 41, and N− drift region 12. By excavating part of the upper side of the semiconductor device, a gate trench 21 is formed. The gate trench 21 floating region 51 is provided beneath the gate trench 21. A further trench 35 differing in depth from the gate trench 21 may be formed, a P floating region 54 being provided beneath the trench 25.

A system and method for cooling electrical machines (e.g., generators), sub-systems (e.g., power electronics), and components (e.g., bearings) in an electrical generation system such as a compressed air storage (CAS) energy system or a thermal and compressed air storage (TACAS) energy system is provided. Cooling is derived from the thermal expansion of a compressed gas, which may be the same gas used to drive a turbine-generator of CAS or TACAS energy system.

The present invention discloses a thermal module with heat reservoir, which is arranged with respect to a chip, and the thermal module comprises: a housing, disposed at a appropriate position corresponding to the chip and made of a material of high heat conductivity; a phase change material, disposed within the housing, capable of changing from a first state to a second state by absorbing heat and changing from the second state to the first state by releasing the heat stored therein; wherein the thermal module can be either mounted on the chip at an appropriate location or disposed at a location separated from the chip by an appropriate distance, in addition, the phase change process of the phase change material changing between the first state and the second state can be either a physical process or a chemical process.

A display includes: display pixel electrodes; common electrodes; a display layer; a display control circuit; touch detection electrodes; and a touch detection circuit detecting an external proximity object based on a detection signal obtained from the touch detection electrodes with use of a common drive voltage for display applied to the common electrode as a touch sensor drive signal. The touch detection circuit includes: a first filter allowing a fundamental detection signal, contained in the detection signal and having a frequency same as a fundamental frequency of the touch sensor drive signal, to pass therethrough, a plurality of second filters separately allowing two or more harmonic detection signals, contained in the detection signal and having frequencies same as respective harmonic frequencies of the touch sensor drive signal, to pass therethrough, and a detection section performing a detection operation based on the fundamental detection signal and the harmonic detection signals.

A phosphor which emits light having high brightness, serves as an excellent orange or red phosphor whose light brightness is less decreased when exposed to an excitation source contains a crystal phase having the chemical composition expressed by the general formula [1]:

(1−a−b)(Ln′_pM^II′_1−pM^III′M^IV′N₃)·a(M^IV′_(3n+2)/4N_nO)·b(AM^IV′₂N₃)  [1]

• • wherein Ln′ represents a metal element selected from the group consisting of lanthanoids, Mn, and Ti; Mn^II′ represents a divalent metal element except the Ln′ element; M^III′ represents a trivalent metal element; M^IV′ represents a tetravalent metal element; A represents a metal element selected from the group consisting of Li, Na, and K; 0<p≦0.2; 0≦a, 0≦b, a+b>0, 0≦n, and 0.002≦(3n+2)a/4≦0.9.

A dual braided catheter shaft includes a flat wire forming the inner braid, thereby potentially allowing for reduced radial thickness of the shaft. In one embodiment, the shaft (100) includes an inner polymer jacket (104), an inner braid (106) formed on the inner jacket (104), an intermediate jacket (108) formed over the inner braid (106), an outer braid (110) formed on the intermediate jacket (108) and an outer jacket (112) formed on the outer braid (110). A preferred construction process involves extruding polymer material directly onto each of the inner and outer braids (106 and 110) so that little or no air gaps remain between the polymer material and the braids (106 and 110). The braiding parameters of the inner and outer braids (106 and 110) can be varied along the length of the catheter to provide varying mechanical properties.

A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.

A fiber optic module includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, an LD shielding plate and a PD shielding plate for electrically shielding the LD module and the PD module, respectively, a first frame and a second frame for holding the circuit board, LD module and PD module. In the fiber optic module, the connector is of a surface mounting type, leads of the LD and PD modules are connected to a side of the circuit board mounted with the connector, the circuit board has an LD variable resistor for adjusting a drive current of the LD module, the LD variable resistor is provided to a side of the circuit board opposite to the connector, the circuit board has a PD variable resistor provided to the side of the circuit board opposite to the connector for detecting a signal of the PD module, 3 signal processing semiconductor ICs or less are provided.