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40results about How to "Reduce pixel area" patented technology

Thin-film transistor and fabrication method thereof and array substrate

The present invention provides a thin-film transistor and a fabrication method thereof, and an array substrate. The thin-film transistor includes a separation layer (5) arranged between the source electrode (4) and the drain electrode (6). An oxide semiconductor channel layer (7) is arranged on one side of the separation layer (5) and the drain electrode (6) to contact a portion of an upper surface of the drain electrode (6), a side surface of the drain electrode (6) and the organic separation layer (5), and a portion of an upper surface of the source electrode (4) to serve as a vertical channel, of which a channel length corresponds to a thickness of the separation layer (5). Varying the thickness of the separation layer to reduce the length of the vertical channel to a sub-micrometer order would greatly reduce the size of the thin-film transistor and reduce the area of a pixel. The vertical channel does not cause a short channel effect so as to improve electrical performance of the thin-film transistor. Using a multiple-layered hexagonal boron nitride film to make a moisture/oxygen barrier layer (2) and using a double-layered graphene film to make the source electrode (4) and the drain electrode (6) help significantly improve bending durability of the thin-film transistor.
Owner:WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD

Global shutter pixel unit of complementary metal oxide semiconductor (CMOS) image sensor

The invention discloses a global shutter pixel unit of a complementary metal oxide semiconductor (CMOS) image sensor. The global shutter pixel unit comprises a photoelectric diode, a signal readout circuit, a signal amplifying circuit, a signal sampling and retaining circuit and a signal output circuit which are connected with one another, wherein the photoelectric diode is used for acquiring original information of an incident light ray and converting an acquired target image light signal into an electric signal; the signal readout circuit is used for reading the electric signal subjected to photoelectric conversion in the photoelectric diode out, and storing the electric signal in a node FD; the signal in the node FD is amplified by the signal amplifying circuit; the signal amplifying circuit comprises an operational amplifier which is used for amplifying the signal stored in the node FD; the amplified signal is output to the signal sampling and retaining circuit; the signal sampling and retaining circuit is used for sampling and retaining the signal output by the signal amplifying circuit; and the signal output circuit is used for sampling and outputting the signal which is sampled and retained in the signal sampling and retaining circuit. By the global shutter pixel unit, the problem of large noise of the existing global shutter pixel in the CMOS image sensor can be solved.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Pixel circuit and infrared imager

The invention provides a pixel circuit and an infrared imager, and relates to the field of infrared imaging. The integration module performs integration and coarse quantization through the common module and the charge injection module at the same time; the charge injection module injects charges into an integrating capacitor in the integrating module; the dynamic comparator generates a counting signal in the process of carrying out fine quantization on the residual voltage, the linear feedback shift register counter counts, the counting result is a coarse quantization result, the dynamic comparator generates the counting signal in the process of carrying out fine quantization on the residual voltage, the linear feedback shift register counter receives the counting signal and counts from 0, and the counting result is a fine quantization result. According to the pixel circuit, coarse and fine quantization share the same module, so that the pixel area is reduced. According to the pixel circuit, part of charges are injected into the integrating capacitor in stages, compared with the injection of equal charges, the introduced noise is lower, the noise charges injected every time are reduced on the whole, the signal-to-noise ratio is improved, and therefore the overall power consumption of the pixel circuit is reduced. The pixel circuit has lower power consumption and better quality factor.
Owner:北京领丰视芯科技有限责任公司

IGZO (Indium Gallium Zinc Oxide) backboard structure applied to OLED (Organic Light Emitting Diode) panel and manufacturing method

The invention discloses an IGZO backboard structure applied to an OLED panel and a manufacturing method. A metal layer M0 is arranged on a substrate Sub; an insulating layer PV is also arranged on the substrate Sub, and the insulating layer PV covers the metal layer M0; a semiconductor layer IGZO is arranged on the insulating layer PV; a metal layer M0.5 is arranged on the IGZO semiconductor layer; an insulating layer GI is also arranged on the insulating layer PV and covers the metal layer M0.5 and the semiconductor layer IGZO; a metal layer M1 is arranged on the insulating layer GI; an insulating layer IP is also arranged on the insulating layer GI and covers the metal layer M1; a metal layer M2 is arranged on the insulating layer IP, and the metal layer M2 and the metal layer M0.5 form a storage capacitor; an organic flat layer OP is further arranged on the insulating layer IP, and the metal layer M2 is covered with the organic flat layer OP; an anode metal layer Anode is arranged on the organic flat layer OP; a pixel definition layer PDL is further arranged on the organic leveling layer OP, and an opening is formed in the position, at the anode metal layer Anode, of the pixel definition layer PDL. According to the invention, the defect of low resolution of the IGZO OLED panel can be improved.
Owner:FUJIAN HUAJIACAI CO LTD
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