97 results about "Gated diode" patented technology

A silicon-on-insulator (SOI) gated diode and non-gated junction diode are provided. The SOI gated diode has a PN junction at the middle region under the gate, and which has more junction area than a normal diode. The SOI non-gated junction diode has a PN junction at the middle region thereof, and then also has more junction area than a normal diode. The SOI diodes of the present invention improve the protection level offered for electrical overstress (EOS) / electrostatic discharge (ESD) due to the low power density and heating for providing more junction area than normal ones. The I / O ESD protection circuits, which comprise primary diodes, a first plurality of diodes, and a second plurality of diodes, all of which are formed of the present SOI diodes, could effectively discharge the current when there is an ESD event. And, the ESD protection circuits, which comprise more primary diodes, could effectively reduce the parasitic input capacitance, so that they can be used in the RF circuits or HF circuits. The proposed gated diode and non-gated diode can be fully process-compatiable to general partially depleted or fully-depleted silicon-on-insulator CMOS processes.

A memory cell comprises: (1) a write switch, the first terminal of the write switch coupled to an at least one bitline, the control terminal of the write switch coupled to the first control line; (2) a two terminal semiconductor, the first terminal of the two terminal semiconductor device coupled to the second terminal of the write switch, and the second terminal of the two terminal semiconductor device coupled to an at least one second control line, wherein the two terminal semiconductor device has a capacitance when a voltage on the first terminal relative to the second terminal is above a threshold voltage and has a lower capacitance when the voltage on the first terminal relative to the second terminal is less than the threshold voltage; (3) a read select switch, the control terminal of the read select switch coupled to an at least one second control line, the first terminal of the read select switch coupled to the at least one bitline; and (4) a read switch, the control terminal of the read switch coupled to the first terminal of the gated diode and coupled to the second terminal of the write switch, the first terminal of the read switch coupled to the second terminal of the read select gate, and the second terminal of the read switch coupled to ground.

A new type of static RAM cell is disclosed that is based on a gated diode and its voltage amplification characteristic. The cell combines the advantages of a static RAM, in which data refresh is not needed, and those of gated diode cells, which are scalable to low voltages, have high signal to noise ratio, high signal margin, and tolerance to process variations, to form a single high performance static memory cell. This new cell has independent read and write paths, which allow for separate optimization of the read (R) and write (W) events, and enable dual-port R / W operation. Furthermore, storage node disturbance during the read and write operations are eliminated, which greatly improves cell stability and scalability for future technologies.

A sense amplifier circuit comprises (1) an isolation device comprising a control terminal and first and second terminals, the first terminal of the isolation device coupled to a signal line, (2) a gated diode comprising first and second terminals, the first terminal of the gated diode coupled to the second terminal of the isolation device, and the second terminal of the gated diode coupled to a set line; and (3) control circuitry coupled to the control terminal of the isolation device and adapted to control voltage on the control terminal of the isolation device in order to enable and disable the isolation device. A latch circuit further comprises a precharge device comprising a control terminal and first and second terminals, the first terminal of the precharge device coupled to a power supply voltage, and the second terminal of the precharge device coupled to the first terminal of the isolation device.

A voltage-variable capacitor uses the channel-to-substrate junction from a gated diode formed from a metal-oxide-semiconductor transistor. The transistor gate has at least two contacts that are biased to different voltages. The gate acts as a resistor with current flowing from an upper gate contact to a lower gate contact. The gate-to-source voltage varies as a function of the position. A critical voltage is where the gate-to-source voltage is equal to the transistor threshold. A portion of the gate that has gate voltages above the critical voltage has an inversion layer or conducting channel under the gate. Another portion of the gate has gate voltages below the critical voltage, and thus no channel forms. By varying either the gate voltages or the source voltage, the area of the gate that has a channel under it is varied, varying the channel-to-substrate capacitance. Separate gate arms reduce bias current.

A CMOS device includes a substrate, a pMOS transistor and an nMOS transistor formed on the substrate, and a gated diode. The gated diode includes a floating gate formed on the substrate in between the pMOS transistor and the nMOS transistor and a pair of a p-doped region and an n-doped region formed in the substrate and between the pMOS transistor and the nMOS transistor. The n-doped region is formed between the floating gate and the nMOS transistor, and the p-doped region is formed between the floating gate and the pMOS transistor.

An electronic device can include a gated diode, wherein the gated diode includes a junction diode structure including a junction. A first conductive member spaced apart from and adjacent to the junction can be connected to a first signal line. A second conductive member, spaced apart from and adjacent to the junction, can be both electrically connected to a second signal line and electrically insulated from the first conductive member. The junction diode structure can include a p-n or a p-i-n junction. A process for forming the electronic device is also described.

A family of logic circuits, called gated diode logic circuits, is disclosed wherein small amplitude signals, typically a fraction of the supply voltage, can be sensed and amplified by applying a small amplitude signal to a gate of a gated diode in a sampling mode and changing a voltage of a source of the gated diode in an evaluation mode. One or more isolation devices may be connected between each small amplitude signal and a gate of the gated diode, wherein the isolation device passes the small amplitude signal to the gate of the gated diode in the sampling mode, and isolates the small amplitude signal from the gate in the evaluation mode for amplification and performing fast logic operations (logic functions). The disclosed gated diode logic circuits overcome the Vt variation problem in FETs by detecting and amplifying the small logic signals utilizing gated diodes that have relatively low Vt variation. The amplified signals may then be processed by conventional logic circuits to perform certain logic functions in a gated diode logic circuit. The Vt variation of the gated diode is relatively small compared to the small logic signal amplitude and can be controlled relatively precisely. Typically, Vt of the gated diode can be set to a fraction of the small logic signal amplitude. Thus, in a gated diode logic circuit, the gated diode circuit can sense and amplify the small logic signals sufficiently to perform the various logic operations in conjunction with conventional logic circuits. The output(s) of the gated diode logic circuit can be of a standard full CMOS voltage swing, or can be scaled down in amplitude and further processed by other gated diode logic circuits.

Pipe defects in n-type lightly doped drain (NLDD) regions and n-type source / drain (NDS) regions are associated with arsenic implants, while excess diffusion in NLDD and NSD regions is mainly due to phosphorus interstitial movement. Carbon implantation is commonly used to reduce phosphorus diffusion in the NLDD, but contributes to gated diode leakage (GDL). In high threshold NMOS transistors GDL is commonly a dominant off-state leakage mechanism. This invention provides a method of forming an NMOS transistor in which no carbon is implanted into the NLDD, and the NSD is formed by a pre-amorphizing implant (PAI), a phosphorus implant and a carbon species implant. Use of carbon in the NDS allows a higher concentration of phosphorus, resulting in reduced series resistance and reduced pipe defects. An NMOS transistor with less than 1·1014 cm−2 arsenic in the NSD and a high threshold NMOS transistor formed with the inventive method are also disclosed.

Diodes, including gated diodes and shallow trench isolation (STI) diodes, manufacturing methods, and related circuits are provided without at least one halo or pocket implant thereby reducing capacitance of the diode. In this manner, the diode may be used in circuits and other devices having performance sensitive to load capacitance while still obtaining the performance characteristics of the diode. Such characteristics for a gated diode include fast turn-on times and high conductance, making the gated diodes well-suited for electro-static discharge (ESD) protection circuits as one example. Diodes include a semiconductor substrate having a well region and insulating layer thereupon. A gate electrode is formed over the insulating layer. Anode and cathode regions are provided in the well region. A P-N junction is formed. At least one pocket implant is blocked in the diode to reduce capacitance.

An electronic device can include a gated diode, wherein the gated diode includes a junction diode structure including a junction. A first conductive member spaced apart from and adjacent to the junction can be connected to a first signal line. A second conductive member, spaced apart from and adjacent to the junction, can be both electrically connected to a second signal line and electrically insulated from the first conductive member. The junction diode structure can include a p-n or a p-i-n junction. A process for forming the electronic device is also described.