30results about How to "Improve signal transmission speed" patented technology

There is provided a semiconductor device of a chip-on-chip structure having a support semiconductor chip, first and second chip blocks supported and connected on one surface of the support semiconductor chip and an insulator arranged between the first and second chip blocks. The first and second chip blocks each include one or a plurality of semiconductor chips having an active surface nearly parallel with the one surface of the support semiconductor chip. Within the insulator, an intralevel wiring is arranged on a wiring plane as a plane including an inactive or active surface of any of the semiconductor chips structuring the first or second chip block.

A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT / pixel / gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.

The invention discloses a manufacturing method of a multilayer flexible circuit board. The manufacturing method comprises the steps of (1) manufacturing a double-sided FPC flexible board; (2) manufacturing a novel material layer structure; (3) hot-pressing at least one group of novel material layer structures on the circuit on the upper surface and / or the lower surface of the double-sided FPC flexible board, and forming a protective layer on the circuit of the outermost novel material layer structure and / or the exposed circuit of the double-sided FPC flexible board to obtain the multi-layer flexible circuit board. The invention further discloses a multi-layer flexible circuit board manufactured by implementing the method. According to the invention, the manufacturing process is simplifiedand convenient, and the production efficiency is high; the manufactured multi-layer flexible circuit board not only greatly simplifies the novel material layer structure and reduces the overall thickness, but also has the function of transmitting high-frequency signals at a high speed, and is particularly suitable for novel 5G technological products; the protective and resistant effects on the copper ion migration phenomenon during the electrification between the circuits are achieved, and the safe and normal work of the circuits is guaranteed.

The invention relates to monitoring technology of power transmission lines, in particular to technology for monitoring ice coating and waving states of the power transmission lines. The invention discloses a method and a device for monitoring the power transmission line by using fiber sensors in real time. The method for monitoring the power transmission line is characterized by comprising the following steps: arranging the fiber sensors along the power transmission line to detect characteristic parameters of different positions of a lead; and judging the state of the power transmission line according to the analysis of the characteristic parameters. The device for monitoring the power transmission line comprises the fiber sensors and a signal transmitting and processing system, and is characterized in that the fiber sensors are arranged along the length direction of the power transmission line and used for detecting and transmitting the characteristic parameters of the different positions of the power transmission line. The method and the device are used for monitoring the ice coating and waving states of the power transmission lines, can fully exert the advantages of the fiber sensors to carry out multi-parameter real-time on-line detection, and have the characteristics that the device has long service life and can work for long time reliably under on-site severe environmentconditions.

A printed circuit board assembly and an electronic apparatus using the same are provided. The printed circuit board assembly includes a circuit board and a first bridging unit. The circuit board includes a first wiring layer, and the first wiring layer includes a plurality of first ground traces, a plurality of first signal traces, and at least one first ground region. Each of the first signal traces is disposed between one of the first ground traces and the first ground region. The first bridging unit is disposed on the first wiring layer of the circuit board. The first bridging unit extends over, without contacting, at least one of the first signal traces from one of the first ground traces to another one of the first ground traces or the first ground region, so as to form at least one first conductive ground path.

The invention relates to the technical field of manufacturing of integrated circuits and provides a range matching CAM (Content Addressable Memory) unit circuit and an RCAM (Range Content Addressable Memory) composed of the range matching CAM unit circuit. According to the range matching CAM unit circuit, high-voltage swing is greater than a GERMC circuit in a range matching unit; a fifth NMOS (N-channel Metal Oxide Semiconductor) tube is in complementary combination with an MP1 of a first PMOS (P-channel Metal Oxide Semiconductor) tube; a grid electrode of the MP1 is connected with a D# end; a source electrode of the MP1 is connected with a third input SL; an MN6 of a sixth NMOS tube is in the complementary combination with an MP2 of a second PMOS tube; a grid electrode of the MP2 is connected with a D end; a source electrode of the MP2 is connected with a fourth input SL#; a node connected between the two combined tubes which are mutually connected in series is connected with the grid electrodes of an MN1 and an MN2 of a first NMOS tube and a second NMOS tube; a drain electrode of an MN3 of a third NMOS tube is connected with a second input GE path, and the grid electrode of the MN3 of the third NMOS tube is connected with the D# end. According to the range matching CAM unit circuit and the RCAM, the two PMOS tubes are introduced to change transmission tubes MN5 and MN6 into transmission gates so that the P-point voltage swing is improved and the voltage drain drain VDD can be reached, so that the transmission speeds of signals equal to a chain or greater than the chain are increased and the circuit speed is increased; meanwhile, the robustness of the unit circuit is also improved and the anti-noise capability is improved.

The object of the present invention is to provide a composite metal foil for the manufacture of printed circuit boards, which has three advantages of better low thermal expansion performance than copper, good electrical conductivity, and good solubility in copper etching solution. characteristic. In order to achieve this object, the present invention adopts a composite metal foil, etc., which is composed of one or more copper layers and one or more nickel alloy layers, and is characterized in that the nickel alloy layer is formed of a nickel-molybdenum alloy. When the total thickness of the one or more copper layers is TCu and the total thickness of the one or more nickel-molybdenum alloy layers is TNi-Mo, the relationship of 0.08≦TNi-Mo / TCu≦1.70 is satisfied.

Provided is an MCP including a plurality chips stacked therein. Each of the chips includes a plurality of inductor pads configured to transmit power or signals, and at both sides of a reference inductor pad, a first and a second inductor pads are formed to generate magnetic fluxes in different directions from each other.

This invention relates to a high-speed signal transmission device, which includes a first transmission device and a second transmission device. Said first transmission device has a first signal cable with a first plug connector and second plug connector on it both ends, said second transmission device has a second signal cable with a third plug connector and fourth plug connector on it both ends. Using a first socket connector and a third socket connector to connect said first plug connector and third plug connector, and using a second socket connector and a fourth socket connector to connect said second plug connector and fourth plug connector to connect first transmission device and a second transmission device electrically to get the signal transmission speed of USB 3.0 and to enhance the rate of signal transmission.

The invention discloses an automatic reeling machine exploration perception mechanism which a first support, a second support, a stepping motor, a sensing arm, a crank rocker mechanism, an explorationdrum wheel, a first hall sensor, a second hall sensor, a short lever gauge fixed fiber sensor, a denier sensor seat, a controller and an upper positioning drum wheel, wherein the first support and the second support relatively fixed. The stepping motor serves as a power source of exploration movement, mechanical signals of the short lever gauge fixed fiber sensor are converted into electric signals by the hall sensors, exploration the perception of raw silk size is completed, and raw silk size signals are processed. The mechanism is characterized in that the explore cycles can be changed in real time according to detection results of raw silks, so that fine lengths of raw silks can be reduced as far as possible, the quality of the raw silks is improved, the mechanical signals of the shortlever gauge fixed fiber sensor are converted into the electric signals, signal transmission speed is greatly improved, and relevant parameters of reeled raw silks are conveniently counted.

A semiconductor device includes a substrate including a first region and a second region, first conductive patterns disposed on the first region and spaced apart from each other by a first distance, second conductive patterns disposed on the second region and spaced apart from each other by a second distance greater than the first distance, and an interlayer insulating layer disposed between the second conductive patterns and including at least one recess region having a width corresponding to the first distance.

The device for generating the bit line signal to enable a column transistor that is connected to a bit line and a local line in a semiconductor memory device includes at least a column decoder and a chain of connected inverters. The column decoder decodes a column address signal. The chain of connected inverters has an input terminal for receiving a first signal outputted from the column decoder and an output terminal for outputting a second signal to drive the column transistor. The second signal voltage is held substantially same as the first signal voltage for a predetermined time. After the predetermined time, the second signal voltage is held at a higher voltage than the first signal voltage to improve the current driving capacity of the column transistor. This increases the transmission speed of the signal transmitted from the bit line to the local input / output line.