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PCB manufacturing method

A manufacturing method and technology of inner layer core board, applied in the direction of printed circuit manufacturing, printed circuit connected with non-printed electrical components, electrical components, etc. Problems such as signal loss, to improve the quality and speed of signal transmission, and to expand the use of the effect

Active Publication Date: 2016-05-11
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is difficult to embed the closed cavity inside the PCB. At present, in order to control the glue flow inside the closed cavity and the shape of the cavity, most designs use pre-cured P sheets that do not flow or have low fluidity for lamination, but this type of semi-cured Cured P-chip is not a high-frequency and high-speed material, and has a certain loss on the signal. At the same time, the above design restricts the use of high-frequency, high-speed and conventional P-chip materials in PCBs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Such as figure 1 and figure 2 Shown, a kind of manufacturing method of PCB comprises the following steps:

[0069] S05, making the inner layer graphics on the inner layer core board;

[0070] S10. Provide the inner core board 2 that needs to be drilled, and set up a relief hole 21 on the inner core board 2 that needs to be drilled;

[0071] S15, performing super-roughening treatment on the inner core board;

[0072] S20, on the end surface of the inner layer core board 2 to be opened and on the edge of the relief hole 21, make a glue-resisting protrusion 4;

[0073] S25, browning the inner core board;

[0074] S30, providing a non-perforated core board and a prepreg 5, and pressing the non-perforated core board, the prepreg 5 and the inner core board 2 to be perforated to form a laminated board with a closed cavity;

[0075] S40, drilling the plywood, and performing post-drilling treatment;

[0076] S50, performing electroless copper deposition and electroplating...

Embodiment 2

[0093] Such as figure 1 and image 3 Shown, a kind of manufacturing method of PCB comprises the following steps:

[0094] S05, making the inner layer graphics on the inner layer core board;

[0095] S10. Provide the inner core board 2 that needs to be drilled, and set up a relief hole 21 on the inner core board 2 that needs to be drilled;

[0096] S15, performing super-roughening treatment on the inner core board;

[0097] S20, on the end surface of the inner layer core board 2 to be opened and on the edge of the relief hole 21, make a glue-resisting protrusion 4;

[0098] S25, browning the inner core board;

[0099] S30, providing a non-perforated core board and a prepreg 5, and pressing the non-perforated core board, the prepreg 5 and the inner core board 2 to be perforated to form a laminated board with a closed cavity;

[0100] S40, drilling the plywood, and performing post-drilling treatment;

[0101] S50, performing electroless copper deposition and electroplating ...

Embodiment 3

[0120] Such as figure 1 and Figure 4 Shown, a kind of manufacturing method of PCB comprises the following steps:

[0121] S05, making the inner layer graphics on the inner layer core board;

[0122] S10. Provide the inner core board 2 that needs to be drilled, and set up a relief hole 21 on the inner core board 2 that needs to be drilled;

[0123] S15, performing super-roughening treatment on the inner core board;

[0124] S20, on the end surface of the inner layer core board 2 to be opened and on the edge of the relief hole 21, make a glue-resisting protrusion 4;

[0125] S25, browning the inner core board;

[0126] S30, providing a non-perforated core board and a prepreg 5, and pressing the non-perforated core board, the prepreg 5 and the inner core board 2 to be perforated to form a laminated board with a closed cavity;

[0127] S40, drilling the plywood, and performing post-drilling treatment;

[0128] S50, performing electroless copper deposition and electroplating...

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Abstract

The invention discloses a PCB manufacturing method, comprising the following steps: S10. Providing an inner-layer core plate to be holed and forming avoidance holes in the inner-layer core plate to be holed; S20, making adhesive blocking projections on the end faces of the inner-layer core plate to be holed and at the edges of the avoidance holes; S30, providing an hole-less core plate and a prepreg and laminating the hole-less core plate, the prepreg and the inner-layer core plate to be holed to form a laminated plate having a closed cavity. According to the scheme provided by the invention, since the adhesive blocking projections are formed at the edges of the avoidance holes, adhesive flowing inside the closed cavity can be controlled effectively and the complete shape of the inner wall can be ensured; moreover, the application of high-frequency high-speed material to the PCB having a closed cavity can be expanded and the signal transmission quality and speed can be enhanced.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a method for manufacturing a PCB. Background technique [0002] Electronic products are indispensable tools for modern life and work. People have higher and higher requirements for the performance of electronic products, and the acceleration of signal transmission speed and the reduction of process loss are the main requirements of electronic products at present. At present, the methods to increase signal propagation speed and reduce loss mainly include reducing the dielectric constant of materials, improving stacking, and circuit design. In order to meet the high requirements of electronic products for signal quality, the high-end design of embedding a closed cavity inside the PCB can not only increase the signal transmission speed of the circuit board, but also further reduce the signal loss. [0003] It is difficult to embed the closed cavity inside the PCB. At present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/32
CPCH05K1/185H05K3/321H05K2203/1322
Inventor 傅宝林纪成光李民善袁继旺
Owner DONGGUAN SHENGYI ELECTRONICS
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