Manufacturing method of PCB

A production method and glue-resistance technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of semi-cured P sheet not belonging to high-frequency and high-speed materials, restricting use, and signal loss, etc., to improve signal Transmission quality and speed, and the effects of expanded use

Active Publication Date: 2016-04-27
DONGGUAN SHENGYI ELECTRONICS
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is difficult to embed the closed cavity inside the PCB. At present, in order to control the glue flow inside the closed cavity and the shape of the cavity, most designs use pre-cured P sheets that do not flow or have low fluidity for lamination,

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of PCB
  • Manufacturing method of PCB
  • Manufacturing method of PCB

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0049] Example 1:

[0050] like figure 1 and figure 2 As shown, a manufacturing method of a PCB includes the following steps:

[0051] S05. Make the inner layer graphics on the inner layer core board;

[0052] S10, providing the inner layer core board 21 to be perforated and the prepreg 5, and pressing the inner core board 21 to be perforated and the prepreg 5 to form the sub-board 2;

[0053] S20, setting up an escape hole 22 on the sub-board 2;

[0054] S25, super-roughening the sub-board 2;

[0055] S30, forming glue-resisting protrusions 4 on the end face of the sub-board 2 and at the edge of the escaping hole 22;

[0056] S40, providing a non-perforated core board and a prepreg 5, and pressing the non-perforated core board, the prepreg 5 and the sub-board 2 to form a pressing board with a closed cavity;

[0057] S50, drilling the pressed plate, and performing post-drilling treatment;

[0058] S60, perform chemical copper immersion and electroplating treatment on t...

Example Embodiment

[0071] Embodiment 2:

[0072] like figure 1 and image 3 As shown, a manufacturing method of a PCB includes the following steps:

[0073] S05, making inner layer graphics on the inner layer core board.

[0074] S10, providing the inner layer core board 21 to be perforated and the prepreg 5, and pressing the inner core board 21 to be perforated and the prepreg 5 to form the sub-board 2;

[0075] S20, setting up an escape hole 22 on the sub-board 2;

[0076] S25, super-roughening processing is performed on the sub-board 2.

[0077] S30, forming glue-resisting protrusions 4 on the end face of the sub-board 2 and at the edge of the escaping hole 22;

[0078] S40, providing a non-perforated core board and a prepreg 5, and pressing the non-perforated core board, the prepreg 5 and the sub-board 2 to form a pressing board with a closed cavity.

[0079] S50, drilling the pressed plate, and performing post-drilling treatment;

[0080] S60, perform chemical copper immersion and el...

Example Embodiment

[0095] Embodiment three:

[0096] like figure 1 and Figure 4 As shown, a manufacturing method of a PCB includes the following steps:

[0097] S05, making inner layer graphics on the inner layer core board.

[0098] S10, providing the inner layer core board 21 to be perforated and the prepreg 5, and pressing the inner core board 21 to be perforated and the prepreg 5 to form the sub-board 2;

[0099] S20, setting up an escape hole 22 on the sub-board 2;

[0100] S25, super-roughening processing is performed on the sub-board 2.

[0101] S30, forming glue-resisting protrusions 4 on the end face of the sub-board 2 and at the edge of the escaping hole 22;

[0102] S40, providing a non-perforated core board and a prepreg 5, and pressing the non-perforated core board, the prepreg 5 and the sub-board 2 to form a pressing board with a closed cavity.

[0103] S50, drilling the pressed plate, and performing post-drilling treatment;

[0104] S60, perform chemical copper immersion a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a manufacturing method of a PCB. The manufacturing method comprises the following steps: S10, providing a pored inner layer core plate and a prepreg, and laminating the pored inner layer core plate and the prepreg to form a sub-plate; S20, forming an avoidance hole in the sub-plate; S30, manufacturing a rubber blocking bulge on the end surface of the sub-plate and at the position of the edge of the avoidance hole; and S40, providing a non-pored core plate and a prepreg, and laminating the non-pored core plate, the prepreg and the sub-plate to form a laminating plate with a sealing cavity. In the scheme, through twice laminating forming, firstly the pored inner layer core plate is laminated to form the sub-plate, and the avoidance hole is integrally formed in the sub-plate, so that the smoothness of inner wall shape of the avoidance hole is guaranteed; and then the rubber blocking bulge is arranged at the edge of the avoidance hole, and the sub-plate and the non-pored core plate are laminated to form the laminating plate, so that internal gumming of the sealing cavity can be effectively controlled, the integrality of the inner wall shape is guaranteed; and meanwhile, the application of high-frequency and high-speed materials in the PCB is widened, and the quality and speed of signal transmission are promoted.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a method for manufacturing a PCB. Background technique [0002] Electronic products are indispensable tools for modern life and work. People have higher and higher requirements for the performance of electronic products, and the acceleration of signal transmission speed and the reduction of process loss are the main requirements of electronic products at present. At present, the methods to increase signal propagation speed and reduce loss mainly include reducing the dielectric constant of materials, improving stacking, and circuit design. In order to meet the high requirements of electronic products for signal quality, the high-end design of embedding a closed cavity inside the PCB can not only increase the signal transmission speed of the circuit board, but also further reduce the signal loss. [0003] It is difficult to embed the closed cavity inside the PCB. At present...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46
CPCH05K3/4697H05K2203/052
Inventor 傅宝林纪成光李民善袁继旺
Owner DONGGUAN SHENGYI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap