A method of manufacturing a pcb

Abstract

The invention discloses a fabrication method of a printed circuit board (PCB). The fabrication method comprises the following steps of S10, opening a concession hole on a sub board; S20, providing a non-opened core board, and fabricating an adhesive prevention bulge on the end surface, near to the sub board, of the non-opened core board adjacent to the sub board; and S30, providing a prepreg, laminating the non-opened core board, the prepreg and the sub board so that the adhesive prevention bulge covers the end part of the concession hole to form a lamination board with a closed hollow cavity. According to the scheme, the adhesive prevention bulge is arranged on the non-opened core board adjacent to the sub board and covers the openings at the two ends of the concession holes, so that internal adhesive flow of the closed hollow cavity is effectively controlled, and the shape of the inner wall is ensured to be in good condition; and meanwhile, the application of a high-frequency and high-speed material in the PCB with the closed hollow cavity is expanded, the signal transmission quality is improved, and the signal transmission speed is increased.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a method for manufacturing a PCB. Background technique [0002] Electronic products are indispensable tools for modern life and work. People have higher and higher requirements for the performance of electronic products, and the acceleration of signal transmission speed and the reduction of process loss are the main requirements of electronic products at present. At present, the methods to increase signal propagation speed and reduce loss mainly include reducing the dielectric constant of materials, improving stacking, and circuit design. In order to meet the high requirements of electronic products for signal quality, the high-end design of embedding a closed cavity inside the PCB can not only increase the signal transmission speed of the circuit board, but also further reduce the signal loss. [0003] It is difficult to embed the closed cavity inside the PCB. At present...

AI Technical Summary

Problems solved by technology

[0003] It is difficult to embed the closed cavity inside the PCB. At present, in order to control the glue flow inside the closed cavity and the shape of the cavity, most designs use pre-cured P sheets that do not flow or have low fluidity for lamination, but this type of semi-cured Cured P-chip is not a high-frequency and high-speed material, and has a certain loss on the signal. At the same time, the above design restricts the use of high-frequency, high-speed and conventional P-chip materials in PCBs.

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