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217results about How to "Fast signal transmission" patented technology

3D assembling method for integrally integrating chips of T/R assembly

The invention provides a 3D assembling method for integrally integrating chips of T/R assembly, and aims to provide a T/R assembly which has advantages of reliable performance, higher density, more functions, high signal transmission speed, better performance and relatively lower cost. The 3D assembling method is realized through a solution which comprises the steps of performing z-direction expansion on a planar circuit with printed circuit patterns to a green ceramic chip laminate of a three-dimensional circuit through interlayer vertical interconnection; vertically packaging an active device in a rectangular chamber (7) of the green ceramic chip laminate (5), placing a power supply modulator on the back surface of the bottom of the green ceramic chip laminate, and inputting an outer signal from a low-frequency interface at the back surface of the green ceramic chip laminate to a pad of the green ceramic chip laminate (5); performing radio frequency connection among chips through a metal wire bonding vertical interconnection structure among the green ceramic chip laminates, accurately aligning and laminating the green ceramic laminates in a Z direction, and then sintering at a temperature of 900 DEG C, thereby preparing a three-dimensional circuit low-temperature co-sintered ceramic LTCC substrate which is used for high-density circuits with no three-dimensional space interference and is internally provided with a passive element and can be equipped with bare chips or package chips on the surface.
Owner:10TH RES INST OF CETC

Method and device for monitoring power transmission line

The invention relates to monitoring technology of power transmission lines, in particular to technology for monitoring ice coating and waving states of the power transmission lines. The invention discloses a method and a device for monitoring the power transmission line by using fiber sensors in real time. The method for monitoring the power transmission line is characterized by comprising the following steps: arranging the fiber sensors along the power transmission line to detect characteristic parameters of different positions of a lead; and judging the state of the power transmission line according to the analysis of the characteristic parameters. The device for monitoring the power transmission line comprises the fiber sensors and a signal transmitting and processing system, and is characterized in that the fiber sensors are arranged along the length direction of the power transmission line and used for detecting and transmitting the characteristic parameters of the different positions of the power transmission line. The method and the device are used for monitoring the ice coating and waving states of the power transmission lines, can fully exert the advantages of the fiber sensors to carry out multi-parameter real-time on-line detection, and have the characteristics that the device has long service life and can work for long time reliably under on-site severe environment conditions.
Owner:SICHUAN HUIYUAN OPTICAL COMM CO LTD

Cordierite-based microcrystalline glass material and preparation method thereof

Belonging to the field of electronic ceramic materials, the invention provides a cordierite-based microcrystalline glass material and a preparation method thereof, and overcomes the problem of poor matching with silicon chips caused by large thermal expansion coefficient, low flexural strength, high dielectric constant, high dielectric loss and the like of existing ceramic materials. The cordierite-based microcrystalline glass material provided by the invention belongs to a magnesium-aluminum-silicon system, the principal crystalline phase is cordierite, the density is high, the flexural strength is up to 230MPa, the Young's modulus is 80-100GPa high, the thermal stability is good, the thermal expansion coefficient is 1.5-2.5*10<-6> / DEG C (20-600DEG C) low, and the cordierite-based microcrystalline glass material can form good match with silicon chips. At the same time, the dielectric constant can be adjusted to 4.5-5.0, the dielectric loss is tan Delta is less than 0.6*10<-3>, the signal transmission speed is greatly improved, and the power consumption is greatly reduced. In addition, in the preparation process, the temperature is lowered from the 1100DEG C or above in the traditional sintering process to 900DEG C or below, under the premise of improving the performance, the sintering temperature is further reduced and the production cost is saved. Moreover, the whole preparation technology has the characteristics of simple process, abundant raw material sources and energy consumption reduction, thus being of important significance for industrial production.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Wireless digital power supply line fault alarm device and method

The invention relates to the technical field of power line detection, in particular to a wireless digital power supply line fault alarm device and a wireless digital power supply line fault alarm method. The device comprises a signal pick-up unit, a processing unit, and an indicating unit, and is characterized in that: the signal pick-up unit comprises a conductive rubber block, a magnetic permeability material and a coil; the conductive rubber block and the magnetic permeability material form a button clamping structure; the coil is wound on the magnetic permeability material to form a current transformer for picking up current and voltage signals; the processing unit comprises a power-off detection unit, a power supply detection unit, a short-circuit detection unit and a grounding detection unit; and the indicating unit comprises a flop unit, an indicator light unit and a radio-frequency unit. The system and the method have the advantages that: 1) wireless signals are uploaded to a control center, so fault points can be accurately positioned in real time; 2) the labor intensity is lightened, and the fault points are quickly transmitted to the control center; and 3) the indication of faults is obvious, and the system and the method are suitable for wide promotion and have important effect of ensuring safe operation of a power grid.
Owner:鞍山银宇电子科技有限公司

Fin-type field effect transistor and formation method thereof

Disclosed are a fin-type field effect transistor and a formation method thereof. The formation method of the fin-type field effect transistor includes the following steps: providing a substrate and forming a fin part on the substrate; forming a silicon-carbon layer on the surface of the fin part; carrying out thermal decomposition on the silicon-carbon layer so that the silicon-carbon layer of a part thickness or all thickness is changed into a graphene layer; carrying out hydrotreating on the graphene layer so that a hydrogen-containing energy gap structure is formed on the surface layer of the graphene layer; forming a gate dielectric layer on the graphene layer and forming a first gate electrode which crosses the gate dielectric layer on the gate dielectric layer; removing the gate dielectric layer and the graphene layer at the two ends of the fin part and forming epitaxial layers with doping on the surface of the exposed fin part, wherein the epitaxial layers and the first gate electrode are separated by the remaining gate dielectric layer and the graphene layer and the epitaxial layers with doping at the two ends of the fin part are used respectively as a source electrode and a drain electrode. The hydrogen-containing energy gap structure introduces an energy gap into the graphene layer and the graphene layer with the hydrogen-containing energy gap structure is used as a channel area so that the mobility ratio of carriers in the transistor is improved.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Intelligent sensitive chair and vehicle

The invention provides an intelligent sensitive chair and a vehicle and relates to the technical field of automobile equipment. The intelligent sensitive chair comprises at least one sensor, wherein the sensor is arranged in at least one position of a chair backrest, a cushion and a headrest; a conductive board for enhancing brain wave signal transmission is arranged on one side contacting a passenger, of the sensor; a reflection receiving board for receiving brain waves of different frequencies is arranged on the other side of the sensor; each sensor is connected with a vehicle-mounted information processor; the vehicle-mounted information processor is connected with an overall vehicle intelligent control module; the vehicle-mounted information processor is used for storing, analyzing andprocessing sensation signals of the sensor to form adjusting signals which are transmitted to the overall vehicle intelligent control module; the overall vehicle intelligent control module is used for receiving adjusting signals of the vehicle-mounted information processor and used for respectively controlling action adjustment and/or function adjustment of the chair backrest, the cushion and theheadrest. By adopting the technical scheme of the invention, brain wave signals can be received, and chairs in the vehicle can be automatically controlled and adjusted appropriately.
Owner:ZHEJIANG GEELY AUTOMOBILE RES INST CO LTD +1

Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method

The invention discloses a multi-cycle arrangement carrier-free double-integrated chip (IC) package and a production method. The package comprises a lead frame, inner leads, IC chips and a plastic package body. The inner leads of the lead frame are arranged on the four sides of the lead frame to form a plurality of cycles; one IC chip is provided with salient points, and the other IC chip is not provided with the salient points; the salient points of the IC chip with the salient points are arrange on the inner leads of the first cycle; the back of the IC chip with the salient points is provided with a die bonding adhesive; and a soldering-pan on the IC chip without the salient points is connected with the inner leads of the second cycle by weld lines to form bonding wires. Compared with the number design of the leads of a single lead frame with the same area, the number of the inner leads of the package provided by the invention is increased by over 40 percent; due to an upper face-down chip, the double-IC package has a short thermal conduction distance, relatively higher thermal properties, high signal transmission speed, low distortion and high electrical properties, and reduces the internal welding inductance and capacitance of a circuit; and a height formed by the salient points of the upper face-down chip and soldering flux is far lower than the camber of the weld line so as to avoid the wire crossing and open circuit of the weld lines and improve test yield and reliability.
Owner:TIANSHUI HUATIAN TECH +1

Low-thermal-expansion cordierite-based microcrystalline glass material and preparation method thereof

The invention belongs to the field of electronic ceramic materials, and provides a low-thermal-expansion cordierite-based microcrystalline glass material and a preparation method thereof, which are used for super-large-scale integrated circuit packaging. The microcrystalline glass material disclosed by the invention is prepared from the following components in percentage by mass: 15 to 19 percentof MgO, 26 to 30 percent of Al2O3, 46 to 50 percent of SiO2, 2 to 6 percent of ZrO2, 1 to 5 percent of B2O3 and 1 to 3 percent of K2O. By introducing K2O as a modifier, ZrO2 as a nucleating agent andB2O3 as a burning reducing agent, a part of (MgAl2Si3O10)0.6 phase is inhibited from being converted into an Mg2Al4Si5O18 phase, so that the thermal expansion coefficient is adjusted to be close to that of a Si chip (3.5*10<-6>/DEG C) and is adjustable at the temperature of (2.5-3.5)*10<-6>/DEG C, and the thermal stability is good; meanwhile, the bending strength can reach 150-200 MPa, the Young'smodulus can reach 80-95 GPa, the dielectric constant is low by 5-6 (at 1 MHz), the dielectric loss is low by 0.5-1*10<-3>(at 1 MHz), so that the signal transmission speed can be increased, and the power consumption is greatly reduced. In conclusion, the low-thermal-expansion cordierite-based microcrystalline glass material is suitable for ultra-large-scale integrated circuit packaging, can significantly reduce signal transmission delay and reduce power consumption, and is well matched with a silicon chip.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Kitchen automatic fire extinguishing device achieving zone control

The invention belongs to fire extinguishing equipment, and particularly relates to a kitchen automatic fire extinguishing device achieving zone control. The kitchen automatic fire extinguishing device comprises a plurality of fire extinguishing mechanisms, a fire extinguishing box and a control box. A plurality of fire signal transmission devices are further included. The number of the fire signal transmission devices is the same as that of the fire extinguishing mechanisms. The input ends of the fire signal transmission devices are connected with the fire extinguishing mechanisms, and the output ends of the fire signal transmission devices are connected with the control box. According to the kitchen automatic fire extinguishing device, under the conditions that the area of a kitchen is too large, or the kitchen is divided into a plurality of zones, and even kitchens are distributed in different rooms, one corresponding fire signal transmission device only needs to be mounted on each fire extinguishing mechanism, multiple units of equipment can be jointly connected to the control box and the fire extinguishing box, multiple sets of equipment do not need to be mounted, and mounting cost is reduced; and zone control can be carried out on the different zones, targeted fire extinguishing can be carried out when a fire happens, and fire extinguishing materials and kitchen food material losses are greatly reduced.
Owner:陕西卫仕厨房灭火设备有限公司

Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof

The invention discloses a multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and a manufacturing method thereof. The multi-turn arranged carrier-free IC chip packaging component comprises a lead frame, inner pins, an IC chip and a plastic packaging body, wherein the lead frame is a carrier-free lead frame, the inner pins of the lead frame are arranged around four sides of the lead frame in turns, the IC chip is provided with bumps, and the bumps are connected to the inner pins. The number of pins of the packaging component in the invention is increased by over 40% compared with the number of the pins of a single-row lead frame with the same area; and bonding lines are not needed for the connection of the pins and the lead frame, and the structure is simple and reasonable. The heat conduction distance is short, the heat performance is excellent, the inner welding inductance and capacitance of a circuit are reduced due to direct contact between the bumps and the frame (a base plate and a chip), the signal transmission is fast, the little distortion is caused, and the electric performance is excellent; in addition, the thickness and the weight of packaging are reduced, thus the crossing and the open circuit of bonding wires are avoided, and the test yield and reliability are improved.
Owner:TIANSHUI HUATIAN TECH +1
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