The invention belongs to the field of electronic ceramic materials, and provides a low-thermal-expansion cordierite-based microcrystalline glass material and a preparation method thereof, which are used for super-large-scale integrated circuit packaging. The microcrystalline glass material disclosed by the invention is prepared from the following components in percentage by mass: 15 to 19 percentof MgO, 26 to 30 percent of Al2O3, 46 to 50 percent of SiO2, 2 to 6 percent of ZrO2, 1 to 5 percent of B2O3 and 1 to 3 percent of K2O. By introducing K2O as a modifier, ZrO2 as a nucleating agent andB2O3 as a burning reducing agent, a part of (MgAl2Si3O10)0.6 phase is inhibited from being converted into an Mg2Al4Si5O18 phase, so that the thermal expansion coefficient is adjusted to be close to that of a Si chip (3.5*10<-6>/DEG C) and is adjustable at the temperature of (2.5-3.5)*10<-6>/DEG C, and the thermal stability is good; meanwhile, the bending strength can reach 150-200 MPa, the Young'smodulus can reach 80-95 GPa, the dielectric constant is low by 5-6 (at 1 MHz), the dielectric loss is low by 0.5-1*10<-3>(at 1 MHz), so that the signal transmission speed can be increased, and the power consumption is greatly reduced. In conclusion, the low-thermal-expansion cordierite-based microcrystalline glass material is suitable for ultra-large-scale integrated circuit packaging, can significantly reduce signal transmission delay and reduce power consumption, and is well matched with a silicon chip.