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Epoxy resin composite material as well as preparation method and application thereof

A technology of epoxy resin and composite materials, which is applied in the field of composite materials, can solve the problems of reducing dielectric constant, increasing material manufacturing costs, and expensive POSS, and achieves the goal of increasing transmittance, reducing power consumption, and increasing signal transmission speed Effect

Inactive Publication Date: 2018-12-14
LUOYANG INST OF CUTTING EDGE TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN106189087 prepares POSS type epoxy resin composite material with POSS as modifier, also can reduce the dielectric constant of material, but POSS price is extremely expensive, has increased the manufacturing cost of material

Method used

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  • Epoxy resin composite material as well as preparation method and application thereof
  • Epoxy resin composite material as well as preparation method and application thereof

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preparation example Construction

[0022] The preparation method of epoxy resin composite provided by the invention may further comprise the steps:

[0023] Such as figure 1 As shown in step S101, bisphenol AF is completely dissolved in epichlorohydrin, and then a catalyst is added to react to obtain a resin ether compound. In this step, bisphenol AF is completely dissolved in epichlorohydrin at 60-80°C, preferably at 70°C, and then a phase shift catalyst tetrabutylammonium bromide with a mass fraction of 0.05%-0.15% is added Reaction, preferably the phase shift catalyst tetrabutylammonium bromide reaction with a mass fraction of 0.1%, heat preservation for 0.5 to 1.5 hours, preferably heat preservation for 1 hour, to obtain a resin ether compound, wherein the bisphenol AF and the epoxy The molar ratio of chloropropane is 1:2-1:6, preferably 1:4.

[0024] Such as figure 1 As shown in step S102, the resin etherified product is reacted with NaOH solution to obtain bisphenol AF chloroether alcohol. In this ste...

Embodiment 1

[0028](1) Synthesis of fluorine-containing resin: Add bisphenol AF and epichlorohydrin at a molar ratio of 1:4 into a three-neck round bottom flask, vacuumize, feed nitrogen, heat up to 70°C, stir and mix, and wait for bisphenol AF After completely dissolving in epichlorohydrin, add a phase transfer catalyst tetrabutylammonium bromide with a mass fraction of 0.1%, and keep it warm for 1 hour to obtain a resin ether compound, add 30% NaOH solution, and heat it at 70°C for 2 hours to get bisphenol AF chloroether alcohol, wherein, the molar ratio of bisphenol AF and NaOH is 1:0.1, after the completion, the unreacted epichlorohydrin is recovered by vacuum distillation, and then 40% NaOH solution is added dropwise, bisphenol AF and NaOH The molar ratio of the fluorine-containing epoxy resin was 1:1.5, reacted for 2 hours, and the reaction was completed, filtered and washed to obtain a fluorine-containing epoxy resin, wherein the purity of the fluorine-containing epoxy resin was 97%....

Embodiment 2

[0031] (1) Synthesis of fluorine-containing resin: Add bisphenol AF and epichlorohydrin at a molar ratio of 1:4 into a three-neck round bottom flask, vacuumize, feed nitrogen, heat up to 70°C, stir and mix, and wait for bisphenol AF After completely dissolving in epichlorohydrin, add a phase transfer catalyst tetrabutylammonium bromide with a mass fraction of 0.1%, and keep it warm for 1 hour to obtain a resin ether compound, add 30% NaOH solution, and heat it at 70°C for 2 hours to get bisphenol AF chloroether alcohol, wherein the molar ratio of bisphenol AF to NaOH is 1:0.1. Recover unreacted epichlorohydrin, then add dropwise 40NaOH solution, the molar ratio of bisphenol AF and NaOH is 1:2, react for 2h, after the reaction is completed, filter and wash to obtain fluorine-containing epoxy resin, wherein, fluorine-containing epoxy The purity of the resin was 97.5%.

[0032] (2) Preparation of low-dielectric epoxy resin composite material: Mix fluorine-containing epoxy resin ...

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Abstract

The invention provides a preparation method of an epoxy resin composite material. The preparation method of the epoxy resin composite material comprises the following steps: completely dissolving bisphenol AF into epoxy chloropropane, adding a catalyst and reacting to obtain resin etherate; performing reaction on the resin etherate and a NaOH solution to obtain bisphenol AF chlorine ether glycol;adding the NaOH solution into the bisphenol AF chlorine ether glycol dropwise to obtain fluorine-containing epoxy resin; and mixing the fluorine-containing epoxy resin and a curing agent uniformly, adding a catalyst, mixing and curing to prepare the epoxy resin composite material. The invention also provides the epoxy resin composite material prepared by the above method as well as the applicationof the epoxy resin composite material serving as an electronic material and a wave-transmitting material. C-F is formed in introducing F into the resin structure to replace C-H, and the polarity of the resin structure is reduced, so that the epoxy resin composite material with low dielectric constant, low dielectric loss and high heat stability is prepared and can be widely applied to the fieldsof printed circuit boards, coating, microelectronics and the like.

Description

technical field [0001] The invention relates to the field of composite materials, specifically, an epoxy resin composite material and its preparation method and application Background technique [0002] Epoxy resin refers to a class of organic polymer compounds containing two or more epoxy groups in the molecule. It has good adhesive performance, small deformation shrinkage, high mechanical strength, abundant raw material sources, low cost, and easy Processing and molding characteristics, widely used in printed circuit boards, coatings, microelectronics and other fields. However, epoxy resins have disadvantages such as easy cracking, poor fatigue resistance and high dielectric constant after curing, so that the dielectric properties of general epoxy resins cannot meet the requirements of today's low dielectric materials. Therefore, it is urgent to study materials with low dielectric properties. Constant epoxy resin composites. [0003] At present, the preparation method of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/06C08L63/00
CPCC08G59/063C08L63/00C08L2201/08C08L2203/20C08G59/06C08G59/68
Inventor 不公告发明人
Owner LUOYANG INST OF CUTTING EDGE TECH
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