Low-thermal-expansion cordierite-based microcrystalline glass material and preparation method thereof

Abstract

The invention belongs to the field of electronic ceramic materials, and provides a low-thermal-expansion cordierite-based microcrystalline glass material and a preparation method thereof, which are used for super-large-scale integrated circuit packaging. The microcrystalline glass material disclosed by the invention is prepared from the following components in percentage by mass: 15 to 19 percentof MgO, 26 to 30 percent of Al2O3, 46 to 50 percent of SiO2, 2 to 6 percent of ZrO2, 1 to 5 percent of B2O3 and 1 to 3 percent of K2O. By introducing K2O as a modifier, ZrO2 as a nucleating agent andB2O3 as a burning reducing agent, a part of (MgAl2Si3O10)0.6 phase is inhibited from being converted into an Mg2Al4Si5O18 phase, so that the thermal expansion coefficient is adjusted to be close to that of a Si chip (3.5*10<-6>/DEG C) and is adjustable at the temperature of (2.5-3.5)*10<-6>/DEG C, and the thermal stability is good; meanwhile, the bending strength can reach 150-200 MPa, the Young'smodulus can reach 80-95 GPa, the dielectric constant is low by 5-6 (at 1 MHz), the dielectric loss is low by 0.5-1*10<-3>(at 1 MHz), so that the signal transmission speed can be increased, and the power consumption is greatly reduced. In conclusion, the low-thermal-expansion cordierite-based microcrystalline glass material is suitable for ultra-large-scale integrated circuit packaging, can significantly reduce signal transmission delay and reduce power consumption, and is well matched with a silicon chip.

Description

Technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a cordierite-based glass-ceramic material with low thermal expansion and a preparation method thereof; it is particularly suitable for ultra-large-scale integrated circuit packaging. Background technique [0002] In recent years, the rapid development of information technology has promoted the ultra-large-scale and multi-functionalization of integrated circuits, and the search for packaging materials with excellent performance has become the focus of attention; MgO-Al 2 O 3 -SiO 2 Series glass-ceramics have the characteristics of low thermal expansion coefficient and excellent dielectric properties, but there are problems such as poor mechanical properties and high sintering temperature. [0003] For example, Journal of Non-Crystalline Solids, 2015, 419: 16-26 report, K 2 The influence of O on the properties of magnesium-aluminum-silicon-based glass-ceramics. The components of t...

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Problems solved by technology

[0005] The present invention aims at problems such as poor mechanical properties, mismatched thermal expansion coefficients, and large dielectric loss in the existing ceramic materials in the background technology, which lead to large signal transmission delays and high power cons

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