31results about How to "Reduce signal transmission delay" patented technology

A multiplexer for selecting a single output signal from a plurality of input signals. For a plurality of complementary input signal pairs in particular, the multiplexer includes for each pair of complementary input signals a control sub-circuit having a selection switch and a common resistance in parallel. The switch and the common resistance have a common low-potential node that is tied to a pair of resistances that are in parallel, wherein each of the parallel resistances is coupled to the respective high-potential nodes of a differential amplifier. A particular pair of incoming complementary input signal pairs controls the differential amplifier. An off-circuit selection signal selects which switch of a plurality of control sub-circuits is activated. When a switch is on, it creates a bypassing of the common resistance, thereby enabling the turn-on of output drivers coupled to the differential amplifier. When a switch is off, the potential drops across the common resistance and the parallel resistances reduce the potential at the output drivers' control nodes enough to block their turn-on. As a result, the only output drivers providing signal output are those associated with the one selected control sub-circuit having its switch turned on.

The invention belongs to the field of electronic ceramic materials, and provides a low-thermal-expansion cordierite-based microcrystalline glass material and a preparation method thereof, which are used for super-large-scale integrated circuit packaging. The microcrystalline glass material disclosed by the invention is prepared from the following components in percentage by mass: 15 to 19 percentof MgO, 26 to 30 percent of Al2O3, 46 to 50 percent of SiO2, 2 to 6 percent of ZrO2, 1 to 5 percent of B2O3 and 1 to 3 percent of K2O. By introducing K2O as a modifier, ZrO2 as a nucleating agent andB2O3 as a burning reducing agent, a part of (MgAl2Si3O10)0.6 phase is inhibited from being converted into an Mg2Al4Si5O18 phase, so that the thermal expansion coefficient is adjusted to be close to that of a Si chip (3.5*10<-6>/DEG C) and is adjustable at the temperature of (2.5-3.5)*10<-6>/DEG C, and the thermal stability is good; meanwhile, the bending strength can reach 150-200 MPa, the Young'smodulus can reach 80-95 GPa, the dielectric constant is low by 5-6 (at 1 MHz), the dielectric loss is low by 0.5-1*10<-3>(at 1 MHz), so that the signal transmission speed can be increased, and the power consumption is greatly reduced. In conclusion, the low-thermal-expansion cordierite-based microcrystalline glass material is suitable for ultra-large-scale integrated circuit packaging, can significantly reduce signal transmission delay and reduce power consumption, and is well matched with a silicon chip.

The invention discloses a measuring device and a measuring method for target-hitting moments. Optical fiber sensors are respectively composed of a single sensing optical fiber, are arranged in a target in a reciprocating mode and cover the target surface area of the target, and the arrangement distance between the optical fiber sensors is smaller than the diameter of an area formed by target hitting of test bullets; optical signals emitted by a light source are transmitted to a photoelectric detector through the optical fiber sensors, converted into electric signals through the photoelectric detector and input into an information collecting and processing module after undergoing signal processing; a time service module obtains the current time information for being used by the information collecting and processing module; when the on-off state signals of the optical fibers are changed to 0 indicating the non-light transmission state from 1 indicating the light transmission state, the time information in the time service module is read and serves as the target-hitting moment. The device and the method can accurately measure the target-hitting moments of the test bullets and can serve as auxiliary analysis means of other range measuring modes, and the extraction efficiency of effective data can be improved. According to the implementation scheme, the method has the advantages that the cost is low, the response speed is high, the measurement accuracy is high, the reliability is high, installing and laying are simple and the anti-jamming capability is high.

The invention discloses a packaging piece based on a substrate and adopting a slotting technology and a manufacturing process of the packaging piece. The packaging piece is mainly composed of a lead frame, a PAD, a solder ball, conducting adhesive, a chip, a bonding wire and a plastic package body. The PAD and the solder ball are arranged on the lead frame, and a notch is formed in the lead frame. The chip is connected into the notch of the lead frame through the conducting adhesive, and welding spots on the chip are connected with the PAD on the lead frame through the bonding wire. The chip, the bonding wire, the solder ball and the lead frame form a power and signal channel of a circuit. The plastic package body wraps the lead frame, the PAD, the solder ball, the chip and the bonding wire. The procedures of the manufacturing process are wafer thinning, scribing, substrate slotting and ball replacing, chip installing, installed chip baking, bonding, plasma cleaning, post curing, plastic packaging and product finishing. According to the packaging piece based on the substrate and adopting the slotting technology and the manufacturing process of the packaging piece, electric heating performance of the chip is improved, and the performance of the whole packaging piece is improved greatly.

The invention relates to a direct-current electromagnetic relay drive circuit and a drive method therefor. The drive circuit comprises a voltage source, a closed circuit and a power consumption suppression circuit, wherein the relay is arranged between the voltage source and the closed circuit; the power consumption suppression circuit is arranged between the voltage source and the relay; the voltage source is used for providing a direct-current power supply voltage which is higher than a rated voltage value of a relay coil; the closed circuit comprises a drive transistor; the transistor is conducted on the basis of a drive control signal for closing the relay, so that a current path is provided for electrifying the relay coil; the power consumption suppression circuit comprises an energy storage capacitor and a power consumption suppression resistor; the energy storage capacitor is used for storing the power supply voltage before the drive transistor is conducted, and releasing the stored voltage to the relay coil after the drive transistor is conducted; and the power consumption suppression resistor is arranged to suppress the voltage of the coil no more than a rated value after the current of the coil reaches the rated value.

The invention provides the BGA package fixing structure of an LED module, which comprises an LED module, a PCB and a BGA surface-mount welding jig. The LED module is a light source device of a BGA package. The welding spots of a salient point array are positioned on the back surface of a BGA package substrate. An LSI chip is located on the front surface of the BGA package substrate. An LED light-emitting tube and a matching circuit, which are packaged and fixed by the mold or filled resin material, are arranged Inside the LSI chip. The LSI chip is electrically connected with the salient point array. The PCB is provided with a BGA light-source bonding pad. The BGA surface-mount welding jig is a positioning plate. The positioning plate is provided with more than one light source fixing hole. During the surface-mounting or welding process of the LED module, the positioning plate is detachably fixed on the PCB. The LED module is subjected to surface-mounting positioning or welding positioning on the PCB through the light source fixing hole. When the LED module is welded and fixed on the PCB, the positioning plate is taken down. According to the technical scheme of the invention, high-availability LED light sources can be manufactured through the BGA package.

The invention provides a driving protection circuit applied to a fully-controlled electric power electronic device. The protection circuit comprises a power supply VCC, a grid driving circuit, a grid resistor gearshift circuit, a Vce voltage detection protection circuit and a short circuit signal FAULT output circuit, wherein the power supply VCC is used for providing a work voltage, an input end of the grid driving circuit is connected with PWM pulses, the grid driving circuit is used for providing an output power and the PWM pulses for the electric power electronic device, the grid resistor gearshift circuit is used for making the electric power electronic device have relatively short turn-off time when the electric power electronic device is in a work state or making the electric power electronic device have the relatively long turn-off time when the electric power electronic device is in an overcurrent state, the Vce voltage detection protection circuit is used for detecting whether the electric power electronic device generates overcurrent during device conduction, and the short circuit signal FAULT output circuit is used for outputting a FAULT signal to a control end when the electric power electronic device generates overcurrent during device conduction.

The invention discloses an electric connector, which comprises at least one electric module, and is characterized in that the electric module comprises: a plurality of terminal assemblies, wherein each terminal assembly comprises two signal terminals with the same length, the two signal terminals are arranged along a first direction to form a differential pair, and the narrow sides of the two signal terminals are coupled; an insulating body which is provided with a plurality of accommodating grooves which are arranged in a second direction perpendicular to the first direction, wherein each accommodating groove is used for accommodating the corresponding terminal assembly; and at least one shielding piece which is fixed on the insulating body and is electrically isolated from the signal terminals, wherein two sides of the terminal assembly in the first direction are defined as a first side and a second side respectively, the shielding piece only shields one of the first side and the second side of each terminal assembly in the first direction, and one of the signal terminals in each differential pair is adjacent to the shielding piece in the first direction relative to the other signal terminal. The electric connector is good in high-frequency performance, interference attacks of differential pairs to outward emission can be reduced, and interference to the outside is reduced.

The invention discloses an adjustable all-optical signal format conversion assembly, device and conversion method, relates to the field of communication systems, and solves the problems that in the prior art, a photoelectric-optical conversion mode is adopted for 8QAM format conversion, signal transmission time delay is increased, high-speed large-capacity transmission of data traffic is not facilitated, and the conversion efficiency is high. A coupler, a high-nonlinearity optical fiber, a phase shifter and an attenuator are used for forming a nonlinear optical loop mirror, the nonlinear optical loop mirror is used for adjusting the amplitude state of an 8QAM signal, parameters of all assemblies in the nonlinear optical loop mirror are set, and the 8PSK or rectangular 8QAM signal is obtained. Therefore, network attacks on an electric layer can be effectively prevented, the processing of all-optical format conversion on signals of different modulation formats avoids a photoelectric-optical conversion mode, signal transmission time delay is reduced, and transmission of data traffic in a high-speed large-capacity transmission line is easier.

The invention provides a wireless communication system for supporting Relay characterized as comprising: base station, relay and terminal; wherein time slot of subframe is divided into uplink signal area and downlink signal area when base station and relay transmits data; the uplink signal area at least comprises uplink mixing zone, and downlink signal area at least comprises downlink mixing zone; relay receives broadcasting information, data and control signal transmitted by base station at downlink signal area; base station separately transmits data to terminal and relay at downlink direction; terminal transmit data to relay at uplink direction, and the relay receives and processes data and transmits the data to base station according to frequency resource allocated by base station; Themethod fully utilizes time frequency resource of system, reduces cost of system and promotes resource utilization.

The invention relates to the field of copper-clad plate materials, in particular to a flexible copper-clad plate material based on a perfluoroalkene ether copolymer and processing equipment of the flexible copper-clad plate material. According to the specific technical scheme, the flexible copper-clad plate material based on the perfluoroalkene ether copolymer comprises a base material film layer, and the base material film layer is composed of the perfluoroalkene ether copolymer or a composite material of the perfluoroalkene ether copolymer. The processing equipment of the flexible copper-clad plate material based on the perfluoroalkene ether copolymer comprises a pressurizing mechanism and a turnover mechanism, wherein the pressurizing mechanism has pressurizing and heating functions; and the turnover mechanism can integrally turnover the pressurizing mechanism. Compared with the prior art, the flexible copper-clad plate material and the preparation method thereof have the advantages of low dielectric constant, small dielectric loss, high temperature resistance, few processing steps and high processing efficiency.

The invention provides a trigonometric function and hyperbolic function extension instruction calculation device and a processor core. The device comprises a control signal generation module, a special angle judgment module, a storage module, an iteration module and an output selection module. The one-hot code coding is carried out on the control signal of the trigonometric function and hyperbolic function extension instruction calculation device, and since only one bit of the one-hot code is 1, secondary decoding of a funct3 signal is avoided, so that resource consumption of a hardware extension circuit is saved.

The invention discloses a vertical graphene interconnection structure-based on-chip spiral inductor. Single-layer graphene is obvious in interconnection power consumption and multilayer graphene is bad in heat conductivity in vertical direction. The vertical graphene interconnection structure-based on-chip spiral inductor comprises a substrate, a second metal layer at the top of the base; a firstmetal layer at the top of the second metal layer, a first through hole transmission channel, a second through hole transmission channel and sixteen graphene interconnection lines located on the firstmetal layer and wound into four turns. Compared with the interconnection of single-layer graphene, the interconnection of multilayer vertical graphene embodies advantages when the width is relativelylarge; compared with copper interconnection, the on-chip spiral inductor decreases the signal transmission delay in integrated circuits so as to reduce the power consumption; and compared with horizontal graphene interconnection, the on-chip spiral inductor is capable of effectively solving the heat conduction problems in vertical direction due to characteristic anisotropy of graphene, and is crucial in application in new technology similar to three-dimensional integrated circuits.

The invention provides a system and method for collecting rotation speed signals of an internal combustion engine. The system comprises a plurality of ECUs, the first-level ECU collects magneto-electric rotation speed signals, converts the collected magneto-electric rotation speed signals into Hall rotation speed signals and sends the Hall rotation speed signals to an MCU of the first-level ECU and the adjacent second-level ECU at the same time, the second-level ECU sends the Hall rotation speed signals to an MCU of the second-level ECU and the adjacent third-level ECU, and so is the third-level ECU. The magneto-electric rotation speed signals are converted into the Hall rotation speed signals in the ECUs, and in this way, cost of a special rotation speed processing circuit for extra exploitation is saved. The number of the ECUs capable of being connected is not limited by pins of the special rotation speed processing circuit, under the condition that signal transmission delay is not considered, numerous ECUs receive the rotation speed signals at the same time, and consistency that oil injection time can be calculated by the multiple ECUs at the same time is guaranteed.