BGA package fixing structure of LED module

Abstract

The invention provides the BGA package fixing structure of an LED module, which comprises an LED module, a PCB and a BGA surface-mount welding jig. The LED module is a light source device of a BGA package. The welding spots of a salient point array are positioned on the back surface of a BGA package substrate. An LSI chip is located on the front surface of the BGA package substrate. An LED light-emitting tube and a matching circuit, which are packaged and fixed by the mold or filled resin material, are arranged Inside the LSI chip. The LSI chip is electrically connected with the salient point array. The PCB is provided with a BGA light-source bonding pad. The BGA surface-mount welding jig is a positioning plate. The positioning plate is provided with more than one light source fixing hole. During the surface-mounting or welding process of the LED module, the positioning plate is detachably fixed on the PCB. The LED module is subjected to surface-mounting positioning or welding positioning on the PCB through the light source fixing hole. When the LED module is welded and fixed on the PCB, the positioning plate is taken down. According to the technical scheme of the invention, high-availability LED light sources can be manufactured through the BGA package.

Description

technical field [0001] The invention relates to the technical field of LED light sources, in particular to a BGA packaging and fixing structure for LED modules. Background technique [0002] At present, there are several packaging methods for LEDs: bracket row packaging, patch packaging, and module packaging. These packaging methods are common and commonly used by us. [0003] Bracket row packaging was the first to be used to produce a single LED device. This is our common lead-type light-emitting diode (including piranha packaging), which is suitable for instrument indicator lights, urban lighting projects, advertising screens, guardrail tubes, traffic Indicator lights, and some products and fields that are currently widely used in our country. [0004] SMD package (SMD) is a leadless package, small and thin, very suitable for keyboard display lighting of mobile phones, backlighting of TV sets, and electronic products that require lighting or indication. In recent years, S...

AI Technical Summary

Problems solved by technology

The advantage of this common method is to save materials, but the disadvantage is that it is not conducive to heat dissipation, and the phosphor will also age.

Because epoxy resin and phosphor are not materials with good thermal conductivity, and wrapping the entire chip will affect heat dissipation

This method is obviously not the best solution for manufacturing LED lighting fixtures

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