189results about How to "Reduce parasitic parameters" patented technology

The invention discloses a 3D (three-dimensional) NAND memory and a manufacturing method of the 3D NAND memory. The 3D NAND memory comprises multiple layers of storage arrays and multiple layers of control grid circuits, wherein each layer of the control grid circuit is electrically connected to the same layer of the storage array, so that selection of each layer of the storage array is realized; each layer of the control grid circuit is obtained by cascading a same number of transistors; grids of all the transistors of the control grid circuits are electrically connected to control wires; the number of the control wires is as the same as that of the transistors comprised in each layer of the control grid circuit; the grids of different transistors positioned on the same layer of the control grid circuit are electrically connected to different control wires. According to the 3D NAND memory, a small number of input control wires SSL select a large number of control grid layers through the control grid circuits, so that the area and the volume of the whole memory cannot be enlarged due to the increase of the number of the required layers of control grids when the storage capacity of the memory is improved due to the increase of the number of storage unit layers.

The invention relates to an MEMS sensor encapsulation structure and an encapsulation method thereof, which are used for encapsulating an MEMS sensor. The MEMS sensor encapsulation structure is characterized by comprising a ceramic base, a side wall and a top cap, wherein a plurality of metal bonding pads are respectively arranged on a top layer and a bottom layer of the ceramic base; the metal bonding pads on the top layer of the ceramic base are connected with leads of the MEMS sensor; the MEMS sensor is arranged on the ceramic base; the metal bonding pads on the bottom layer of the ceramic base are connected with an external circuit; the ceramic base adopts one-layer or multi-layer perpendicularly interconnected structure; the side wall and the top cap are both made of kovar alloy. According to the invention, the ceramic base of which coefficient of thermal expansion is approximate to that of the MEMS sensor material is selected as the encapsulation material, in order to reduce influence of the base expansion stress to the MEMS sensor; meanwhile, the ceramic base can be utilized to realize one-layer perpendicular interconnection or multi-layer perpendicular interconnection; the system-level integration between the MEMS sensor and the peripheral circuit can be realized within a small area; high-density system-level encapsulation can be realized; the encapsulation flexibility and the expansibility of the MEMS sensor can be realized.

The invention discloses a microwave film resistor and a manufacturing method thereof, and belongs to the field of circuit elements. The microwave film resistor comprises a ceramic substrate, a film resistance layer which is adhered to the upper surface of the ceramic substrate and an electrode layer which is adhered to the film resistance layer. The film resistor has the advantages of high precision, high using frequency and high resistance stability. In addition, the invention also discloses a microwave film resistor network module and a manufacturing method thereof, wherein the microwave film resistor network module is formed by integrating three or more microwave film resistors on one module.

The invention relates to direct current (DC) step-up power conversion technology and discloses a current-type multi-resonance DC converter. The current-type multi-resonance DC converter comprises a square-wave current source generator, a multi-resonance network and a rectification filtering output unit which are sequentially connected in series, and is characterized in that: the multi-resonance network comprises a transformer, a parallel resonant inductor, a parallel resonant capacitor and a serial resonant inductor, wherein the serial resonant inductor is connected with a primary side of the transformer; the rectification filtering output unit comprises a diode rectifying circuit and a filtering capacitor which is connected with an output end of the diode rectifying circuit in parallel.

The embodiment of the invention provides a field-effect transistor and a manufacturing method thereof and relates to the technical field of semiconductors. Parasitic parameters of the field-effect transistor can be reduced to improve the reliability of the field-effect transistor. The method comprises the steps as follows: a support structure with superlattice characteristics is formed on a semiconductor substrate; the support structure comprises first semiconductor material layers and second semiconductor material layers, which are alternately arranged; isolating layers are arranged at two sides of the support structure; a false gate structure covering the support structure is formed along the juncture of the isolating layers and the support structure; the length of the false gate structure in a gate length direction is smaller than those of the first semiconductor material layers in the gate length direction; areas except for sacrificial layers in the first semiconductor material layers are removed along the gate length direction to form insulating grooves; the dielectric constants of mediums filled into the insulating grooves are smaller than those of the first semiconductor material layers; and a source and a drain are formed in preset source region and drain region along the gate length direction and the source and the drain are isolated from the sacrificial layers through the insulating grooves.

The invention provides a 3D integrated framework of an ultrahigh frequency power converter. The 3D integrated framework comprises a PCB circuit layer and a winding unit erected on the PCB circuit layer. The winding unit is connected with the PCB circuit layer through a wire. The winding unit comprises winding layers formed on a first insulating layer and a first soft magnetic thin film layer formed on a second insulating layer. The first soft magnetic thin film layer is arranged below the winding layers in a laminated mode to be used for achieving magnetic shielding between the winding layers and the PCB circuit layer. Compared with the prior art, by the adoption of 3D integration, the size of the converter is reduced, and the power density is increased; soft magnetic materials are adopted to form the magnetic shielding layer, magnetic field interference between windings and the PCB circuit layer and between the windings and external metal is solved, the Q value of the windings is increased, the alternating current resistance and high-frequency loss of an inductor and a transformer are reduced, and the working efficiency of the converter is improved; a plane magnetic element is further adopted, and the miniaturization and flattening of products are guaranteed; temperature rising of the magnetic element is reduced greatly, and the working environment of a semiconductor device is improved.

The invention relates to a novel lamination structure of a multilayer high-speed PCB. The novel lamination structure comprises multiple layers of ground planes, power supply planes arranged between every two adjacent ground planes, and two layers of signal planes arranged on the top layer and the bottom layer of a PCB, which are up-down successively arranged. Spaces between the power supply planes and adjacent two layers of ground planes are filled with medium. Each of the signal planes arranged on the top layer and the bottom layer of the PCB comprises a weld disc and a microstrip line. A signal via hole is arranged in each of the weld discs. The microstrip lines are connected together via the signal via holes. N grounding short circuit holes are uniformly arranged around each of the signal via hole. According to the invention, the grounding short circuit holes can provide ideal low-impedance returning paths for the signal via holes, and parasitic parameters of current paths among the planes are reduced.

The invention discloses a germanium-silicon photoelectric detector with high bandwidth and high responsivity, and relates to the technical field of photoelectric detection. The germanium-silicon photoelectric detector comprises a silicon waveguide, a silicon substrate, a lightly doped silicon region, a heavily doped silicon region, a germanium absorption region, an epitaxial silicon region, an epitaxial silicon doped region, a first electrode and a second electrode. The silicon waveguide is used for transmitting incident light; the silicon substrate is used for receiving the incident light propagated by the silicon waveguide; the lightly doped silicon region is arranged in the silicon substrate; the heavily doped silicon region is arranged in the lightly doped silicon region; the germaniumabsorption region is arranged on the lightly doped silicon region, the germanium absorption region comprises a first part far away from the silicon waveguide, and the projection surface of the firstpart on the lightly doped silicon region is arc-shaped; the epitaxial silicon region surrounds and covers the germanium absorption region; the epitaxial silicon doped region covers the top of the germanium absorption region; the first electrode is arranged on the heavily doped silicon region, and the shape of the first electrode is matched with that of the heavily doped silicon region; the secondelectrode is arranged on the epitaxial silicon doped region. The germanium-silicon photoelectric detector has high responsivity and relatively high bandwidth.

The invention discloses a self-alignment integrated package method of a high-density three-dimensional lamination layer, and aims to provides an integrated package method which employs a BGA welding ball as an interlayer mechanical support for multi-layer substrate self-alignment three-dimensional stack and also can be a signal interconnection passage among high-density layers. The self-alignmentintegrated package method is implemented according to the technical scheme that bonding pads are arranged on a lower surface of a top-layer substrate, an upper surface and a lower surface of an intermediate-layer substrate and an upper surface of a bottom-layer substrate and are used for welding micro BGA welding balls, the micro BGA welding balls are attached onto the upper surface of the intermediate-layer substrate and the upper surface of the bottom-layer substrate, the micro BGA welding balls on the upper surface of the intermediate-layer substrate are corresponding to the lower surface of the top-layer substrate, the micro BGA welding balls on the upper surface of the bottom-layer substrate are corresponding to the lower surface of the intermediate-layer substrate, vertical and interconnection rectangular array micro BGA ball welding is formed, a hollow square boss cavity box body is arranged at the peripheries outside an upper cavity surface of the intermediate-layer substrate 2and an upper cavity surface of the bottom-layer substrate 3, the cavity box body is stacked and placed in a backflow welding furnace by a tool, and self-alignment lamination layer welding is performed to form a package body.

A method for manufacturing an encapsulated antenna is provided. The encapsulated antenna includes an antenna structure including an antenna radiation patch, an antenna substrate dielectric layer and areflective ground plane arranged in sequence. The antenna substrate dielectric layer has a first surface and a second surface opposite to each other. The antenna radiation patch is fixed on the firstsurface and the reflective ground plane is fixed on the second surface. Chip; A package having opposite first and second faces, the front face and reflective ground plane of the chip being exposed toand flush with the second face; A rewiring layer comprising an RDL dielectric layer and an RDL metal layer, the RDL metal layer comprising a feeder, a plurality of fan-out leads and a plurality of pads, at least a portion of the pads being connected to the chip through vias in the RDL dielectric layer; And a solder ball implanted on the pad. The encapsulated antenna can reduce its own parasitic parameters while improving antenna radiation patch performance.

The invention relates to a packaged antenna and a manufacturing method thereof. The packaged antenna comprises a circuit chip; A substrate provided with a substrate groove, the circuit chip is fixed in the substrate groove, the front surface of the circuit chip is exposed to the first surface and is flush with the first surface, the substrate is provided with a substrate metal layer, and the substrate metal layer is formed with an antenna; Rewiring layer, laminated on the first surface of the substrate and the front surface of the circuit chip, the rewiring layer includes at least one RDL metal layer, The metal layer is formed with a reflective ground plane, a feeder line, a plurality of fan-out leads and a plurality of pads, the feeder line being connected to the circuit chip to feed theantenna, the plurality of fan-out leads connecting corresponding vias to the circuit chip for connecting the circuit chip and the printed circuit board, the plurality of pads being located on a layerof RDL metal layer furthest from the second surface; And solder balls. With the above technical solution, the encapsulated antenna provided by the present disclosure can reduce its own parasitic parameters while improving antenna performance.

The invention discloses an SRM-based driving reconstruction type circuit and a vehicle-mounted integrated charging and feeding system. According to the circuit, three solid-state relays and a plurality of single-phase voltage type bridge inverters obtained through a DC bus reconstruction mode form an integrated power converter, and the integrated power converter is connected to a power battery and a vehicle-mounted solar photovoltaic panel; the vehicle-mounted integrated charging and feeding system adopting the driving reconstruction type circuit can be suitable for a multi-phase switched reluctance motor, and is combined with a proper control strategy; therefore, various operation modes such as a power battery driving mode, a vehicle-mounted solar photovoltaic panel driving mode, a hybrid driving mode, a regenerative braking mode, a single-phase and three-phase static charging and feeding mode and the like can be realized. The circuit is compact in structure, small in parasitic parameter, low in power consumption and high in power density, switching among different operation modes can be achieved by simply controlling the conducting state of the solid-state relay, and therefore, bidirectional flow of energy among a power battery, a power grid and a motor is achieved.

The invention discloses an LTCC (Low Temperature Co-Fired Ceramic) miniaturization microwave passive device. The LTCC miniaturization microwave passive device comprises dielectric layers and metal layers which are arranged between the dielectric layers; the dielectric layers comprise a first micro-strip dielectric layer, a second micro-strip dielectric layer, a third micro-strip dielectric layer, a first strip line dielectric layer, a second strip line dielectric layer, a third strip line dielectric layer, a fourth strip line dielectric layer, a fifth strip line dielectric layer and a sixth strip line dielectric layer which are arranged from top to bottom in turn; the metal layers comprise a micro-strip line, a first grounding plane, a strip line and a second grounding plane; the micro-strip line is arranged on the first micro-strip dielectric layer; the first grounding plane is arranged between the third micro-strip dielectric layer and the first strip line dielectric layer; the strip line is arranged between the third strip line dielectric layer and the fourth strip line dielectric layer; the second grounding plane is arranged below the sixth strip line dielectric layer. According to the LTCC miniaturization microwave passive device, the multilayer wiring scheme is adopted and accordingly the circuit size and weight is reduced under the same working frequency, the problem of transmission line overlapping is effectively solved, parasitic parameters are reduced, the structure is simple, and the performance is good.

The invention relates to an optical receiving assembly for hundred trillion-grade 850nm optical communication and a preparation method thereof, and provides an optical receiving assembly for hundred trillion-grade 850nm optical communication, which is compatible with a commercial CMOS process and can replace the hybrid integration in the traditional 850nm optical transceiver and meet the transmission requirement, and a preparation method thereof. The optical receiving assembly is provided with a 850nm optoelectronic single integrated receiving chip, a pipe seat, a pipe cap, a pipe pin and an adapter, wherein the chip is provided with a prepositive amplifying circuit and an optoelectronic detector, and the prepositive amplifying circuit is provided with two mutual resistance type amplifying circuits, a three-grade differential amplifier, an output buffer circuit and a direct current negative feedback circuit. The optoelectronic detector is provided with a low doped P-shaped silicon substrate, a P pit, an N-shaped heavy doping silicon layer, a field oxide layer, an aluminum layer, three SiO2 insulating medium layers and a Si3N4 surface passivating layer from bottom to top in the longitudinal direction. The chip is attached to the pipe seat by a CMOS process; a welding disk of the chip is bonded with the pipe pin by a gold thread; and the pipe cap is covered to be encapsulated with the adapter according to the same shaft.

The invention relates to packaging antenna and a manufacturing method thereof. The packaging antenna comprises a chip, a substrate, a first rewiring layer and a second rewiring layer, wherein the chipis fixed in the substrate; one surface of the substrate presses the first rewiring layer, the other surface of the substrate presses the second rewiring layer, wherein the first rewiring layer manufactures an antenna pattern, the second rewiring layer manufactures a reflecting ground plane and a feeder pattern, ore the reflecting ground plane is formed by a substrate metal layer. By the packagingantenna, the parasitic parameter of the packaging antenna is reduced, and meanwhile, the performance of the antenna is improved.

The invention discloses a multi-chip sharing power supply or ground structure used in a printed circuit board, which belongs to the technical field of circuit board noise suppression. The power supply or ground structure is a typical capacitor structure of which certain three layers are in metal-medium-metal structure and constructed in the multi-layer printed circuit board, wherein the used medium is a high dielectric constant medium; large area of power supply or ground metal plane is divided into areas with the same number according to the required power supplied chip number respectively, and each area is positioned under the chip supplied with power. Through embedding technology, namely the whole power supply/ground structure is a part of the circuit board, the structure has short wiring and small parasitic parameter, can work at high frequency, and greatly widens the high frequency property of a wave filter.

The invention relates to a structure of a high-thermal-reliability multi-unit power integration module (PIM) and a processing technology thereof. The structure comprises a silicon-based IGBT chip, a silicon carbide Schottky barrier diode chip, a silicon-based diode chip, a copper/graphene nanosheet (Cu/GN) heterogeneous thin film, graphene-based packaging resin, a copper-clad ceramic lining plate, a solder layer, a nano-silver conductive adhesive, a bonding wire, a copper gasket, a plastic packaging shell, an aluminum silicon carbide substrate, heat-conducting silicone grease and a radiator. The Cu/GN heterogeneous thin film is adopted to replace a local bonding wire, local heat of a chopper circuit IGBT chip in a high-power PIM is dissipated through an upper heat conduction path and a lower heat conduction path, and the local hot spot temperature on the chip is reduced; and meanwhile, the graphene is uniformly added into the epoxy resin to serve as a potting material so that the overall thermal resistance of the high-power PIM from a chip to the environment is reduced, and the heat dissipation efficiency is improved.

The invention discloses a packaging piece based on a substrate and adopting a slotting technology and a manufacturing process of the packaging piece. The packaging piece is mainly composed of a lead frame, a PAD, a solder ball, conducting adhesive, a chip, a bonding wire and a plastic package body. The PAD and the solder ball are arranged on the lead frame, and a notch is formed in the lead frame. The chip is connected into the notch of the lead frame through the conducting adhesive, and welding spots on the chip are connected with the PAD on the lead frame through the bonding wire. The chip, the bonding wire, the solder ball and the lead frame form a power and signal channel of a circuit. The plastic package body wraps the lead frame, the PAD, the solder ball, the chip and the bonding wire. The procedures of the manufacturing process are wafer thinning, scribing, substrate slotting and ball replacing, chip installing, installed chip baking, bonding, plasma cleaning, post curing, plastic packaging and product finishing. According to the packaging piece based on the substrate and adopting the slotting technology and the manufacturing process of the packaging piece, electric heating performance of the chip is improved, and the performance of the whole packaging piece is improved greatly.

The invention discloses a method for manufacturing a multi-slot PN junction capacitor with multi-electrode ultra-low inductance. Through a series of theoretical argumentation and assumption, the original semiconductor PN junction capacitor is improved, so that the improved capacitor has the characteristics of simple structure, large capacitance density, small parasitic parameter, simple manufacturing process and the like, and particularly can realize great reduction of series inductance to ensure that the capacitor works in a higher frequency range. The capacitor can be widely applied to decoupling, filtering, matching, preventing static and surge and the like in the high-frequency high-speed power electronic system.

The invention provides a circuit simulation method and device, electronic equipment and a computer readable storage medium, and the method comprises the steps: obtaining estimated power supply voltagedata determined according to a target simulation circuit comprising a power supply simulation circuit and a function simulation circuit; and performing simulation according to the estimated power supply voltage data and the function simulation circuit to obtain a parasitic parameter netlist of the target simulation circuit. Through the method in the embodiment of the invention, the circuit simulation efficiency can be improved.