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Encapsulated micro-wave voltage-controlled oscillator test device

A voltage-controlled oscillator and testing device technology, which is applied in the direction of the measuring device casing, etc., to achieve the effects of reducing the connection contact distance, solving mechanical damage, and improving test reliability

Inactive Publication Date: 2015-11-11
GUIZHOU AEROSPACE INST OF MEASURING & TESTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: for the mechanical damage, poor contact, easy short circuit, easy misoperation and easy to cause large test To solve problems such as data errors, a packaged microwave voltage-controlled oscillator test device is provided, which can achieve no damage, good contact, no short circuit, reliable operation and accurate test data, so as to overcome the problems existing in the prior art

Method used

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Embodiment Construction

[0021] The invention will be further introduced below in conjunction with the accompanying drawings and specific embodiments.

[0022] Such as Figure 1~Figure 4 As shown, a packaged microwave voltage-controlled oscillator test device includes a test fixture 14 for installing and fixing a voltage-controlled oscillator 3, a conductive rubber 10 and a test adapter circuit board 6, and the test adapter circuit board 6 is installed on a metal On the base plate 7, it is connected to the monitoring equipment through a cable, the conductive rubber 10 is bonded to the middle part of the upper end face of the test adapter circuit board 6, the test fixture 14 is placed on the test adapter circuit board 6, and fixedly connected to the metal base plate 7, the present invention puts the encapsulated microwave voltage-controlled oscillator in the test fixture, places the voltage-controlled oscillator on the conductive rubber, and connects its pins to the test adaptation circuit board throug...

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PUM

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Abstract

The invention discloses an encapsulated micro-wave voltage-controlled oscillator test device. The device comprises a test clamp used for installing and fixing a voltage-controlled oscillator, a conductive rubber and a test adaption circuit board. The test adaption circuit board is installed on a metal base plate and is connected to monitoring equipment through a cable. The conductive rubber is pasted on a central section of an upper end surface of the test adaption circuit board. The test clamp is placed on the test adaption circuit board and is fixedly connected to the metal base plate. In the invention, an encapsulated micro-wave voltage-controlled oscillator is placed in the test clamp; and a pin of the oscillator is connected to the test adaption circuit board through the conductive rubber so that contact between a chip pin and the test adaption circuit board can be avoided, a parasitic parameter is reduced and normal transmission of microwave signals is guaranteed. Besides, because of elasticity of the conductive rubber, damages generated through carrying out hard pressing on the chip can be avoided; test reliability and test efficiency of the encapsulated micro-wave voltage-controlled oscillator are increased; and the device possesses characteristics that the structure is simple and assembling and disassembling are convenient.

Description

technical field [0001] The invention belongs to the technical field of testing devices for electronic components, and relates to a testing device for a packaged microwave voltage-controlled oscillator. Background technique [0002] The packaged microwave voltage-controlled oscillator is a multi-pin device. The output signal frequency is in the microwave range (above 8GHz). Its pins are signal output, working power supply, tuning power supply and two grounding pins. There is a A large ground plane to ensure the normal operation of the device. At present, most of the packaged microwave voltage-controlled oscillator tests use fixtures to directly press the device on the corresponding position of the test circuit board, and then use monitoring equipment to test. This test method is very difficult due to the hard contact between the device pins and the circuit board. It is easy to cause damage to the plating layer of the device pins and affect the solderability of the device. At...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
Inventor 袁文杜勇袁帅
Owner GUIZHOU AEROSPACE INST OF MEASURING & TESTING TECH
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