MEMS (Micro-Electromechanical System) sensor encapsulation structure and encapsulation method thereof

Abstract

The invention relates to an MEMS sensor encapsulation structure and an encapsulation method thereof, which are used for encapsulating an MEMS sensor. The MEMS sensor encapsulation structure is characterized by comprising a ceramic base, a side wall and a top cap, wherein a plurality of metal bonding pads are respectively arranged on a top layer and a bottom layer of the ceramic base; the metal bonding pads on the top layer of the ceramic base are connected with leads of the MEMS sensor; the MEMS sensor is arranged on the ceramic base; the metal bonding pads on the bottom layer of the ceramic base are connected with an external circuit; the ceramic base adopts one-layer or multi-layer perpendicularly interconnected structure; the side wall and the top cap are both made of kovar alloy. According to the invention, the ceramic base of which coefficient of thermal expansion is approximate to that of the MEMS sensor material is selected as the encapsulation material, in order to reduce influence of the base expansion stress to the MEMS sensor; meanwhile, the ceramic base can be utilized to realize one-layer perpendicular interconnection or multi-layer perpendicular interconnection; the system-level integration between the MEMS sensor and the peripheral circuit can be realized within a small area; high-density system-level encapsulation can be realized; the encapsulation flexibility and the expansibility of the MEMS sensor can be realized.

Description

technical field [0001] The invention relates to the field of component packaging structure and packaging method thereof, in particular to a MEMS (micro-electromechanical system) sensor packaging structure and packaging method; the invention also relates to a MEMS accelerometer utilizing the packaging structure and method. Background technique [0002] Multi-chip module refers to the integration of multiple bare or / and packaged integrated circuit chips and single or multiple passive components, such as resistors, capacitors, inductors, etc., into a package base to form a system or functional module a technique. At present, electronic component chips are developing in a more and more complex direction, and traditional IC integrated device packaging and metal tube packaging will bring difficulties. For example, for MEMS sensors (such as MEMS accelerometers and MEMS gyroscopes), in order to improve their performance, it is often necessary to increase the thickness of the movabl...

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Problems solved by technology

[0004] The purpose of the present invention is to address the deficiencies of the prior art, to provide a base that can be easily expanded into a multi-level structure according to needs, and the wires can be arranged in layers in the base, which can solve the problem of difficult wiring; provide A packaging structure with low packaging stress and good airtightness is provided, and the packaging method of the packaging structure is provided at the same time, which effectively improves production efficiency and reduces costs, and is suitable for harsh environments such as high temperature and high humidity.

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