Packaging piece based on substrate and adopting slotting technology and manufacturing process of packaging piece

A package and substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as poor heat dissipation of EPBGA

Inactive Publication Date: 2013-09-25
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] EPBGA still has the problem of poor heat dissipation

Method used

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  • Packaging piece based on substrate and adopting slotting technology and manufacturing process of packaging piece
  • Packaging piece based on substrate and adopting slotting technology and manufacturing process of packaging piece
  • Packaging piece based on substrate and adopting slotting technology and manufacturing process of packaging piece

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Experimental program
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Effect test

Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings.

[0018] Such as Image 6 As shown, a substrate-based package using slotting technology is mainly composed of lead frame 1 , PAD 2 , solder ball 3 , conductive glue 4 , chip 5 , bonding wire 6 and plastic package 7 . There are PAD2 and solder ball 3 on the lead frame 1, and there is a notch, the lead frame 1 is connected with a chip 5 in the notch through the conductive glue 4, and the solder joint on the chip 5 is bonded to the PAD2 on the lead frame 1 The wire 6 is connected, the chip 5, the bonding wire 6, the solder ball 3, and the lead frame 1 constitute the power supply and signal channel of the circuit, and the plastic package 7 surrounds the lead frame 1, PAD2, solder ball 3, chip 5 and bonding wire 6 , the plastic package 7 supports and protects the chip 5 , the bonding wire 6 and the solder ball 3 .

[0019] The bonding wire 6 includes gold wire, copper wire ...

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PUM

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Abstract

The invention discloses a packaging piece based on a substrate and adopting a slotting technology and a manufacturing process of the packaging piece. The packaging piece is mainly composed of a lead frame, a PAD, a solder ball, conducting adhesive, a chip, a bonding wire and a plastic package body. The PAD and the solder ball are arranged on the lead frame, and a notch is formed in the lead frame. The chip is connected into the notch of the lead frame through the conducting adhesive, and welding spots on the chip are connected with the PAD on the lead frame through the bonding wire. The chip, the bonding wire, the solder ball and the lead frame form a power and signal channel of a circuit. The plastic package body wraps the lead frame, the PAD, the solder ball, the chip and the bonding wire. The procedures of the manufacturing process are wafer thinning, scribing, substrate slotting and ball replacing, chip installing, installed chip baking, bonding, plasma cleaning, post curing, plastic packaging and product finishing. According to the packaging piece based on the substrate and adopting the slotting technology and the manufacturing process of the packaging piece, electric heating performance of the chip is improved, and the performance of the whole packaging piece is improved greatly.

Description

[0001] technical field [0002] The invention belongs to the technical field of integrated circuit packaging, in particular to a package based on a substrate using slotting technology and a manufacturing process thereof. Background technique [0003] The full name of EPBGA is Enhanced Plastic Ball Grid Array (Enhanced Heat Dissipation Ball Grid Array Package), which is a reverse packaging method in which integrated circuits use organic substrates + all-metal heat sinks. It has the following characteristics: ①The package area is much smaller than the ceramic package; ②The area of ​​the heat sink is large, and the heat dissipation performance is very good, which is suitable for VLSI; ③The PCB board can be self-centered when soldering, and it is easy to tin; ④Light weight, reliability High; ⑤ good electrical performance, low overall cost. [0004] The I / O terminals of the BGA package are distributed under the package in the form of circular or columnar solder joints in an arra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48H01L21/50
CPCH01L2224/45144H01L2224/45147H01L2224/48091
Inventor 贾文平谢建友王昕捷张园贾飞崔梦
Owner HUATIAN TECH XIAN
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