LTCC (Low Temperature Co-Fired Ceramic) miniaturization microwave passive device

Abstract

The invention discloses an LTCC (Low Temperature Co-Fired Ceramic) miniaturization microwave passive device. The LTCC miniaturization microwave passive device comprises dielectric layers and metal layers which are arranged between the dielectric layers; the dielectric layers comprise a first micro-strip dielectric layer, a second micro-strip dielectric layer, a third micro-strip dielectric layer, a first strip line dielectric layer, a second strip line dielectric layer, a third strip line dielectric layer, a fourth strip line dielectric layer, a fifth strip line dielectric layer and a sixth strip line dielectric layer which are arranged from top to bottom in turn; the metal layers comprise a micro-strip line, a first grounding plane, a strip line and a second grounding plane; the micro-strip line is arranged on the first micro-strip dielectric layer; the first grounding plane is arranged between the third micro-strip dielectric layer and the first strip line dielectric layer; the strip line is arranged between the third strip line dielectric layer and the fourth strip line dielectric layer; the second grounding plane is arranged below the sixth strip line dielectric layer. According to the LTCC miniaturization microwave passive device, the multilayer wiring scheme is adopted and accordingly the circuit size and weight is reduced under the same working frequency, the problem of transmission line overlapping is effectively solved, parasitic parameters are reduced, the structure is simple, and the performance is good.

Description

technical field [0001] The invention belongs to the technical field of microwave control circuits, in particular to a miniaturized microwave passive device based on low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC). Background technique [0002] Low Temperature Co-fired Ceramic (LTCC) technology is an eye-catching integrated component technology developed in 1982. It has become the mainstream technology of passive integration and the development direction and new trend in the field of passive components. The economic growth point of the component industry. This technology can successfully manufacture various high-tech LTCC products. There are many ways to integrate multiple passive components of different types and performances into one package, mainly including low-temperature co-fired ceramic (LTCC) technology, thin-film technology, silicon wafer semiconductor technology, and multi-layer circuit board technology. LTCC technology is the mainstream...

AI Technical Summary

Problems solved by technology

The method of loading the original lumped parameter will introduce more parasitic parameters, and it is limited to the self-resonant frequency of the component, especially when the frequency is high, it will have a greater impact on the circuit performance; the structure of the composite left-handed transmission line is more complicated, requiring high processing accuracy. Relatively difficult to implement; defect ground structures are constructed by engraving a pattern of candle defects on the ground plane, which can disrupt the distribution of conduction current on the ground plane, adversely affecting passive device performance

Loading open-circuit stubs at both ends or in the middle of the transmission line can change the equivalent transmission constant of the transmission line, thereby shortening the length of the transmission line. The circuit structure is simple, the cost is low, and the performance is good, but the problem of overlapping transmission lines in the planar structure is difficult solution, making its application and performance very limited

Images