Multi-chip common power supply/grounding structure for printed circuit board

A printed circuit board and grounding structure technology, which is applied in the directions of printed circuit components, multi-layer circuit manufacturing, and electrical connection printed components, can solve problems such as long decoupling efficiency distance, complex design, and isolation performance impact, and achieve parasitic parameters The effect of small size, short connection, and extended high-frequency performance
CN101437368AInactive Publication Date: 2009-05-20INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Publication Date
2009-05-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a multi-chip sharing power supply or ground structure used in a printed circuit board, which belongs to the technical field of circuit board noise suppression. The power supply or ground structure is a typical capacitor structure of which certain three layers are in metal-medium-metal structure and constructed in the multi-layer printed circuit board, wherein the used medium is a high dielectric constant medium; large area of power supply or ground metal plane is divided into areas with the same number according to the required power supplied chip number respectively, and each area is positioned under the chip supplied with power. Through embedding technology, namely the whole power supply / ground structure is a part of the circuit board, the structure has short wiring and small parasitic parameter, can work at high frequency, and greatly widens the high frequency property of a wave filter.
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Description

technical field

[0001] The invention relates to the technical field of circuit board noise suppression, in particular to a shared power supply / grounding structure for multiple chips in a printed circuit board. Background technique

[0002] With the development of people's requirements for electronic products in the direction of miniaturization, multi-function and environmental protection, people strive to make electronic systems smaller, more integrated, and more powerful. Based on people's ideas like this, many new technologies, new materials and new designs have been born, such as system-in-chip and system-in-package technologies. In these technologies, it is often necessary to place multiple chips in a small area, and it is required to share a power supply network and a ground network. The working status of each chip is different, such as digital circuits, analog circuits or highly sensitive RF front-ends, which makes the common power network or common ground network pro...

Claims

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