423 results about "Electrical structure" patented technology

A power semiconductor device package according to one aspect of the present invention comprises: a plurality of power semiconductor chips which are arranged in a laminated structure so that the plurality of power semiconductor chips are opposing to each other at the surfaces with the same electrical structures, and which are connected in parallel to one another, and are sealed in a sealing resin as one body.

Articles, systems, and methods related to the configuration of electrically non-conductive materials and related components in electrochemical cells are generally described. Some inventive electrochemical cell configurations include an electrically non-conductive material (e.g., as part of the electrolyte) that is configured to wrap around the edge of an electrode to prevent short circuiting of the electrochemical cell. In some embodiments, the electrically non-conductive material layer can be arranged such that it includes first and second portions (one on either side of an electrode) as well as a third portion adjacent the edge of the electrode that directly connects (and, in some cases, is substantially continuous with) the first and second portions. The electrically non-conductive material layer can be relatively thin while maintaining relatively high electrical insulation between the anode and the cathode, allowing one to produce an electrochemical cell with a relatively low mass and/or volume. The arrangements described above can be formed, for example, by forming a multi-layer structure comprising an electrode and an electrically non-conductive material layer (e.g., as a coating), and folding the multi-layer structure such that the electrically non-conductive material covers the convex surface portion of the resulting crease.

Electronic modules and methods of fabrication are provided implementing a first metallization level directly on a chips-first chip layer. The chips-first layer includes chips, each with a pad mask over an upper surface and openings to expose chip contact pads. Structural dielectric material surrounds and physically contacts the side surfaces of the chips, and has an upper surface which is parallel to an upper surface of the chips. A metallization layer is disposed over the front surface of the chips-first layer, residing at least partially on the pad masks of the chips, and extending over one or more edges of the chips. Together, the pad masks of the chips, and the structural dielectric material electrically isolate the metallization layer from the edges of the chips, and from one or more electrical structures of the chips in the chips-first layer.

An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED comprises an LED die, a base supporting the LED die thereon and thermally contacting the substrate to take heat generated by the LED die to the substrate, a pair of leads electrically connecting the LED die to input a current to the LED die, and an encapsulant enveloping the LED die. The pair of leads hover above the substrate to separate an electrical route of the LED assembly from a heat conducting pathway thereof. Furthermore, each LED has a plurality of legs extending raidally from the base thereof to fit in the base of an adjacent LED, to thereby engagingly lock with the adjacent LED.

An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.

The invention relates to a novel frequency domain ground-to-air electromagnetic prospecting method which adopts a work mode of land launching and air receiving of electromagnetic waves to extract signal frequency spectrums and gives the underground electrical structure an inverse interpretation through a whole-region apparent resistivity method. A launching system which works on the ground launches multi-frequency pseudo-random waves towards the underground through multiple cascades and the signal with multiple frequencies can be obtained with one triggering, thereby greatly improving the detection efficiency. A receiving system is loaded on an aircraft, so when measuring the magnetic fields in the testing zone, it can adapt to the environment of complex surface structures, reduce the static effect caused by the near field effect and expands the detection range of electromagnetic prospecting. The receiving system can correct and compensate tested magnetic-field components when measuring multiple magnetic-field components, so the resolution capability of magnetic field measurement is improved. The frequency domain ground-to-air electromagnetic prospecting method is applicable to depth detection of severe surface zones and has the advantages of being wide in detection range, large in detection depth, high in detection efficiency, etc.

High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.

The invention relates to an electrical source transient electromagnet ground-air detection method. The electrical source transient electromagnet ground-air detection method comprises the steps that a long grounding wire is adopted as an emitting source, and a helicopter or an unmanned aerial vehicle carries a receiving coil for data collection; observation data are processed according to a full-domain apparent resistivity method, qualitative interpretation on deep geological targets is finished, and profile information such as the attitude, extending direction and scale of the geological targets is obtained; ground-air data are interpreted and processed according to a transient electromagnetic wave field transform method, a three-dimensional migration imaging technology and an inverse synthetic aperture method, fine detection of the deep targets is finished, and detailed information such as the depth, shape and electrical structures of the deep geological structure is obtained. The electrical source transient electromagnet ground-air detection method can achieve electromagnetic detection rapidly on a large scale, the deep geological targets can be detected in a detailed mode, and the accurate and detailed geological information of the deep geological targets can be obtained.

A circuit structure of light-emitting diode (LED) lamp includes a combination of at least one LED lamp assembly, a current-limit resistor, a bridge rectifier, a capacitor set, a circuit board, and an electrical connector, by which each LED of at least one LED lamp assembly is at one end in series with a serially-connected resistor individually and then each serial-connected by-pass resistor is in parallel with the former-mentioned electrical structure to form a LED lamp assembly. The present invention provides a better solution which conventional LED lamp cannot be configured with a high voltage power supply. Further, the hardware lay-out of the circuit structure allows for direct connection with an external power source of AC 100-380V, which is fed through the bridge rectifier for regulation and conversion into direct current to be directly coupled to and used by the LED lamp assembly without a voltage-down transformer.

A process for improving design-limited yield by collecting test fail data, converting to electrical faults, and localizing to physical area on semiconductor die. The steps of identifying an area on a wafer containing a fault to enable the analysis of specific defects, accumulating data suitable for yield monitoring analysis based on pattern test failures logged on scan cells in scan chains on automatic test equipment, and translating scan cell and scan chain failure reports to geometric locations of electrical structures on wafers.

A die collet for a semiconductor chip having an exposed electrical structure, the die collet including a body having a vacuum line connected thereto, the die collet including a plurality of parts each having a vacuum hole communicating with the vacuum line. Apparatus for bonding a semiconductor chip to a lead frame, the apparatus including a first die collet for picking up the semiconductor chip, on aligning stage for receiving the semiconductor chip from the first pickup tool and aligning the semiconductor chip. A second die collet picks up the semiconductor chip from the aligning stage and places the semiconductor chip on a lead frame. The first and second die collets are constructed as described above.

The invention relates to a power unit phase module based on IEGT, comprising two IEGT devices; each IEGT device is connected with a freewheel diode in parallel, the two IEGT devices are connected in series, and the middle connecting end is lead out to be output terminal; and the phase module is provided with a buffer absorption circuit. The phase module is in the electric structure that the external is a closed box, an insulating separator divides the interior of the closed box into upper and lower spaces, and the IEGT unit and the diode unit are respectively arranged in the upper and lower spaces of the insulating separator to form a double-layer structure. The invention has the beneficial effects that: (1) power density is high; (2) serviceability is high; (3) installation and maintenance are convenient; (4) modular design can be convenient for free combination, thus being widely applied to multiple power electronic devices.

The invention discloses a method for realizing safe filling control of a vehicle gas cylinder by radio frequency identification and computer technology, which comprises an electronic tag, a tag recognition device, a filling controller and relevant software; wherein, the electronic tag is stuck on the cylinder body; the tag recognition device communicates the read tag information with the filling controller arranged in a gas dispenser control chamber via a wireless network; the filling controller is communicated with a gas dispenser monitoring background via a COM port connecting wire in accordance with that the tag information is converted into corresponding instructions; the gas dispenser background controls whether a gas gun is unlocked according to the instructions so as to dispense the vehicles to realize automatic filling of the gas cylinder and completely avoid the interference of human factors on dispensing; after filling is finished, the filling controller extracts dispensing records from the gas dispenser monitoring background and stores the records. Without changing the electrical structure of the gas dispenser, the method realizes automatic identity recognition and acquisition of filling information during filling, connects the filling controller with data centers of supervision departments via communication networks and realizes the functions of downloading gas cylinder blacklist and uploading gas cylinder dispensing information in real time.

Placement of a conductive polymer composition grounding material at frequent points in an integrated electric transmission and distribution system to minimize transmission of harmonics and the resulting electrical losses is described.

The invention discloses a tracing to the source direct current correcting method for a Delta-typed direct current. By externally adding a stable AC voltage source, AC voltage output forms a voltage channel by a voltage divider, low conversion voltage value of a voltage loop is obtained from the voltage channel; the AC voltage output of the stable AC voltage source is connected with a current transformer by a high precision resistance, thus forming a current channel; and the measured voltage value representing current is obtained from the current channel by impedance conversion; precise stable voltage direct current reference voltage and the measured conversion voltage value of the voltage loop are connected into an AC/DC voltage comparator with self correction, so as to obtain a sine voltage output by the voltage source steadily; composite ratio and angular difference of the current transformer and an equivalent impedance of a secondary load are obtained in a way that the measured voltage value obtained in the AC/DC voltage comparator is combined and connected based on the obtained sine voltage, error compensation parameters are stored for error compensation of impedance conversion measured by the following current. The invention has few error sources, simple electrical structure and high precision.

An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

The invention provides a design and an integrated circuit having a substantially uniform density and electrical characteristics between parts of the IC that are angled at 45 degrees relative to one another. In particular, the invention provides fill tiling patterns oriented substantially uniformly to electrical structures of either orthogonal or 45 degree angle orientation.

A substrate structure is provided, the substrate structure comprising: a molded substrate located within a connector body of a coaxial cable connector and an electrical structure mechanically connected to the molded substrate. The electrical structure is located in a position that is external to a signal path of a radio frequency (RF) signal flowing through the coaxial cable connector.